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Microelectronics International

Volume 20 Issue 2

Published: 2003 | Start Page: 10

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Articles

Articles
Article No:	Article Information:
878460	Dielectrophoretic mechanism for downward trimming of polymer resistors Y. Srinivasa Rao, M. Satyam (pp. 10-15) Keywords: High voltage, Polymers, Resistors, Thick film ArticleType: Research paper View HTML \| View PDF (407 KB) \| Reprints & Permissions
878461	Dual-rail improved adiabatic pseudo-domino logic with auxiliary clock: a low-power partially-adiabatic CMOS logic family W.M. Tan, K.T. Lau (pp. 16-18) Keywords: Design, Electrical circuits ArticleType: Research paper View HTML \| View PDF (429 KB) \| Reprints & Permissions
878462	Computing electrical potential in unbounded two-dimensional regions Maqsood A. Chaudhry, Roland Schinzinger (pp. 19-23) Keywords: Electrical fields, Finite elements, Mapping, Numerical methods ArticleType: Research paper View HTML \| View PDF (424 KB) \| Reprints & Permissions
1455635	Defect evolutions with different temperature injections in MOSFETs Jean-Yves Rosaye, Pierre Mialhe, Jean-Pierre Charles (pp. 24-31) Keywords: Hysteresis, Oxide, Semiconductors ArticleType: Research paper View HTML \| View PDF (803 KB) \| Reprints & Permissions
1455636	An evaluation of the characteristics of membrane materials suitable for the batch fabrication of dissolved oxygen sensors W.V. Glasspool, J.K. Atkinson (pp. 32-40) Keywords: Membranes, Sensors, Thick film ArticleType: Research paper View HTML \| View PDF (845 KB) \| Reprints & Permissions
878463	Thick-film strain gauges on alumina, zirconia and steel substrates Darko Belavic, Marko Hrovat, Marina Santo Zarnik, Andreja Bencan, Walter Smetana, Roland Reicher, Heinz Homolka (pp. 41-45) Keywords: Resistors, Sensors, Strain, Thick film ArticleType: Research paper View HTML \| View PDF (659 KB) \| Reprints & Permissions

Editorial

Editorial
Item No:	Item Information
1488363	Editorial Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Association news

International IEEE conference on Asian Green Electronics (AGEC)
Item No:	Item Information
1488364	International IEEE conference on Asian Green Electronics (AGEC) Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

The 6th International Conference on Reliability, Maintainability and Safety (ICRMS' 2004)
Item No:	Item Information
1488365	The 6th International Conference on Reliability, Maintainability and Safety (ICRMS' 2004) Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Central European Advanced SMT and Packaging Exhibition and Seminars
Item No:	Item Information
1488366	Central European Advanced SMT and Packaging Exhibition and Seminars Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

CoorsTek agrees to $220 million buyout
Item No:	Item Information
1488367	CoorsTek agrees to $220 million buyout Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Netpack: packaging store goes online
Item No:	Item Information
1488368	Netpack: packaging store goes online Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

IMEC begins construction of 300 mm research lab
Item No:	Item Information
1488369	IMEC begins construction of 300 mm research lab Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

MicroTech 2003
Item No:	Item Information
1488370	MicroTech 2003 Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Industry news

SMT/HYBRID/PACKAGING 2003
Item No:	Item Information
1488371	SMT/HYBRID/PACKAGING 2003 Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

BTU International joins SECAP
Item No:	Item Information
1488372	BTU International joins SECAP Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

The International Conference and Exhibition PCIM
Item No:	Item Information
1488373	The International Conference and Exhibition PCIM Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Datacon Hungary Kft. moves to new production premises in Györi Ipari Park
Item No:	Item Information
1488374	Datacon Hungary Kft. moves to new production premises in Györi Ipari Park Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Newport advanced packaging (APAS) facility achieves ISO 9001
Item No:	Item Information
1488375	Newport advanced packaging (APAS) facility achieves ISO 9001 Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Appointments

TRL Technology appoints new managing director
Item No:	Item Information
1488376	TRL Technology appoints new managing director Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

International diary

International diary
Item No:	Item Information
1488377	International diary Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

New products

EXFO Lite Ultraviolet/Visible Spot Curing System is released
Item No:	Item Information
1488378	EXFO Lite Ultraviolet/Visible Spot Curing System is released Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

New metrology tool assists in determining pressure in multilayer PCB and hybrid circuits
Item No:	Item Information
1488379	New metrology tool assists in determining pressure in multilayer PCB and hybrid circuits Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

New high power thick film SMT resistors deliver greater power without increased size
Item No:	Item Information
1488380	New high power thick film SMT resistors deliver greater power without increased size Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Probe needles for wafer and hybrid test applications
Item No:	Item Information
1488381	Probe needles for wafer and hybrid test applications Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

New sealant is spot-on
Item No:	Item Information
1488382	New sealant is spot-on Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Thermoset announces new fast cure adhesive MT-125
Item No:	Item Information
1488383	Thermoset announces new fast cure adhesive MT-125 Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Newport introduces AutoAlign™ MODAL Modular Alignment System
Item No:	Item Information
1488384	Newport introduces AutoAlign™ MODAL Modular Alignment System Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Newport announces advanced automation for MEMS packaging
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1488385	Newport announces advanced automation for MEMS packaging Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

SUSS MicroTec introduces new embossing equipment
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1488386	SUSS MicroTec introduces new embossing equipment Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Sikama offers wafer handling system falcon whs 412
Item No:	Item Information
1488387	Sikama offers wafer handling system falcon whs 412 Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Book review

Foldable Flex and Thinned Silicon Chips for Multichip Packaging
Item No:	Item Information
1488388	Foldable Flex and Thinned Silicon Chips for Multichip Packaging Journal: Microelectronics International Vol : 20 Issue: 2 View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1488389	Internet commentary Journal: Microelectronics International Vol : 20 Issue: 2 Author(s): Brian Ellis View HTML