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Microelectronics International

Volume 16 Issue 3

Published: 1999 | Start Page: 6

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Articles

Articles
Article No:	Article Information:
878419	Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill Zhaowei Zhong (pp. 6-14) Keywords: Anisotropy, Eutectic solder, Flip chip, Reliability, Underfill ArticleType: General review View HTML \| View PDF (316 KB) \| Reprints & Permissions
878420	Thermal fatigue analysis of the flip chip assembly on the polymer stud grid array (PSGA) package Bart Vandevelde, Eric Beyne (pp. 15-21) Keywords: Area array, Fatigue, Flip chip, Packaging, Thermal analysis ArticleType: Technical paper View HTML \| View PDF (371 KB) \| Reprints & Permissions
878421	High frequency wire bonding for PBGA package, a process optimisation approach Teo Kiat Choon, Victor G. Corpuz (Billie) (pp. 22-35) Keywords: Packaging, Plastic ball grid array, Wire bonding ArticleType: Technical paper View HTML \| View PDF (275 KB) \| Reprints & Permissions
878422	HDI substrate technology for electronic automotive applications M. Bremond, D. Lambert (pp. 36-38) Keywords: Build-up technology, HDIS circuits, Microvias ArticleType: Technical paper View HTML \| View PDF (96 KB) \| Reprints & Permissions
878423	A new approach to flip chip on board technology using SMT compatible processes S. Zhang, J. De Baets, A. Van Calster (pp. 39-42) Keywords: Flip chip on board, Printed circuit boards, Solder pastes, Surface mount technology ArticleType: Technical paper View HTML \| View PDF (104 KB) \| Reprints & Permissions
878424	The cyclic fatigue behaviour of ball grid arrays A.J. Curley, K.J. Williams, T. Le, H. Patel (pp. 43-45) Keywords: Adhesion, Ball grid array, Fatigue, Load analysis ArticleType: Technical paper View HTML \| View PDF (95 KB) \| Reprints & Permissions
1455608	Low cost high performance microwave structures fabricated by advanced thick film techniques Barbara Dziurdzia, Stanislaw Nowak, Michal Ciez, Wojciech Gregorczyk, Heiko Thust, Erich Polzer (pp. 46-53) Keywords: Etching, Microwaves, Solder pastes, Thick film ArticleType: Technical paper View HTML \| View PDF (382 KB) \| Reprints & Permissions

IMAPS news

IMAPS Europe '99 Harrogate
Item No:	Item Information
1487926	IMAPS Europe '99 Harrogate Journal: Microelectronics International Vol : 16 Issue: 3 Author(s): Brian Waterfield, Nihal Sinnadurai View HTML

IMAPS Germany
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1487927	IMAPS Germany Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

IMAPS Japan
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1487928	IMAPS Japan Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

IMAPS Nordic
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1487929	IMAPS Nordic Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

IMAPS USA
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1487930	IMAPS USA Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

IMAPS Poland
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1487931	IMAPS Poland Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Industry news

Karl Suss acquires product lines of Fairchild Technology SEG
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1487932	Karl Suss acquires product lines of Fairchild Technology SEG Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

New MRSI European office opens
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1487933	New MRSI European office opens Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

VIA electronic GmbH and SOREP-ERULEC S. A. form strategic alliance
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1487934	VIA electronic GmbH and SOREP-ERULEC S. A. form strategic alliance Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

TechSearch International's study shows Japanese companies dominate microvia production
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1487935	TechSearch International's study shows Japanese companies dominate microvia production Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Heraeus is named preferred supplier for C-MAC industries
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1487936	Heraeus is named preferred supplier for C-MAC industries Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

NPL improves reliability and performance of microelectronics encapsulants
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1487937	NPL improves reliability and performance of microelectronics encapsulants Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Agreement adds third component to JME/Flomerics Inc. pact signed June 1998
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1487938	Agreement adds third component to JME/Flomerics Inc. pact signed June 1998 Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

UMC and Virtual Silicon Technology join Europractice MPW service
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1487939	UMC and Virtual Silicon Technology join Europractice MPW service Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Inseto and Delo in partnership
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1487940	Inseto and Delo in partnership Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

The worldwide market for digital mobile radio
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1487941	The worldwide market for digital mobile radio Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Microelectronic Modules Corp. acquires Switch Power, Inc.
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1487942	Microelectronic Modules Corp. acquires Switch Power, Inc. Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Total solution, low-cost prototyping and small volume ASICs in 0.25 micron available to US companies
Item No:	Item Information
1487943	Total solution, low-cost prototyping and small volume ASICs in 0.25 micron available to US companies Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Stanford selects Europractice IC service for low volume production of highly specialized ASIC
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1487944	Stanford selects Europractice IC service for low volume production of highly specialized ASIC Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Heraeus lead-free solder is IDEAL for Marconi
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1487945	Heraeus lead-free solder is IDEAL for Marconi Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

CS2 achieves commercial production in record time
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1487946	CS2 achieves commercial production in record time Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Microsystems roadmap predicts technical challenge for packaging industry
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1487947	Microsystems roadmap predicts technical challenge for packaging industry Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Du Pont improves thick film product testing facilities
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1487948	Du Pont improves thick film product testing facilities Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Maury and ATN announce microwave alliance
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1487949	Maury and ATN announce microwave alliance Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Appointments

BC Components Centralab appoints new CEO for Asia-Pacific operations
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1487950	BC Components Centralab appoints new CEO for Asia-Pacific operations Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Alphasem appoints new VP sales and marketing
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1487951	Alphasem appoints new VP sales and marketing Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Jay Boyd joins MicroJoin as vice president sales and marketing
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1487952	Jay Boyd joins MicroJoin as vice president sales and marketing Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Maximilian Huber will take over responsibility for Europe as Head of Sharp Microelectronics Division in Hamburg
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1487953	Maximilian Huber will take over responsibility for Europe as Head of Sharp Microelectronics Division in Hamburg Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Robert Ott selected Asian regional sales manager for Palomar Technologies
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1487954	Robert Ott selected Asian regional sales manager for Palomar Technologies Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Horiba president appointed director of SEMI
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1487955	Horiba president appointed director of SEMI Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Former general manager of IBM Microelectronics brings more than 30 years' experience to SVG
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1487956	Former general manager of IBM Microelectronics brings more than 30 years' experience to SVG Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Professor Gilbert Declerck appointed as new president and CEO
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1487957	Professor Gilbert Declerck appointed as new president and CEO Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

IMAPS diary

IMAPS diary
Item No:	Item Information
1487958	IMAPS diary Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

International diary

International diary
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1487959	International diary Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

New products

Silicon Valley Group unveils Procell™ a vital partner in lithography cluster productivity
Item No:	Item Information
1487960	Silicon Valley Group unveils Procell™ a vital partner in lithography cluster productivity Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

SEC introduces new laser diode bonder
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1487961	SEC introduces new laser diode bonder Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

New design for surface-mount single in-line packages combines advantages of SMT and SIP hybrid circuitry
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1487962	New design for surface-mount single in-line packages combines advantages of SMT and SIP hybrid circuitry Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Alphasem's new Swissline 9002 FC/CSP die attach system
Item No:	Item Information
1487963	Alphasem's new Swissline 9002 FC/CSP die attach system Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection
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1487964	MicroJoin introduces the 4200 PDI pulsed heat hot bar bonder with powered display inspection Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Closed-loop process control benefits encapsulation
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1487965	Closed-loop process control benefits encapsulation Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

New from UV Light Technology Limited a range of high performance UV light cabinet systems
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1487966	New from UV Light Technology Limited a range of high performance UV light cabinet systems Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Sonoscan introduces time-saving STAR module
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1487967	Sonoscan introduces time-saving STAR module Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications
Item No:	Item Information
1487968	Siemens introduces direct die feeder technology for fast, easy placement in chip on board (COB) and flip chip applications Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

New range of polymer thick film materials from Multicore-Asahi includes resistor inks for embedded passives
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1487969	New range of polymer thick film materials from Multicore-Asahi includes resistor inks for embedded passives Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Unique BGA reballing solution from Intertronics
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1487970	Unique BGA reballing solution from Intertronics Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Palomar upgrades ball bonders with LED-based lighting system and light calibration software
Item No:	Item Information
1487971	Palomar upgrades ball bonders with LED-based lighting system and light calibration software Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Automatic wafer transfer option enables continuous die placement on Quad APS-I advanced packaging system
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1487972	Automatic wafer transfer option enables continuous die placement on Quad APS-I advanced packaging system Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

New Leica INS 1000 post-electrical test inspection station
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1487973	New Leica INS 1000 post-electrical test inspection station Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system
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1487974	Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Dexter introduces Hysol FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices
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1487975	Dexter introduces Hysol FluxFill 2000 reflow encapsulant designed for flip chip semiconductor devices Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

New adhesive films from Ablestik
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1487976	New adhesive films from Ablestik Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Du Pont launches new gold conductor QG150 for high density/high frequency applications
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1487977	Du Pont launches new gold conductor QG150 for high density/high frequency applications Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Obituary

Baron Professor Roger Van Overstraeten
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1487978	Baron Professor Roger Van Overstraeten Journal: Microelectronics International Vol : 16 Issue: 3 View HTML

Internet commentary

He trudg'd along, unknowing what he sought (John Dryden, Cymon and Iphigenia)
Item No:	Item Information
1487979	He trudg'd along, unknowing what he sought (John Dryden, Cymon and Iphigenia) Journal: Microelectronics International Vol : 16 Issue: 3 Author(s): Brian Ellis View HTML