| 878378 |
Interconnection Technology for Advanced High Density Thick Films
M. Vrana, A. Van Calster, R. Vanden Berghe**, K. Allaert
(pp. 5-8)
Keywords:
Interconnection,
Microelectronics,
Screen printing,
Thick film
ArticleType:
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| 1455587 |
Fine-line Passive Components for Hybrid Microelectronics
V.Kripesh, S.K. Bhatnagar, H. Osterwinter, W. Gust
(pp. 9-11)
Keywords:
Components,
Laser ablation,
Lasers,
Microelctronics,
Microelectronics
ArticleType:
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| 1455588 |
Application of Taguchi Methods to the Production of Integrated Circuits
I.E. Klein
(pp. 12-14)
Keywords:
Integrated circuit,
Microelectronics,
Taguchi methods
ArticleType:
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| 878379 |
An Ultra High Density Technology for Microsystems
S. Larcombe, P. Ivey
(pp. 15-18)
Keywords:
Density Multichip module,
HDIS,
Microelectronics
ArticleType:
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| 1455797 |
Advances in Packaging and Assembly Polymers
K. Gilleo
(pp. 19-22)
Keywords:
Electronics packaging,
Microelectronics,
Polymers
ArticleType:
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| 1455790 |
Packaging Reliability for High Temperature Electronics: A Materials Focus
F.P. McCluskey, L. Condra, T. Torri, J. Fink
(pp. 23-26)
Keywords:
Electronics packaging,
High temperature,
Microelectronics,
Reliability
ArticleType:
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| 878380 |
Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices
R. Cross
(pp. 27-29)
Keywords:
Conductive adhesive,
Microelectronics,
Polymers,
Thermal conduction
ArticleType:
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| 1455589 |
Spin Coating Study for Thick Layers with High Viscosity Polyimide
M. Borsetto, G. Carcano, M. Ceriani
(pp. 30-32)
Keywords:
Deposition,
Microelectronics,
Polyimides,
Thick layers
ArticleType:
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