Microelectronics International: Volume 41 Issue 3

An ultrawideband Koch fractal patch antenna

Iqra Masroor, Jamshed Aslam Ansari

Compact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of…

A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration

Mohammad A. Gharaibeh

This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic…

Investigation on the new reliability issues of PCB in 5G millimeter wave application

Xiao He, Lijuan Huang, Meizhen Xiao, Chengyong Yu, En Li, Weiheng Shao

The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the…

Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR

Sasireka Perumalsamy, Kavya G., Rajkumar S.

This paper aims to propose a two-element dual fed ultra-wideband (UWB) multiple input multiple output (MIMO) antenna system with no additional decoupling structures. The antenna…

Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications

Divya Shree M., Srinivasa Rao Inabathini

This paper aims to present the simulation, fabrication and testing of a novel ultra-wide band (UWB) band-pass filters (BPFs) with better transmission and rejection characteristics…

Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Zuraihana Bachok, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohamad Riduwan Ramli, Muhamed Abdul Fatah bin Muhamed Mukhtar

This study aims to investigate the possible defects and their root causes in a soft-termination multilayered ceramic capacitor (MLCC) when subjected to a thermal reflow process.

Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents

Amer Mecellem, Soufyane Belhenini, Douaa Khelladi, Caroline Richard

The purpose of this study is to propose a simplifying approach for modelling a reliability test. Modelling the reliability tests of printed circuit board (PCB)/microelectronic…