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Microelectronics International

Volume 16 Issue 2

Published: 1999 | Start Page: 8

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Articles

Articles
Article No:	Article Information:
878413	Analysis of packaging and sealing techniques for microelectronic modules and recent advances P.K. Khanna, S.K. Bhatnagar, W. Gust (pp. 8-12) Keywords: Electronics, Hybrid circuits, Integrated circuits, Multichip modules, Packaging, Sealing ArticleType: Technical paper View HTML \| View PDF (109 KB) \| Reprints & Permissions
1455605	Low cost prototyping of multichip modules - the European INCO-Copernicus project Zsolt Illyefalvi-Vitéz, Alfons Vervaet, André Van Calster, Nihal Sinnadurai, Marko Hrovat, Paul Svasta, Endre Tóth, Darko Belavic, Radu Mihai Ionescu, William Dennehy (pp. 13-19) Keywords: Europe, Microelectronics, Multichip modules, Prototyping ArticleType: Technical paper View HTML \| View PDF (143 KB)
878414	Smart sensors for industrial applications Stephen J. Prosser, Ernest D.D. Schmidt (pp. 20-23) Keywords: Component manufacture, Microelectronics, Sensors ArticleType: Technical paper View HTML \| View PDF (200 KB) \| Reprints & Permissions
878415	Effect of heat-spreader sizes on the thermal performance of large cavity-down plastic ball grid array packages - NuCSP John Lau, Tony Chen (pp. 24-33) Keywords: Electronic packaging, Electronics assembly, Plastic ball grid array, Printed circuit boards, Thermal performance ArticleType: Technical paper View HTML \| View PDF (387 KB) \| Reprints & Permissions
878416	Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications Ken Gilleo, Peter Ongley (pp. 34-38) Keywords: Adhesives, Electronics assembly, Microelectronics, Polymers, Thermoplastics ArticleType: Technical paper View HTML \| View PDF (81 KB) \| Reprints & Permissions
878417	Towards a better understanding of underfill encapsulation for flip chip technology: proposed developments for the future Ken Gilleo, Matthew Witt, David Blumel, Peter Ongley (pp. 39-43) Keywords: Chip scale packaging, Encapsulation, Flip chip, Polymerization, Thermoplastics, Underfill ArticleType: Technical paper View HTML \| View PDF (277 KB) \| Reprints & Permissions
1455606	Anisotropic conducting adhesives for electronic assembly David C. Whalley, Samjid H. Mannan, David J. Williams (pp. 44-48) Keywords: Adhesives, Electronics assembly, Microelectronics ArticleType: Technical paper View HTML \| View PDF (135 KB) \| Reprints & Permissions
878418	Interconnect solutions for advanced area array packaging M.W. Hendriksen, F.K. Frimpong, N.N. Ekere (pp. 49-54) Keywords: Electronics packaging, Interconnection, Laminates, Microvias, Printed circuit boards ArticleType: Technical paper View HTML \| View PDF (128 KB) \| Reprints & Permissions
1455607	Low cost high-density multilayer circuits for MCM-C I. Born, D. Detemmerman, M. Vrana, J. De Baets, A. Van Calster (pp. 55-58) Keywords: HDIS circuits, Miniaturization, Multilayers ArticleType: Technical paper View HTML \| View PDF (156 KB) \| Reprints & Permissions

Editorial

The 12th European Microelectronics and Packaging Conference
Item No:	Item Information
1487886	The 12th European Microelectronics and Packaging Conference Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Internet commentary

After a search so painful, and so long
Item No:	Item Information
1487887	After a search so painful, and so long Journal: Microelectronics International Vol : 16 Issue: 2 Author(s): Brian Ellis View HTML

IMAPS news

IMAPS Sponsors 12th Annual European Microelectronics Conference and Exhibition
Item No:	Item Information
1487888	IMAPS Sponsors 12th Annual European Microelectronics Conference and Exhibition Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

IMAPS Brazil
Item No:	Item Information
1487889	IMAPS Brazil Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

IMAPS Germany
Item No:	Item Information
1487890	IMAPS Germany Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

IMAPS Nordic
Item No:	Item Information
1487891	IMAPS Nordic Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

IMAPS Poland
Item No:	Item Information
1487892	IMAPS Poland Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

IMAPS UK
Item No:	Item Information
1487893	IMAPS UK Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

IMAPS USA
Item No:	Item Information
1487894	IMAPS USA Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Industry news

Air Products acquires majority interest in Korea's leading specialty gas equipment manufacturer for the semiconductor industry
Item No:	Item Information
1487895	Air Products acquires majority interest in Korea's leading specialty gas equipment manufacturer for the semiconductor industry Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Semi Dice announces kick-off of third annual bare die survey
Item No:	Item Information
1487896	Semi Dice announces kick-off of third annual bare die survey Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Zevatech forms new advanced transfer division
Item No:	Item Information
1487897	Zevatech forms new advanced transfer division Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Palomar Technologies opens office in France
Item No:	Item Information
1487898	Palomar Technologies opens office in France Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Philips Semiconductors invests US$30 million to extend its Hamburg plant
Item No:	Item Information
1487899	Philips Semiconductors invests US$30 million to extend its Hamburg plant Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Palomar Technologies expands presence in Europe
Item No:	Item Information
1487900	Palomar Technologies expands presence in Europe Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Silway enters European ASSP and ASIC market with proven design and production facilities
Item No:	Item Information
1487901	Silway enters European ASSP and ASIC market with proven design and production facilities Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

General Scanning Inc. and Lumonics Inc. announce agreement to merge
Item No:	Item Information
1487902	General Scanning Inc. and Lumonics Inc. announce agreement to merge Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Appointments

Palomar Technologies names Todd Wieseler manager of applications engineering
Item No:	Item Information
1487903	Palomar Technologies names Todd Wieseler manager of applications engineering Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Micronic Laser Systems appoints chief financial officer
Item No:	Item Information
1487904	Micronic Laser Systems appoints chief financial officer Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Ray Cronin to lead Everett Charles Technologies semiconductor test group
Item No:	Item Information
1487905	Ray Cronin to lead Everett Charles Technologies semiconductor test group Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Conference programme

IMAPS EUROPE '99. 12th European Microelectronics and Packaging Conference and Exhibition
Item No:	Item Information
1487906	IMAPS EUROPE '99. 12th European Microelectronics and Packaging Conference and Exhibition Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

IMAPS diary

IMAPS diary
Item No:	Item Information
1487907	IMAPS diary Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

International diary

International diary
Item No:	Item Information
1487908	International diary Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

New products

Alternative pressing laminates (APL-D*) for producing sequential build-up multilayers
Item No:	Item Information
1487909	Alternative pressing laminates (APL-D) for producing sequential build-up multilayers Journal:* Microelectronics International Vol : 16 Issue: 2 View HTML

Staubli Tec-Sem - management buy out
Item No:	Item Information
1487910	Staubli Tec-Sem - management buy out Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Waterfall transducer provides acoustic coupling breakthrough
Item No:	Item Information
1487911	Waterfall transducer provides acoustic coupling breakthrough Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Johnson Matthey Hydrogen Technology Group delivers hydrogen purifier units to Aixtron AG of Aachen, Germany
Item No:	Item Information
1487912	Johnson Matthey Hydrogen Technology Group delivers hydrogen purifier units to Aixtron AG of Aachen, Germany Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Third-generation 193nm tool introduced as part of industry roadmap for critical chip design technology
Item No:	Item Information
1487913	Third-generation 193nm tool introduced as part of industry roadmap for critical chip design technology Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Palomar upgrades ball bonders with LED-based lighting system and light calibration software
Item No:	Item Information
1487914	Palomar upgrades ball bonders with LED-based lighting system and light calibration software Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Fastflo numerical simulation software on UNIX
Item No:	Item Information
1487915	Fastflo numerical simulation software on UNIX Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

New microwave UV curing system
Item No:	Item Information
1487916	New microwave UV curing system Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Flip chip option now available with DB100 semi-automatic precision die bonder from Cammax Precima
Item No:	Item Information
1487917	Flip chip option now available with DB100 semi-automatic precision die bonder from Cammax Precima Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Schlumberger introduces ETC 1000 for breakthrough precision in test site thermal control
Item No:	Item Information
1487918	Schlumberger introduces ETC 1000 for breakthrough precision in test site thermal control Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Composite chips for efficient EMI/RFI filtering
Item No:	Item Information
1487919	Composite chips for efficient EMI/RFI filtering Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Direct die feeder reduces packaging costs
Item No:	Item Information
1487920	Direct die feeder reduces packaging costs Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

First-ever zoom emission microscope combines speed and sensitivity
Item No:	Item Information
1487921	First-ever zoom emission microscope combines speed and sensitivity Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

ECT expands wide bandwidth coaxial probe line
Item No:	Item Information
1487922	ECT expands wide bandwidth coaxial probe line Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

New bond load option adds to flip chip bonder's versatility
Item No:	Item Information
1487923	New bond load option adds to flip chip bonder's versatility Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

ECT introduces expanded line of IC test probes
Item No:	Item Information
1487924	ECT introduces expanded line of IC test probes Journal: Microelectronics International Vol : 16 Issue: 2 View HTML

Publications

Ablestik offers comprehensive adhesive shipping, handling and storage guide
Item No:	Item Information
1487925	Ablestik offers comprehensive adhesive shipping, handling and storage guide Journal: Microelectronics International Vol : 16 Issue: 2 View HTML