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Circuit World

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Articles

Articles

Article No:	Article Information:
878252	Tenting: cost-effective fabrication of high-density PWBs for the year 2000 and beyond John Raine (pp. 6-10) Keywords: Cost effectiveness, Fabrication, Printed circuits, Tenting ArticleType: Research paper View HTML | View PDF (130 KB)
1508829	A low-cost solder-bumped chip scale package -NuCSP John H. Lau, Chris Chang, Tony Chen, David Cheng, Eric Lao (pp. 11-25) Keywords: Chip size package, Packaging, Printed circuits, Solders ArticleType: Research paper / Technical paper View HTML | View PDF (324 KB) | Reprints & Permissions
878254	Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading Shi-Wei Ricky Lee, Xiaowu Zhang (pp. 26-31) Keywords: Finite element, Printed circuits, Stress, Surface mount technology ArticleType: Research paper View HTML | View PDF (107 KB) | Reprints & Permissions
878255	PCB presentation David Cawthray (pp. 32-33) Keywords: Inspection, Printed circuits, Surface finishing ArticleType: Research paper View HTML | View PDF (24 KB) | Reprints & Permissions
1455549	Characterization of a non-woven randomly dispersed short fiber laminate Michael Pecht, Keith Rogers, Andre Fowler (pp. 34-37) Keywords: Laminates, Non-woven laminates, Printed circuit boards ArticleType: Research paper View HTML | View PDF (121 KB) | Reprints & Permissions

Book review

Thermal Modelling and Optimisation of Power Circuits

Item No:	Item Information
1498942	Thermal Modelling and Optimisation of Power Circuits Journal: Circuit World Vol : 24 Issue: 3 Author(s): Keith Pitt View HTML