| 878406 |
The past, present and future of EEE components for space application: COTS - the next generation
John Wall, Nihal Sinnadurai
(pp. 7-16)
Keywords:
Aerospace industry,
Components,
Microelectronics
ArticleType: Technical paper
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(132 KB)
|
| 1455600 |
Future trends in materials for lightweight microwave packaging
David M. Jacobson, Satti P.S. Sangha
(pp. 17-21)
Keywords:
Composite materials,
Manufacturing,
Microwaves,
Packaging
ArticleType: General review
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(77 KB)
|
| 878407 |
Frits in thick film superconductors: a special approach for improving superconducting and adhesion properties
Gábor Harsányi, Yanqing Liu, W. Kinzy Jones
(pp. 22-25)
Keywords:
Adhesion,
High temperature,
Superconductors,
Thick film
ArticleType: General review
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(65 KB)
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| 878408 |
Silicon pressure sensors with a thick film periphery
Darko Belavic, Stojan Šoba, Marko Pavlin, Dubravka Rocak, Marko Hrovat
(pp. 26-30)
Keywords:
Parameter adjustment,
Pressure sensors,
Silicone,
Thick film
ArticleType: General review
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(109 KB)
|
| 878409 |
Studying electro-physical material characteristics of vacuum-deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups
Ph. Philippov, R. Arnaudov, N. Yordanov, V. Ianev, M. Gospodinova
(pp. 31-35)
Keywords:
Aluminium,
Interconnection,
Multichip module,
Vacuum deposition,
Vias
ArticleType: Technical paper
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(87 KB)
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| 878410 |
A new concept for the use of Al-sheet as integrated substrate for one or multichip module package
Ph. Philippov, R. Arnaudov, N. Yordanov, M. Gospodinova
(pp. 36-41)
Keywords:
Interconnection,
Multichip module,
Thin film
ArticleType: Technical paper
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(93 KB)
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| 1455601 |
The role of selective electroplating in the construction of advanced circuit boards
Peter Moran
(pp. 42-48)
Keywords:
Ceramics,
Copper,
Electroplating,
Interconnection,
Printed circuit boards
ArticleType: Technical paper
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(103 KB)
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