Soldering & Surface Mount Technology: Volume 36 Issue 3

Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraint

Zhenkun Li, Zhili Zhao, Jinliang Liu, Xin Ding

To solve the problems caused by using precise molds for copper column positioning in the current column grid array package, this paper aims to optimize the proposed friction…

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Fakhrozi Che Ani, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli

This study aims to investigate the thermal fracture mechanism of moisture-preconditioned SAC305 ball grid array (BGA) solder joints subjected to multiple reflow and thermal…

A temperature control method of hot-bar soldering based on extended Kalman filter

Min Zeng, Jianxing Xie, Zhitao Li, Qincheng Wei, Hui Yang

This study aims to introduce a novel technique for nonlinear sensor time constant estimation and sensor dynamic compensation in hot-bar soldering using an extended Kalman filter…

Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder

Fang Liu, Zilong Wang, JiaCheng Zhou, Yuqin Wu, Zhen Wang

The purpose of this study is to investigate the effects of Ce and Sb doping on the microstructure and thermal mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder. The effects…

Electric current stressing enhanced damping properties in Sn5Sb solder

Linqiang Liu, Feng Chen, Wangyun Li

The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder.

A study on the thermomechanical response of various die attach metallic materials of power electronics

Mohammad A. Gharaibeh, Jürgen Wilde

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is…