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Microelectronics International

Volume 13 Issue 1

Published: 1996 | Start Page: 6

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Articles

Articles
Article No: Article Information:
1508836 Non-hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications
I.P. Hall (pp. 6-10)
Keywords: Silicone gels
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1508837 Novel Uses of Flexible Circuit Technology in High Performance Electronic Applications
T. DiStefano, J. Fjelstad (pp. 11-15)
Keywords: Circuit Technology
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1455581 Combifilm: A Novel Thick- and Thin-film Technology with Two Signal Layers for High-speed Hybrid Circuits Signal Layers for High-speed Hybrid Circuits
U.P.I. Pedersen, O. Aaserud, O.W. Bungum (pp. 16-19)
Keywords: Film, Interconnection, Microelectronics, Substrate
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878369 Low Temperature Sinterable Multilayer Glass-ceramic Substrates
S.L. Fu, L.S. Chen, J.N. Lu (pp. 20-21)
Keywords: Microelectronics, Sintering, Substrate
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878370 Are BGAs a Concern in SMT? A User’s Point of View
X. Saint-Martin, Y. Stricot, M. Auray, C. Floury (pp. 22-25)
Keywords: Ball grid array, Components, Microelectronics, Surface mount Technology
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878371 Large AI/SiC Baseplate Packages for Digital and Microwave Applications
A. Lefeuvre, M. Caplot, C. Stranieri, P. Massiot (pp. 26-30)
Keywords: Electronics packaging, Microelectronics, Multichip module
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878372 Fibre-optic Multisensor for Simultaneous Monitoring of Pressure and Composition of Gases
Z. Keresztes-Nagy (pp. 42-43(continued on page 48))
Keywords: Fibre optics, Gas, Gas sensors, Microelectronics, Sensors
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1455582 Laser Beam Micro Welding as a New Interconnection Technique
M. Glasmacher, H.-J. Pucher (pp. 44-48)
Keywords: Inerconnection, Laser Welding, Microelectronics, Welding
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1508838 The Intelligent Multichip Module Analyser: A Thermal Design Tool
M.J. Stoklosa (pp. 49-51)
Keywords: Design, Electronics packaging, Microelectronics, Multichip module, Software
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1508839 An Innovation in Thermoplastic, Reworkable Adhesive Pastes
R. Dietz, D. Peck (pp. 52-56)
Keywords: Thermoplastic
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