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Microelectronics International

Volume 13 Issue 2

Published: 1996 | Start Page: 5

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Articles

Articles
Article No: Article Information:
1455583 Assembly and Reliability of Very Large Flip-chip on CQFP
J.J. Clementi, G.0. Dearing, C. Bergeron (pp. 5-8)
Keywords: Assembly, Electronics packaging, Flip chip, Microelectronics, Reliability
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878374 Thick Film Microchannels: Design and Fabrication
D. Filippini, L. Fraigi, S. Gwirc (pp. 9-12)
Keywords: Channel management, Microelectronics, Thick film
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1455584 Characterisation of Polyimide-glass-metal Joints Bonded with Anisotropic Electrically Conductive Adhesives
P.Savolainen, J. Kivilahti (pp. 13-16)
Keywords: Adhesives, Bonding joints, Microelectronics, Tape automated bonding, Thermoplastic adhesive
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878375 Design Optimisation of Integrated Circuit Thin-film Resistors with Slits and Curved Boundaries
Maqsood A. Chaudhry (pp. 17-21)
Keywords: Design optimisation, Integrated circuits, Microelectronics, Resistors, Slits, Thin film
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1455585 Acceleration Factors for Thick Film Gold Conductors on Ceramic for Temperature, Humidity and Bias Testing
V. Kripesh, S.K. Bhatnagar, H. Osterwinter, W. Gust (pp. 22-26)
Keywords: Acceleration, Conductors, Microelectronics, Thick film
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878376 Minimal Size Packaging Solutions: A Comparison
S. Greathouse (pp. 27-32)
Keywords: Electronics Packaging, Microelectronics
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1455586 Electroless Bumped Bare Dice on Flexible Substrates
A. Björklöf (pp. 49-52)
Keywords: Bumping, Microelectronics, Semiconductors, Solder joint
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1508840 European Microelectronics Activities — Nordic Countries and Central and Eastern Europe
S. Nørlyng (pp. 53-56)
Keywords: Europe, ISHM, Microelectronics
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878377 Improving the Heat Dissipation of Multilayer Ceramic Modules by the Use of CBGA Connections on HTCC and LTCC
W. Lyszio (pp. 54-56)
Keywords: Ceramic ball grid array, Heat Dissipation, Microelectronics, Multilayers
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