Welcome guest

Microelectronics International

Browse
User Guides

Online Access

See all available RSS feeds

Journal Information

E-mail this page

Microelectronics International

Volume 20 Issue 1

Published: 2003 | Start Page: 13

Icon Key:

Requires login or subscription

Backfiles

EarlyCite

Articles

Articles
Article No:	Article Information:
1455631	Measurements and simulation of SMT components Ryszard J. Pryputniewicz, David Rosato, Cosme Furlong (pp. 13-16) Keywords: Deformation, Measurement, Surface mount technology, Thermal analysis ArticleType: Technical paper View HTML \| View PDF (923 KB) \| Reprints & Permissions
878455	Multi-layer thick-film microwave components and measurements Zhengrong Tian, Charles Free, Colin Aitchison, Peter Barnwell, James Wood (pp. 17-20) Keywords: Microwaves, Multilayers, Thick film ArticleType: Technical paper View HTML \| View PDF (350 KB) \| Reprints & Permissions
878456	A frequency tunable half-wave resonator using a MEMS variable capacitor Patrick Bell, Nils Hoivik, Victor Bright, Zoya Popovic (pp. 21-25) Keywords: Flip-chip, Microelectronics ArticleType: Technical paper View HTML \| View PDF (1038 KB) \| Reprints & Permissions
878457	High- RF inductors on 20?O.cm silicon realized through wafer-level packaging techniques G.J. Carchon, W. De Raedt, E. Beyne (pp. 26-30) Keywords: Electronic packaging, Interconnection, Multilayers ArticleType: Technical paper View HTML \| View PDF (597 KB) \| Reprints & Permissions
1455791	An evaluation of materials and processes employed in the construction of novel thick film force sensors Yulan Zheng, John Atkinson, Zhige Zhang, Russ Sion (pp. 31-33) Keywords: Stainless steel, Temperature, Thick film ArticleType: Technical paper View HTML \| View PDF (187 KB) \| Reprints & Permissions
878458	Materials characterization of the effect of mechanical bending on area array package interconnects Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie (pp. 34-42) Keywords: Interconnection, Printed circuit boards, Solder joints ArticleType: Technical paper View HTML \| View PDF (1889 KB) \| Reprints & Permissions
1455633	Mechanically fixed and thermally insulated micromechanical structures for GaAs heterostructure based MEMS devices T. Lalinsky´, S?. Hašcík, Ž. Mozolová, E. Burian, M. Krnác, M. Tomáška, J. Škriniarová, M. Drz?ík, I. Kostic?, L. Matay (pp. 43-47) Keywords: Membranes, Sensors, Surface mount technology ArticleType: Technical paper View HTML \| View PDF (632 KB) \| Reprints & Permissions
878459	Advanced thick film system for AlN substrates Y.L. Wang, A.F. Carroll, J.D. Smith, Y. Cho, R.J. Bacher, D.K. Anderson, J.C. Crumpton, C.R.S. Needes (pp. 48-51) Keywords: Substrates, Thick film ArticleType: Research paper View HTML \| View PDF (241 KB) \| Reprints & Permissions
1455634	High-resolution integration of passives using micro-contact printing (µCP) Charles D.E. Lakeman, Patrick F. Fleig (pp. 52-55) Keywords: Electrical circuits, Printed circuit boards ArticleType: Technical paper View HTML \| View PDF (664 KB) \| Reprints & Permissions

Note from the publisher

Note from the publisher
Item No:	Item Information
1488331	Note from the publisher Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

IMAPS news

“Top 10 developments” in ceramic interconnect technology
Item No:	Item Information
1488332	“Top 10 developments” in ceramic interconnect technology Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference
Item No:	Item Information
1488333	IMAPS announces “Ceramic Interconnect Technology: The Next Generation” 2003 Conference Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

IMAPS announces award winners for exceptional papers at IMAPS 2002
Item No:	Item Information
1488334	IMAPS announces award winners for exceptional papers at IMAPS 2002 Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Industry news

Research into Nanotechnology for faster and smaller devices
Item No:	Item Information
1488335	Research into Nanotechnology for faster and smaller devices Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Mondiaquartz opens
Item No:	Item Information
1488336	Mondiaquartz opens Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

IMEC develops a distributed sensor network for health and comfort applications
Item No:	Item Information
1488337	IMEC develops a distributed sensor network for health and comfort applications Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Air Products and Penn State University researching effects of gas source purity
Item No:	Item Information
1488338	Air Products and Penn State University researching effects of gas source purity Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

KIC opens first European office
Item No:	Item Information
1488339	KIC opens first European office Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Micron Technology selects Mintech European supplier
Item No:	Item Information
1488340	Micron Technology selects Mintech European supplier Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Auburn University moves to forefront of wireless technology
Item No:	Item Information
1488341	Auburn University moves to forefront of wireless technology Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Agilent test equipment to be used in new UMIST research centre
Item No:	Item Information
1488342	Agilent test equipment to be used in new UMIST research centre Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Top European technology company has designs on Wales
Item No:	Item Information
1488343	Top European technology company has designs on Wales Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

International Diary

International Diary
Item No:	Item Information
1488344	International Diary Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

New products

SUSS unveils new AP200SAW
Item No:	Item Information
1488345	SUSS unveils new AP200SAW Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

High speed heavy wire bonder
Item No:	Item Information
1488346	High speed heavy wire bonder Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

New oscilloscope and probing measurement system
Item No:	Item Information
1488347	New oscilloscope and probing measurement system Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

New small dot dispensing system for semiconductor and optical packaging and assembly
Item No:	Item Information
1488348	New small dot dispensing system for semiconductor and optical packaging and assembly Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Capillary underfill dispenser introduced for the flip chip market
Item No:	Item Information
1488349	Capillary underfill dispenser introduced for the flip chip market Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

New WLCSP marking system
Item No:	Item Information
1488350	New WLCSP marking system Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

High-performance evaporation masks minimise process costs
Item No:	Item Information
1488351	High-performance evaporation masks minimise process costs Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

New versatile spin coater from SUSS MicroTec
Item No:	Item Information
1488352	New versatile spin coater from SUSS MicroTec Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

NanoVia announces MultiDice™ wafer dicing technology
Item No:	Item Information
1488353	NanoVia announces MultiDice™ wafer dicing technology Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Advanced vapourisation system
Item No:	Item Information
1488354	Advanced vapourisation system Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Book reviews

Protecting the Ozone Layer
Item No:	Item Information
1488355	Protecting the Ozone Layer Journal: Microelectronics International Vol : 20 Issue: 1 Author(s): Brian Ellis View HTML

Six Sigma for Electronics Design and Manufacturing
Item No:	Item Information
1488356	Six Sigma for Electronics Design and Manufacturing Journal: Microelectronics International Vol : 20 Issue: 1 Author(s): Bob Willis View HTML

Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies
Item No:	Item Information
1488357	Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies Journal: Microelectronics International Vol : 20 Issue: 1 Author(s): Bob Willis View HTML

Microvias for Low Cost High Density Interconnects
Item No:	Item Information
1488358	Microvias for Low Cost High Density Interconnects Journal: Microelectronics International Vol : 20 Issue: 1 Author(s): Bob Willis View HTML

Green Electronics/Green Bottom Line
Item No:	Item Information
1488359	Green Electronics/Green Bottom Line Journal: Microelectronics International Vol : 20 Issue: 1 Author(s): Bob Willis View HTML

Fundamentals of Microsystems Packaging
Item No:	Item Information
1488360	Fundamentals of Microsystems Packaging Journal: Microelectronics International Vol : 20 Issue: 1 Author(s): Bob Willis View HTML

Publications

Publications
Item No:	Item Information
1488361	Publications Journal: Microelectronics International Vol : 20 Issue: 1 View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1488362	Internet commentary Journal: Microelectronics International Vol : 20 Issue: 1 Author(s): Brian Ellis View HTML