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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1455695	Improving the fatigue life of a bare die flip chip by thinning T. Alander, I. Suominen, P. Heino, E. Ristolainen (pp. 8-14) Keywords: Reliability management, Solder, Substrates ArticleType: Research paper View HTML | View PDF (1058 KB) | Reprints & Permissions
1455696	Flip chip solder joint reliability under harsh environment Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Wolfgang Kempe (pp. 15-20) Keywords: Joining processes, Laminates, Product reliability, Solder ArticleType: Research Paper View HTML | View PDF (455 KB) | Reprints & Permissions
878563	Mechanical characterization of Sn-3.5Ag solder joints at various temperatures H. Rhee, K.N. Subramanian, A. Lee, J.G. Lee (pp. 21-26) Keywords: Deformation, Fatigue, Joining processes, Mechanical properties of materials, Soldering ArticleType: Research paper View HTML | View PDF (1257 KB) | Reprints & Permissions
1455697	Failures of flip chip assemblies under thermal shock Cheng Bo, Wang Li, Zhang Qun, Gao Xia, Xie Xiaoming, Wolfgang Kempe (pp. 27-32) Keywords: Failure (mechanical), Printed circuits, Solder ArticleType: Research paper View HTML | View PDF (1644 KB) | Reprints & Permissions
878564	Thermal strain analysis of an electronics package using the SEM Moiré technique Z.W. Zhong, S.K. Nah (pp. 33-35) Keywords: Electrical components, Mathematical analysis, Strain measurement ArticleType: Research paper View HTML | View PDF (728 KB) | Reprints & Permissions

Editorial

Editorial

Item No:	Item Information
1489260	Editorial Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 Author(s): David Whalley View HTML

Literati Club

Awards for Excellence

Item No:	Item Information
1489261	Awards for Excellence Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Note from the publisher

Brian Ellis wins an Outstanding Service Award at the Literati Awards for Excellence 2003

Item No:	Item Information
1489262	Brian Ellis wins an Outstanding Service Award at the Literati Awards for Excellence 2003 Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Association news

IPC releases 2002/2003 Technology Roadmap

Item No:	Item Information
1489263	IPC releases 2002/2003 Technology Roadmap Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

2003 Hutchins grant award recipient announced

Item No:	Item Information
1489264	2003 Hutchins grant award recipient announced Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

IPC/Soldertec conference on lead-free electronics – an international success!

Item No:	Item Information
1489265	IPC/Soldertec conference on lead-free electronics – an international success! Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Industry news

Universal teams with CALCE to enhance packaging and assembly analysis

Item No:	Item Information
1489266	Universal teams with CALCE to enhance packaging and assembly analysis Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Soldertec Global seeks nominations for Lead-free Solder Awards 2003

Item No:	Item Information
1489267	Soldertec Global seeks nominations for Lead-free Solder Awards 2003 Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Semtronics sold to Desco Industries, Inc.

Item No:	Item Information
1489268	Semtronics sold to Desco Industries, Inc. Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Foxconn Hon Hai launches USD 45 million greenfield investment

Item No:	Item Information
1489269	Foxconn Hon Hai launches USD 45 million greenfield investment Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Electronic Scientific Engineering acquires Macrotron GmbH

Item No:	Item Information
1489270	Electronic Scientific Engineering acquires Macrotron GmbH Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

EKRA and Speedline mend fences

Item No:	Item Information
1489271	EKRA and Speedline mend fences Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Eastern Europe to emerge as serious mobile player

Item No:	Item Information
1489272	Eastern Europe to emerge as serious mobile player Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Conference and exhibition on microsystem packaging and manufacturing

Item No:	Item Information
1489273	Conference and exhibition on microsystem packaging and manufacturing Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Founder Group chooses Glasgow for European HQ

Item No:	Item Information
1489274	Founder Group chooses Glasgow for European HQ Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Exhibitions/seminars

NPL ensure success of the "Hands-On lead-free experience" at Nepcon show

Item No:	Item Information
1489275	NPL ensure success of the "Hands-On lead-free experience" at Nepcon show Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

First in series of NPL Lead-Free Master Classes is well received

Item No:	Item Information
1489276	First in series of NPL Lead-Free Master Classes is well received Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

International diary

International diary

Item No:	Item Information
1489277	International diary Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

New products

Orbotech introduces new Verifast21™

Item No:	Item Information
1489278	Orbotech introduces new Verifast21™ Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

AIM develops lead-free pin probe testable no-clean solder paste

Item No:	Item Information
1489279	AIM develops lead-free pin probe testable no-clean solder paste Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Metcal rework system now bigger and better

Item No:	Item Information
1489280	Metcal rework system now bigger and better Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Heraeus introduces top performing no-clean solder paste

Item No:	Item Information
1489281	Heraeus introduces top performing no-clean solder paste Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Computed tomography in the micron range

Item No:	Item Information
1489282	Computed tomography in the micron range Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Promising new substrate materials for PC boards

Item No:	Item Information
1489283	Promising new substrate materials for PC boards Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Contamination testers help eliminate rework costs and field failures

Item No:	Item Information
1489284	Contamination testers help eliminate rework costs and field failures Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1489285	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 15 Issue: 3 View HTML