| 1455597 |
A comparative analysis of interconnection technologies for integrated multilayer inductors
Stephen O’ Reilly, John Flannery, Terence O’ Donnell, Andrew Muddiman, Gerard Healy, Michael Byrne, Sean Cian Ó Mathúna
(pp. 6-10)
Keywords:
Electroplating,
Planar inductor,
Printed circuit board,
Thick film
ArticleType: General review
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(97 KB)
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| 878396 |
Thin-film processing on a thick-film multilayer
Gerhard Klink, Andreas Drost
(pp. 11-14)
Keywords:
Multichip module,
Planarisation,
Polyimide,
Thick film,
Thin-film processing
ArticleType: Research paper
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(148 KB)
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| 878397 |
Current noise of trimmed thick-film resistors: measurement and simulation
Achim Raab, Christian Jung, Peter Dullenkopf
(pp. 15-22)
Keywords:
Current noise,
Noise measurement,
Noise simulation,
Trimmed thick-film resistors
ArticleType: Research paper
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(120 KB)
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| 878398 |
Thermodynamic aspect of the wire-bonding process
J. Falk
(pp. 23-31)
Keywords:
Adhesion,
Finite element method,
Lift-off,
Thermodynamics,
Wire bonding
ArticleType: Research paper
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(134 KB)
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| 1455598 |
Low-cost fibre-chip coupling for electro-optic EMC-probes
Luc Vanwassenhove
(pp. 32-34)
Keywords:
Flip-chip,
Mounting,
Probes
ArticleType: Research paper
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(85 KB)
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| 1455599 |
Effects of chip scale package and flip-chip on the design and manufacturing of electronic products
Petri Savolainen
(pp. 35-38)
Keywords:
Assembly,
Chip scale packages,
Design,
Flip-chip
ArticleType: General review
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(60 KB)
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| 878399 |
A five-layer thin film MCM-Si design using oxynitride dielectrics
Jo Lernout
(pp. 39-42)
Keywords:
Interconnection,
MCM-Si,
Multichip modules,
Oxynitride
ArticleType: Research paper
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(80 KB)
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