| 878385 |
Planarisation of NiFeO Thick Film Ferrite Inductors
O.S. Aleksic, P.M. Nikolic, D. Vasiljevic-Radovic, M.D. Lukovic, S. Duric
(pp. 5-7)
Keywords:
Inductors,
Microelectronics,
Thick film
ArticleType:
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| 1508841 |
Thermal Transient Testing
V. Székely, M. Rencz, B. Courtois
(pp. 8-10)
Keywords:
Electronic packaging,
Microelectronics,
Testing,
Thermal testing
ArticleType:
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| 878386 |
Plastic Ball Grid Array Attachment: Assembly and Reliability
Performance
L. Anderson, A.A. Primavera
(pp. 11-15)
Keywords:
Assembly,
Electronics packaging,
Microelectronics,
Plastic ball grid array,
Reliability,
Testing
ArticleType:
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| 878387 |
Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging Applications
M.G. Firmstone, P.M. Bartholomew, G. Paterson, R. Dietz, P. Robinson
(pp. 16-21)
Keywords:
Adhesives,
Conductive adhesives,
Electronics packaging,
Microelectronics,
Multicore,
Thermoplastics
ArticleType:
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| 878388 |
Low Ohm Resistor Series for Optimum Performance in High Voltage Surge Applications
M.F. Barker
(pp. 22-24 (continued on pages 57,58))
Keywords:
Microelectronics,
Resistors,
Surge Protection
ArticleType:
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| 878389 |
High-quality RF Inductors in LTCC
J. Müller
(pp. 59-63)
Keywords:
Ceramics,
Conduction,
Inductors,
Microelectronics
ArticleType:
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| 878390 |
TECHNICAL BRIEF Polymer Thick Film Resistors: Application
and Design Criteria
D. Jean, R.
Linde
(pp. 65-66)
Keywords:
Microelectronics,
Polymers,
Resistors,
Thick film
ArticleType:
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