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Microelectronics International

Volume 20 Issue 3

Published: 2003 | Start Page: 7

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Articles

Articles
Article No:	Article Information:
878464	The effect of pulse voltage trimming on current noise of polymer thick film resistors Y. Srinivasa Rao, M. Satyam (pp. 7-10) Keywords: High voltage, Noise, Resistors ArticleType: Research paper View HTML \| View PDF (110 KB) \| Reprints & Permissions
878465	Characterization of low- benzocyclobutene dielectric thin film K.C. Chan, M. Teo, Z.W. Zhong (pp. 11-22) Keywords: Curing, Shrinkage, Thin film ArticleType: Research Paper View HTML \| View PDF (778 KB) \| Reprints & Permissions
1508842	Edge potential effect on the operation of short-channel devices A.K. Singh, S. Gurunarayanan, V. Ramachandran, M. Umashankar (pp. 23-28) Keywords: Semiconductors, Voltage regulation ArticleType: Research paper View HTML \| View PDF (438 KB) \| Reprints & Permissions
878466	Liquid dispensing encapsulation in semiconductor packaging Liyu Yang, Carl K. King, Joseph B. Bernstein (pp. 29-35) Keywords: Electronic packaging, Encapsulation, Optimization, Semiconductors ArticleType: Research paper View HTML \| View PDF (460 KB) \| Reprints & Permissions
878467	Design and fabrication of silicon condenser microphone using single deeply corrugated diaphragm technique W.J. Wang, R.M. Lin, Y. Ren (pp. 36-40) Keywords: Design, Electrical machines, Fabrication, Silicon ArticleType: Research paper View HTML \| View PDF (434 KB) \| Reprints & Permissions
878468	New modeling approach of on-chip interconnects for RF integrated circuits in CMOS technology H. Ymeri, B. Nauwelaers, K. Maex, D. De Roest (pp. 41-44) Keywords: Analysis, Interconnection, Magnetostatics, Silicon ArticleType: Research paper View HTML \| View PDF (214 KB) \| Reprints & Permissions

Editorial

Editorial
Item No:	Item Information
1488390	Editorial Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Note from the publisher

Note from the publisher
Item No:	Item Information
1488391	Note from the publisher Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Literati Club

Awards for Excellence
Item No:	Item Information
1488392	Awards for Excellence Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Association news

IMAPS UK
Item No:	Item Information
1488393	IMAPS UK Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Twenty five per cent growth for electronics and microsystems (MEMS) devices in medical markets
Item No:	Item Information
1488394	Twenty five per cent growth for electronics and microsystems (MEMS) devices in medical markets Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

MicroTech 2003
Item No:	Item Information
1488395	MicroTech 2003 Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

IMAPS Nordic
Item No:	Item Information
1488396	IMAPS Nordic Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Industry news

SMT Nuremberg breathes life into the European electronics industry
Item No:	Item Information
1488397	SMT Nuremberg breathes life into the European electronics industry Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Rood Technology: back to the core business
Item No:	Item Information
1488398	Rood Technology: back to the core business Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Brewer Science signs agreement
Item No:	Item Information
1488399	Brewer Science signs agreement Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Derwent innovations index version 4.0 offers expanded functionality
Item No:	Item Information
1488400	Derwent innovations index version 4.0 offers expanded functionality Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

BTU International acquires Sagarus Robotics
Item No:	Item Information
1488401	BTU International acquires Sagarus Robotics Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

SUSS MicroTec and LNL Technologies announce agreement
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1488402	SUSS MicroTec and LNL Technologies announce agreement Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Interest in micro structures soars as orders quadruple
Item No:	Item Information
1488403	Interest in micro structures soars as orders quadruple Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

FEINFOCUS and Palomar Technologies collaborate
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1488404	FEINFOCUS and Palomar Technologies collaborate Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Kulicke and Soffa to relocate wire bonder manufacturing
Item No:	Item Information
1488405	Kulicke and Soffa to relocate wire bonder manufacturing Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Exhibitions/Seminars

IPC/Soldertec Conference on lead-free electronics – an international success!
Item No:	Item Information
1488406	IPC/Soldertec Conference on lead-free electronics – an international success! Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

First in series of NPL Lead-Free Master Classes is well received
Item No:	Item Information
1488407	First in series of NPL Lead-Free Master Classes is well received Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

NPL ensure success of the "Hands-On Lead-Free Experience" at Nepcon show
Item No:	Item Information
1488408	NPL ensure success of the "Hands-On Lead-Free Experience" at Nepcon show Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

International diary

International diary
Item No:	Item Information
1488409	International diary Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

New products

Orbotech to deliver its new AOI product for flat panel display production
Item No:	Item Information
1488410	Orbotech to deliver its new AOI product for flat panel display production Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

New laser trimming system from ESI
Item No:	Item Information
1488411	New laser trimming system from ESI Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Sikama International Inc. introduces new wafer transport system
Item No:	Item Information
1488412	Sikama International Inc. introduces new wafer transport system Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Ultrasonic flipchip, a cost effective alternative in mass production
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1488413	Ultrasonic flipchip, a cost effective alternative in mass production Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Ganged RF system for Molex
Item No:	Item Information
1488414	Ganged RF system for Molex Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

ATEK Technology brings cool solutions to hot applications
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1488415	ATEK Technology brings cool solutions to hot applications Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Unique optical hybrid technology from QinetiQ
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1488416	Unique optical hybrid technology from QinetiQ Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Palomar Technologies introduces FAST 35 assembly tool
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1488417	Palomar Technologies introduces FAST 35 assembly tool Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Manual lead reconditioning equipment from Fancourt
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1488418	Manual lead reconditioning equipment from Fancourt Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Palomar Technologies introduces new automatic ball and wedge bonders
Item No:	Item Information
1488419	Palomar Technologies introduces new automatic ball and wedge bonders Journal: Microelectronics International Vol : 20 Issue: 3 View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1488420	Internet commentary Journal: Microelectronics International Vol : 20 Issue: 3 Author(s): Brian Ellis View HTML