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Microelectronics International

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Articles

Articles

Article No:	Article Information:
1455609	PAD design reliability for SMD passives Milos Dusek, Ivan Szendiuch, Petr Szuscik (pp. 8-12) Keywords: Components, Reliability, Stencils, Surface mount technology, Thermal cycling ArticleType: Research paper View HTML | View PDF (201 KB) | Reprints & Permissions
1455610	An analysis of technology trends within the electronics industry P.J. Palmer, D.J. Williams (pp. 13-16) Keywords: Electronics industry, Forecasting, Technology ArticleType: General review View HTML | View PDF (215 KB) | Reprints & Permissions
878425	A new method for measuring signal integrity in CMOS ICs Sonia Delmas-Bendhia, Fabrice Caignet, Etienne Sicard (pp. 17-21) Keywords: Integrated circuits, Measurement, Sensors ArticleType: Technical paper View HTML | View PDF (829 KB) | Reprints & Permissions
878426	Cure behavior of a no flow underfill encapsulant D.T. Hsu, H.K. Kim, F.G. Shi, H.Y. Tong, S. Chungpaiboonpatana, C. Davidson, J.M. Adams (pp. 22-27) Keywords: Curing, Encapsulant materials, Reliability, Solder joints, Underfill ArticleType: Research paper View HTML | View PDF (231 KB) | Reprints & Permissions
878427	Reliability of flip chip components soldered on FR5 board Jarmo Määttänen, Petteri Palm, Aulis Tuominen (pp. 27-30) Keywords: Electronics packaging,, Flip chip,, Reliability,, Solder bumps,, Temperature cycling ArticleType: Technical paper View HTML | View PDF (380 KB) | Reprints & Permissions
1455611	Substrate integrated packaging for RF-applications H. Richter, D. Ferling, F. Buchali, W. Heck (pp. 31-36) Keywords: Electronics packaging, Multilayers, Thin film ArticleType: Technical paper View HTML | View PDF (1856 KB) | Reprints & Permissions
1455612	A comparison of routing estimation methods for microelectronic modules P.A. Sandborn, P. Spletter (pp. 36-41) Keywords: Estimation, Microelectronic modules, Multilayers, Routing ArticleType: General review View HTML | View PDF (219 KB) | Reprints & Permissions

Editorial

Y2K, here we are!

Item No:	Item Information
1487980	Y2K, here we are! Journal: Microelectronics International Vol : 17 Issue: 1 Author(s): Prof. Nihal Sinnadurai View HTML

IMAPS news

IMAPS UK

Item No:	Item Information
1487981	IMAPS UK Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

IMAPS Benelux

Item No:	Item Information
1487982	IMAPS Benelux Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

IMAPS USA

Item No:	Item Information
1487983	IMAPS USA Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

IMAPS Japan

Item No:	Item Information
1487984	IMAPS Japan Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Industry news

California Micro Devices opens European office

Item No:	Item Information
1487985	California Micro Devices opens European office Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

UV companies combine and launch latest in microwave curing

Item No:	Item Information
1487986	UV companies combine and launch latest in microwave curing Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

The Nordic Electronics Packaging Guideline

Item No:	Item Information
1487987	The Nordic Electronics Packaging Guideline Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Developers of the MP3 chip awarded innovation prize

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1487988	Developers of the MP3 chip awarded innovation prize Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

SEMI DICE announces two 'discrete' relationships

Item No:	Item Information
1487989	SEMI DICE announces two 'discrete' relationships Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Appointments

Prasad Nevrekar joins MRSI group as director of sales and marketing

Item No:	Item Information
1487990	Prasad Nevrekar joins MRSI group as director of sales and marketing Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

New impetus for microelectronics

Item No:	Item Information
1487991	New impetus for microelectronics Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Semi Dice announces four promotions

Item No:	Item Information
1487992	Semi Dice announces four promotions Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

New sales manager for Menvier Hybrids

Item No:	Item Information
1487993	New sales manager for Menvier Hybrids Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

IMAPS diary

IMAPS diary

Item No:	Item Information
1487994	IMAPS diary Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Conferences/exhibitions

IMAPS and Miller Freeman announce launch of HD International

Item No:	Item Information
1487995	IMAPS and Miller Freeman announce launch of HD International Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

International diary

International diary

Item No:	Item Information
1487996	International diary Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Technical brief

Discovering a heroic connection

Item No:	Item Information
1487997	Discovering a heroic connection Journal: Microelectronics International Vol : 17 Issue: 1 Author(s): Professor Nihal Sinnadurai View HTML

New products

MicroJoin Model 2000 delivers precision-controlled pulsed hot bar bonding capabilities in an integrated workstation

Item No:	Item Information
1487998	MicroJoin Model 2000 delivers precision-controlled pulsed hot bar bonding capabilities in an integrated workstation Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Expanded pupil microscope technology makes die bonding more efficient

Item No:	Item Information
1487999	Expanded pupil microscope technology makes die bonding more efficient Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Speedline launches industry's only wafer printing system with integrated wafer handling robot

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1488000	Speedline launches industry's only wafer printing system with integrated wafer handling robot Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Enthone-OMl opens high volume copper manufacturing facility

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1488001	Enthone-OMl opens high volume copper manufacturing facility Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Three chips stacked in one housing

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1488002	Three chips stacked in one housing Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Conductive film for MR/GMR head wafer fab

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1488003	Conductive film for MR/GMR head wafer fab Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Recommended reading for microelectronics technologists

Item No:	Item Information
1488004	Recommended reading for microelectronics technologists Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Quad launches first advanced packaging system to address needs of hybrid market while providing full SMT assembly capabilities

Item No:	Item Information
1488005	Quad launches first advanced packaging system to address needs of hybrid market while providing full SMT assembly capabilities Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

New Murakami capillary film

Item No:	Item Information
1488006	New Murakami capillary film Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Radiant technology unveils new wafer bump reflow oven

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1488007	Radiant technology unveils new wafer bump reflow oven Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Total solutions for the back end from datacon

Item No:	Item Information
1488008	Total solutions for the back end from datacon Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

High-speed, fully automatic screen printer for substrates, wafers and panels for solar cell production

Item No:	Item Information
1488009	High-speed, fully automatic screen printer for substrates, wafers and panels for solar cell production Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Dage launches new low-force wire pull tester

Item No:	Item Information
1488010	Dage launches new low-force wire pull tester Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Pure silver flakes conduct electricity and heat

Item No:	Item Information
1488011	Pure silver flakes conduct electricity and heat Journal: Microelectronics International Vol : 17 Issue: 1 View HTML

Internet commentary

Style is the dress of thought

Item No:	Item Information
1488012	Style is the dress of thought Journal: Microelectronics International Vol : 17 Issue: 1 Author(s): Brian Ellis View HTML