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Microelectronics International

Volume 14 Issue 3

Published: 1997 | Start Page: 5

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Articles

Articles
Article No: Article Information:
1455592 AIN LGAs for High Performance Packaging Applications
N. Iwase, J. Ewanich (pp. 5-7)
Keywords: Aluminium, Electronics packaging, Land grip array, Microelectronics
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1455593 High Current Integrated Microinductors and Microtransformers using Low Temperature Fabrication Processes
J.Y. Park, M.G. Allen (pp. 8-11(continued on page 18))
Keywords: Electromagnetics, Inductance, Microelectronics, Transformers
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878391 Novel Epoxy-based Compositions for Microelectronics Packaging Applications: Part I
R. Ghoshal, M. Sambasivam, P.K. Mukerji (pp. 12-14(continued on page 18))
Keywords: Electronics packaging, Epoxy, Microelectronics, Resins
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878392 A Zero X-Y Shrinkage Low Temperature Cofired Ceramic Substrate Using Ag and AgPd Conductors for Flip-chip Bonding*
M. Itagaki, Y. Bessho, K. Eda, T. Ishida (pp. 15-18)
Keywords: Bonding, Ceramics, Flip chip, Microelectronics, Shrinkage
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878393 Moisture Ambient Effects on an AlO Thin-thick Film Overlaid Parallel Coupled Broad-band Microstrip Filter
S.B. Rane, V. Puri (pp. 19-20(continued on page 30))
Keywords: Fulter, Microelectronics, Moisture, Overlay, Thick film, Thin film
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1455594 Fatigue Properties of BGA Solder Joints: A Comparison of Thermal and Power Cycle Tests
H.-J. Albrecht, J.Gamalski (pp. 21-30)
Keywords: Ball grid array, Cycle tests, Fatigue, Microelectronics, Solder joint
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878394 Tomorrow’s Packaging – Chip Scale Packaging vs Flip Chip
K. Boustedt, E.J. Vardaman (pp. 31-32)
Keywords: Chip scale packaging, Electronics packaging, Flip chip, Microelectronics
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1455595 Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps
S. Honma, K. Tateyama, H. Yamada, K. Doi, N. Hirano, T. Okada, H. Aoki, Y. Hiruta, T. Sudo (pp. 47-50)
Keywords: Eutectic, Microelectronics, Solder bumps, Thin film
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1455596 Advanced Thick-film Technology — The New Generation
P. Barnwell, J. Wood (pp. 51-53)
Keywords: Ceramics, Electronics packaging, Microelectronics, Thick film
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878395 Achieving Low Moisture Levels in Hermetic Packages containing Silver Glass with Organic Solvent Die Attach Materials
P. Coupier, J. Ph. Peltier, E. Pilat (pp. 54-56)
Keywords: Electronics packaging, Microelectronics, Moisture, Semiconductors
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