| 878400 |
An investigation of the effect of poling conditions on the characteristics of screen-printed piezoceramics
Peter Dargie, Russell Sion, John Atkinson, Neil White
(pp. 6-10)
Keywords:
Pastes,
Piezoelectric,
Poling conditions,
Thick film
ArticleType: General review
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(87 KB)
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| 878401 |
Performance of Cu- and Ag-based microstrips up to millimetre wave frequencies
Esa Kemppinen, Petri Mikkonen, Paul E. Collander, Seppo Leppävuori
(pp. 11-15)
Keywords:
Dielectric constant,
Microstrip,
Microwave probing,
Permittivity measurements,
Transmission line attenuation
ArticleType: General review
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(94 KB)
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| 878402 |
A new under bump metallurgy for solder bump flip chip applications
Kari Kulojärvi, Jorma Kivilahti
(pp. 16-19)
Keywords:
Flip chip,
Transfusion technology,
Under bump metallurgy
ArticleType: Research paper
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(66 KB)
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| 878403 |
Effect of dissolution and intermetallic formation on the reliability of FC joints
Kari Kulojärvi, Vesa Vuorinen, Jorma Kivilahti
(pp. 20-24)
Keywords:
Electronic packaging,
Flip chip,
Intermetallics,
Under bump metallurgy
ArticleType: General review
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(124 KB)
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| 878404 |
Thermal performance of a low-cost thermal enhanced plastic ball grid array package - NuBGA
John H. Lau, K.L. Chen, F. Wu
(pp. 25-33)
Keywords:
Electronic packaging,
Plastic ball grid array,
Thermal performance
ArticleType: Research paper
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(292 KB)
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| 878405 |
Optimization of thermal distribution in ceramics and LTCC structures applied to sensor elements
Reinhard Bauer, Leszek J. Golonka, Torsten Kirchner, Karol Nitsch, Heiko Thust
(pp. 34-38)
Keywords:
Ceramics,
Cutting lasers,
Heaters,
Thick film sensors
ArticleType: Research paper
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(117 KB)
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