| 878381 |
Two Novel Applications of Adhesives for
Optical Microelectronics
M. Erickson
(pp. 4-5( continued on page 8))
Keywords:
Adhesives,
Microelectronics,
Optics
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| 878382 |
A Principle of a Hybrid Microwave Power Sensor Based on Thermometric
Measurements
P. Xavier, D. Rauly, A. Daullé
(pp. 6-8)
Keywords:
Microelectronics,
Microwaves,
Sensors,
Temperature gradient
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| 878383 |
Precision Tin/Lead Alloy Plating for Flip-Chip Mounting Technology
H. Richter, K.
Ruess, A. Gemmler, W. Leonhard
(pp. 9-13)
Keywords:
Alloys,
Bumping,
Flip chip,
Microelectronics,
Plating,
Tin-lead
ArticleType:
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| 1455590 |
Effects of Lift-off Procedures on Mechanical and Chemical Properties of Photoresists
N. Imber, M. Hershcovitz, A. Ashur, I. E. Klein
(pp. 14-15(continued on page 19))
Keywords:
Lift off,
Microelectronics,
Photoresists
ArticleType:
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| 1455591 |
The Analysis of Manufacturing Processes for Plastic Ball Grid
Arrays (PBGAs)
G. Hill
(pp. 16-19)
Keywords:
Electronics packaging,
Microelectronics,
Plastic ball grid array
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| 878384 |
Popcorning in PBGA Packages During IR Reflow Soldering
P. McCluskey, R. Munamarty, M. Pecht
(pp. 20-23)
Keywords:
Electronics packaging,
Microelectronics,
Plastic ball grid array,
Popcorning
ArticleType:
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