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Microelectronics International

Volume 16 Issue 1

Published: 1999 | Start Page: 8

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Articles

Articles
Article No:	Article Information:
1455602	A simple modification of a flip-chip bonder to allow large area chip attach S. Fuchs, K. Rindelhardt, J. Barrett, F. Stam (pp. 8-11) Keywords: Assembly, Flip chip, Mountings ArticleType: Technical paper View HTML \| View PDF (141 KB) \| Reprints & Permissions
1455603	Higher yields and reliability with automated assembly of microwave modules Michael Chalsen, Daniel Crowley (pp. 12-17) Keywords: Assembly, Automation, Microwaves ArticleType: Technical paper View HTML \| View PDF (296 KB) \| Reprints & Permissions
878411	Characteristics of passive Ta-resistive planes embedded in Al-sheet “PCB” - compatible for integrated MCM-substrates or packaging carriers Philip Ivanov Philippov, Milka Markova Rassovska, Radosvet Georgiev Arnaudov, Vassil Angelov Ianev, Minka Draganova Gospodinova (pp. 18-20) Keywords: Aluminium, Multichip model, Multilayers, Packaging ArticleType: Technical paper View HTML \| View PDF (51 KB) \| Reprints & Permissions
1455604	High performance liquid cooled aluminium nitride heat sinks R. Hahn, V. Glaw, A. Ginolas, M. Töpfer, K. Wittke, H. Reichl (pp. 21-26) Keywords: Fabrication, Heat sinks ArticleType: Technical paper View HTML \| View PDF (180 KB) \| Reprints & Permissions
878412	Self-managing teams in high technology manufacture: overcoming technological barriers James McCalman (pp. 27-34) Keywords: High technology, Management, Performance, Self-managing teams, Work organization ArticleType: Case study View HTML \| View PDF (83 KB) \| Reprints & Permissions

Editorial

Life cycle and environmental mismatches in electronics for critical applications
Item No:	Item Information
1487840	Life cycle and environmental mismatches in electronics for critical applications Journal: Microelectronics International Vol : 16 Issue: 1 Author(s): F. Patrick McCluskey View HTML

Internet commentary

O what a tangled web we weave
Item No:	Item Information
1487841	O what a tangled web we weave Journal: Microelectronics International Vol : 16 Issue: 1 Author(s): Brian Ellis View HTML

Communication

IVF research projects
Item No:	Item Information
1487842	IVF research projects Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Lessons learnt from the Montreal Protocol
Item No:	Item Information
1487843	Lessons learnt from the Montreal Protocol Journal: Microelectronics International Vol : 16 Issue: 1 Author(s): Brian Ellis View HTML

IMAPS news

Jim Cook is 1999 President of International Microelectronics and Packaging Society
Item No:	Item Information
1487844	Jim Cook is 1999 President of International Microelectronics and Packaging Society Journal: Microelectronics International Vol : 16 Issue: 1 Author(s): Brian Ellis View HTML

Industry news

Third microsystems MPW service now available from EUROPRACTICE
Item No:	Item Information
1487845	Third microsystems MPW service now available from EUROPRACTICE Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

European design houses to join new EUROPRACTICE 'IC service alliance' program
Item No:	Item Information
1487846	European design houses to join new EUROPRACTICE 'IC service alliance' program Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Intarsia Corporation and Philips Integrated Passive Components to collaborate on standards for chip scale integrated passive devices
Item No:	Item Information
1487847	Intarsia Corporation and Philips Integrated Passive Components to collaborate on standards for chip scale integrated passive devices Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

General Scanning introduces breakthrough process in new chip component trim system
Item No:	Item Information
1487848	General Scanning introduces breakthrough process in new chip component trim system Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Internet patent search service launched
Item No:	Item Information
1487849	Internet patent search service launched Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Suppliers of assembly and specialist equipment
Item No:	Item Information
1487850	Suppliers of assembly and specialist equipment Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

ITRI releases BGA guidelines report
Item No:	Item Information
1487851	ITRI releases BGA guidelines report Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Chip scale packaging will not affect bare die market
Item No:	Item Information
1487852	Chip scale packaging will not affect bare die market Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Survey points way for new European quality labelling scheme in electronics training
Item No:	Item Information
1487853	Survey points way for new European quality labelling scheme in electronics training Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Statek Corporation recommended for ISO certification
Item No:	Item Information
1487854	Statek Corporation recommended for ISO certification Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Philips Semiconductors teams with TSMC and EDB Investments to develop new chip production facility
Item No:	Item Information
1487855	Philips Semiconductors teams with TSMC and EDB Investments to develop new chip production facility Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Philips Components and Pioneer Electronic Corporation to develop the next generation of PDP technology
Item No:	Item Information
1487856	Philips Components and Pioneer Electronic Corporation to develop the next generation of PDP technology Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Fife company cleans up in the semiconductor industry
Item No:	Item Information
1487857	Fife company cleans up in the semiconductor industry Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Palomar Technologies expands presence in Europe
Item No:	Item Information
1487858	Palomar Technologies expands presence in Europe Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Schiller Automation Systems LLC
Item No:	Item Information
1487859	Schiller Automation Systems LLC Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Training

Full listing of qualified electronics training courses now available on the Web
Item No:	Item Information
1487860	Full listing of qualified electronics training courses now available on the Web Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Appointments

New senior appointments announced at CS2
Item No:	Item Information
1487861	New senior appointments announced at CS2 Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Promotion
Item No:	Item Information
1487862	Promotion Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Expanding efforts at California Micro Devices attract thin film veteran
Item No:	Item Information
1487863	Expanding efforts at California Micro Devices attract thin film veteran Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Advanced Surface Technology announces the appointment of vice president
Item No:	Item Information
1487864	Advanced Surface Technology announces the appointment of vice president Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

IMAPS diary

IMAPS diary
Item No:	Item Information
1487865	IMAPS diary Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Conferences and exhibitions

China's electronics industry grew by 26.19 percent for the first half of this year
Item No:	Item Information
1487866	China's electronics industry grew by 26.19 percent for the first half of this year Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

XIII SBMicro-ICMP '98, Curitiba, Brazil
Item No:	Item Information
1487867	XIII SBMicro-ICMP '98, Curitiba, Brazil Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

IMAPS expands scope of Denver conference and gives it a new name
Item No:	Item Information
1487868	IMAPS expands scope of Denver conference and gives it a new name Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

International diary

International diary
Item No:	Item Information
1487869	International diary Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

New products

New control system and air-tight sealing techniques slash operating cost of desiccator storage systems
Item No:	Item Information
1487870	New control system and air-tight sealing techniques slash operating cost of desiccator storage systems Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Holometrix and Micromet Instruments join to support the electronic thermal management and packaging materials market
Item No:	Item Information
1487871	Holometrix and Micromet Instruments join to support the electronic thermal management and packaging materials market Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

K and S introduces programmable manual wire bonders
Item No:	Item Information
1487872	K and S introduces programmable manual wire bonders Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

New semi-auto dicing systems combine enhanced accuracy, advanced software
Item No:	Item Information
1487873	New semi-auto dicing systems combine enhanced accuracy, advanced software Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Advanced Surface Technology introduces the new plasma system product line
Item No:	Item Information
1487874	Advanced Surface Technology introduces the new plasma system product line Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Vantage produces 3D scans of thick film
Item No:	Item Information
1487875	Vantage produces 3D scans of thick film Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

SMT stencil printer offers speed, convenience, productivity, 20 X 20 frame capacity
Item No:	Item Information
1487876	SMT stencil printer offers speed, convenience, productivity, 20 X 20 frame capacity Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

New backside silicon image enhancing software
Item No:	Item Information
1487877	New backside silicon image enhancing software Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Philips Semiconductors introduces low-cost RF front-end IC for wireless equipment
Item No:	Item Information
1487878	Philips Semiconductors introduces low-cost RF front-end IC for wireless equipment Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Palomar Technologies introduces continuous bonding technology
Item No:	Item Information
1487879	Palomar Technologies introduces continuous bonding technology Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Wafer dicing and singulation system ideal for advanced materials
Item No:	Item Information
1487880	Wafer dicing and singulation system ideal for advanced materials Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Programmable hall-effect sensor replaces mechanical potentiometers and angle measuring devices
Item No:	Item Information
1487881	Programmable hall-effect sensor replaces mechanical potentiometers and angle measuring devices Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Enthone-OMl introduces new micro via dielectric materials: photo definable and laser definable dielectric processes
Item No:	Item Information
1487882	Enthone-OMl introduces new micro via dielectric materials: photo definable and laser definable dielectric processes Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

Siemens to commercialize PSGA packaging technology
Item No:	Item Information
1487883	Siemens to commercialize PSGA packaging technology Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

New resistor networks protect AMD telecom chip sets against transient power faults under bellcore ITU specs
Item No:	Item Information
1487884	New resistor networks protect AMD telecom chip sets against transient power faults under bellcore ITU specs Journal: Microelectronics International Vol : 16 Issue: 1 View HTML

New technology in vaporising systems is launched
Item No:	Item Information
1487885	New technology in vaporising systems is launched Journal: Microelectronics International Vol : 16 Issue: 1 View HTML