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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
878558	Pb-free solder bumping for flip chip package by electroplating Hyeon Hwang, Soon-Min Hong, Jae-Pil Jung, Choon-Sik Kang (pp. 10-16) Keywords: Electroplating, Flip chip, Lead-free soldering ArticleType: Research Paper View HTML | View PDF (1050 KB) | Reprints & Permissions
878559	Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping Yanhong Tian, Chunqing Wang, Xiaodong Zhang, Deming Liu (pp. 17-21) Keywords: Reflow, Solder ArticleType: Research Paper View HTML | View PDF (1250 KB) | Reprints & Permissions
878560	Process characterization of PCB assembly using 0201 packages with lead-free solder David Geiger, Fredrik Mattsson, Dongkai Shangguan, MT Ong, Patrick Wong, Mei Wang, Todd Castello, Sammy Yi (pp. 22-27) Keywords: Assembly, Lead-free, Printed circuit boards, Solder pastes ArticleType: Conceptual Paper View HTML | View PDF (1097 KB) | Reprints & Permissions
878561	The effect of the hot air levelling process on skip solder defects in the wave soldering process Teo Kiat Choon (pp. 28-34) Keywords: Printed circuit boards, Wave soldering ArticleType: Conceptual Paper View HTML | View PDF (1082 KB) | Reprints & Permissions
878562	A novel measurement technique for stencil printed solder paste Milos? Dus?ek, Christopher Hunt (pp. 35-45) Keywords: Defects, Measurement, Solder pastes ArticleType: Research Paper View HTML | View PDF (3249 KB) | Reprints & Permissions
1455694	Study of under bump metallisation barrier layer for lead-free solder K.C. Chan, Z.W. Zhong, K.W. Ong (pp. 46-52) Keywords: Lead-free, Under bump metallurgy ArticleType: Conceptual Paper View HTML | View PDF (989 KB) | Reprints & Permissions

Association news

SMTA expands corporate advisory council

Item No:	Item Information
1489232	SMTA expands corporate advisory council Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

New benefits for joining SSTC

Item No:	Item Information
1489233	New benefits for joining SSTC Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

IPC restructures exhibition

Item No:	Item Information
1489234	IPC restructures exhibition Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

The SMTA recognizes outstanding authors

Item No:	Item Information
1489235	The SMTA recognizes outstanding authors Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Industry news

£8m administrative centre for Cookson Electronics

Item No:	Item Information
1489236	£8m administrative centre for Cookson Electronics Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Calling electronics SMEs: are you lead-free?

Item No:	Item Information
1489237	Calling electronics SMEs: are you lead-free? Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

NPL seeks partners for new project

Item No:	Item Information
1489238	NPL seeks partners for new project Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

MBO completed – Viasystems Ballynahinch becomes Nitronica

Item No:	Item Information
1489239	MBO completed – Viasystems Ballynahinch becomes Nitronica Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Benchmarking/PPM monitoring your process with industry

Item No:	Item Information
1489240	Benchmarking/PPM monitoring your process with industry Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Lead-free wave soldering evaluation update

Item No:	Item Information
1489241	Lead-free wave soldering evaluation update Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Lead-free assemblies present no problems for AOI

Item No:	Item Information
1489242	Lead-free assemblies present no problems for AOI Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

International diary

International diary

Item No:	Item Information
1489243	International diary Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

New products

JNJ Industries announces 30 in. metal squeegee blades

Item No:	Item Information
1489244	JNJ Industries announces 30 in. metal squeegee blades Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

New sealant is spot-on

Item No:	Item Information
1489245	New sealant is spot-on Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Agilent Technologies announces design verification application support

Item No:	Item Information
1489246	Agilent Technologies announces design verification application support Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

New AOI repair software increases effectivity

Item No:	Item Information
1489247	New AOI repair software increases effectivity Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Heraeus introduces top performing F10 no-clean solder paste

Item No:	Item Information
1489248	Heraeus introduces top performing F10 no-clean solder paste Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Expanded seminar schedule to take centre stage at Nepcon

Item No:	Item Information
1489249	Expanded seminar schedule to take centre stage at Nepcon Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Vitronics Soltec building new facility

Item No:	Item Information
1489250	Vitronics Soltec building new facility Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Fuji Machine Mfg and Tecnomatix announce joint migration path

Item No:	Item Information
1489251	Fuji Machine Mfg and Tecnomatix announce joint migration path Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Orbotech introduces new aoi capabilities

Item No:	Item Information
1489252	Orbotech introduces new aoi capabilities Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Thermoset announces new adhesive – MT-125

Item No:	Item Information
1489253	Thermoset announces new adhesive – MT-125 Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Cobar Europe brings certificates of compliance (COCs) online

Item No:	Item Information
1489254	Cobar Europe brings certificates of compliance (COCs) online Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Gelease™ MG-200 developed by Thermoset

Item No:	Item Information
1489255	Gelease™ MG-200 developed by Thermoset Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Coreco Imaging introduces PC2-Vision frame grabber

Item No:	Item Information
1489256	Coreco Imaging introduces PC2-Vision frame grabber Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Book reviews

Foldable Flex and Thinned Silicon Chips for Multichip Packaging

Item No:	Item Information
1489257	Foldable Flex and Thinned Silicon Chips for Multichip Packaging Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 Author(s): Johan Liu View HTML

Chip Scale Packaging for Modern Electronics

Item No:	Item Information
1489258	Chip Scale Packaging for Modern Electronics Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1489259	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 2 View HTML