Search

Search:(Access key 2)

• Athens/Institution Login |
• Register |
• Forgot Password?

Home >  Browse > Journal Issue List

E-mail this page

Soldering & Surface Mount Technology

---

Articles

Articles

Article No:	Article Information:
878555	Contact resistance of metal-coated polymer particles used in anisotropically conductive adhesives Jarmo Määttänen (pp. 12-15) Keywords: Anisotropy, Conductive layers, Flip chip, Resistance ArticleType: Research Paper View HTML | View PDF (404 KB) | Reprints & Permissions
1455689	Reducing bonding cycle time of adhesive flip chip process Anne Seppälä, Kati Aalto, Eero Ristolainen (pp. 16-20) Keywords: Anisotropy, Cycle time, Flip chip, Reflow, Reliability ArticleType: Research paper View HTML | View PDF (385 KB) | Reprints & Permissions
878556	Finite element analysis of a three-dimensional package Zhaowei Zhong, Peng Kiong Yip (pp. 21-25) Keywords: Fatigue, Finite element analysis, Flip chip, Solder joints ArticleType: Conceptual Paper View HTML | View PDF (337 KB) | Reprints & Permissions
878557	The analysis of creep data for solder alloys W.J. Plumbridge (pp. 26-30) Keywords: Lead-free, Reliability, Solder ArticleType: Research Paper View HTML | View PDF (335 KB) | Reprints & Permissions
1455690	The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs S.T. Nurmi, J.J. Sundelin, E.O. Ristolainen, T. Lepistö (pp. 31-38) Keywords: Lead-free, Plastic ball grid array, Reliability ArticleType: Research paper View HTML | View PDF (873 KB) | Reprints & Permissions
1455691	Creep behaviour of composite lead-free electronic solder joints F. Guo, J. Lee, K.N. Subramanian (pp. 39-42) Keywords: Composite solders, Lead-free soldering ArticleType: Research Paper View HTML | View PDF (221 KB) | Reprints & Permissions
1455692	Fine pitch stencil printing using enclosed printing systems Ling Chunxian Zou, Milos Dusek, Martin Wickham, Christopher Hunt (pp. 43-49) Keywords: Assembly, Solder pastes, Stencils ArticleType: Research paper View HTML | View PDF (466 KB) | Reprints & Permissions
1455693	Advanced alloy for lead-free solder balls Marc Dittes, Hermann Walter (pp. 50-54) Keywords: Lead-free, Semiconductors, Solder ArticleType: Conceptual Paper View HTML | View PDF (873 KB) | Reprints & Permissions

Editorial

Maintaining confidence in research

Item No:	Item Information
1489197	Maintaining confidence in research Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 Author(s): Peter Grundy View HTML

Note from the publisher

Note from the publisher

Item No:	Item Information
1489198	Note from the publisher Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

SMART Group news

Obituary – Alan Jones

Item No:	Item Information
1489199	Obituary – Alan Jones Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Despite a sad cloud over Brighton, the 5th European Conference was successful

Item No:	Item Information
1489200	Despite a sad cloud over Brighton, the 5th European Conference was successful Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Association news

Sixty six members honored at 2002 IPC annual meeting

Item No:	Item Information
1489201	Sixty six members honored at 2002 IPC annual meeting Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

2003 SMTA Pan Pacific Symposium Exhibit and sponsorship opportunities

Item No:	Item Information
1489202	2003 SMTA Pan Pacific Symposium Exhibit and sponsorship opportunities Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

SMTA annual awards announced

Item No:	Item Information
1489203	SMTA annual awards announced Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

SOLDERTEC announces winners of lead-free solder awards 2002

Item No:	Item Information
1489204	SOLDERTEC announces winners of lead-free solder awards 2002 Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Industry news

July 2006: Europe agrees lead ban in electrical and electronic equipment

Item No:	Item Information
1489205	July 2006: Europe agrees lead ban in electrical and electronic equipment Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

AIM acquires SMT solder paste assets of OMG’s microbond division

Item No:	Item Information
1489206	AIM acquires SMT solder paste assets of OMG’s microbond division Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Nigel Griffiths launches new Asia Pacific electronics business association

Item No:	Item Information
1489207	Nigel Griffiths launches new Asia Pacific electronics business association Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

EKRA and FUJI machine manufacturing announce OEM agreement

Item No:	Item Information
1489208	EKRA and FUJI machine manufacturing announce OEM agreement Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Tin Technology leads project on halogen-free, flame retardant systems

Item No:	Item Information
1489209	Tin Technology leads project on halogen-free, flame retardant systems Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

KIC opens first European office

Item No:	Item Information
1489210	KIC opens first European office Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Business co-operation between Nihon Superior and DKL Metals Ltd

Item No:	Item Information
1489211	Business co-operation between Nihon Superior and DKL Metals Ltd Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

New European headquarters in Krefeld

Item No:	Item Information
1489212	New European headquarters in Krefeld Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Norgren launches new grippers for electronics production market

Item No:	Item Information
1489213	Norgren launches new grippers for electronics production market Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Appointments

Texcel Technology appoints John Bergin

Item No:	Item Information
1489214	Texcel Technology appoints John Bergin Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

International diary

International diary

Item No:	Item Information
1489215	International diary Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

New products

AIM announces Sn63LT alloy for reducing tombstoning

Item No:	Item Information
1489216	AIM announces Sn63LT alloy for reducing tombstoning Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Asymtek releases Fluidmove® for Windows NT® Version 4.5

Item No:	Item Information
1489217	Asymtek releases Fluidmove® for Windows NT® Version 4.5 Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

New: Collimator add-on for X-ray tubes

Item No:	Item Information
1489218	New: Collimator add-on for X-ray tubes Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

248 now available online

Item No:	Item Information
1489219	248 now available online Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Pin-in-hole reflow specialist proves fit-for-purpose stencils

Item No:	Item Information
1489220	Pin-in-hole reflow specialist proves fit-for-purpose stencils Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Automatic printer for small batches

Item No:	Item Information
1489221	Automatic printer for small batches Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Cobar debuts “Solder-Ball Killer” wave soldering flux

Item No:	Item Information
1489222	Cobar debuts “Solder-Ball Killer” wave soldering flux Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Book reviews

Protecting the Ozone Layer

Item No:	Item Information
1489223	Protecting the Ozone Layer Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 Author(s): Brian Ellis View HTML

Six Sigma for Electronics Design and Manufacturing

Item No:	Item Information
1489224	Six Sigma for Electronics Design and Manufacturing Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 Author(s): Bob Willis View HTML

Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies

Item No:	Item Information
1489225	Reflow Soldering Processes and Troubleshooting SMT, BGA, CSP and Flip Chip Technologies Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 Author(s): Bob Willis View HTML

Environmental-Friendly Electronics: Lead-Free Technology

Item No:	Item Information
1489226	Environmental-Friendly Electronics: Lead-Free Technology Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 Author(s): Bob Willis View HTML

Green Electronics/Green Bottom Line

Item No:	Item Information
1489227	Green Electronics/Green Bottom Line Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 Author(s): Bob Willis View HTML

Fundamentals of Microsystems Packaging

Item No:	Item Information
1489228	Fundamentals of Microsystems Packaging Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 Author(s): Bob Willis View HTML

Publications

Peak booklet spells out common test mistakes

Item No:	Item Information
1489229	Peak booklet spells out common test mistakes Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Derwent launches BioMEMs, Lab-on-a-Chip Industry and Technology Patents Profile

Item No:	Item Information
1489230	Derwent launches BioMEMs, Lab-on-a-Chip Industry and Technology Patents Profile Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1489231	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 1 View HTML