Welcome guest

Microelectronics International

Browse
User Guides

Online Access

See all available RSS feeds

Journal Information

E-mail this page

Microelectronics International

Volume 17 Issue 2

Published: 2000 | Start Page: 7

Icon Key:

Requires login or subscription

Backfiles

EarlyCite

Articles

Articles
Article No:	Article Information:
878428	Embedded passive components and PCB size – thermal effects D.M. Stubbs, S.H. Pulko, A.J. Wilkinson, B. Wilson, F. Christiaens, K. Allaert (pp. 7-10) Keywords: Heat, Printed circuit boards, Resistors, Simulation, Thermal testing ArticleType: Technical paper View HTML \| View PDF (218 KB) \| Reprints & Permissions
878429	Packaging of closed chamber PCR-chips for DNA amplification C.G.J. Schabmueller, A.G.R. Evans, A. Brunnschweiler, G. Ensell, D.L. Leslie, M.A. Lee (pp. 11-14) Keywords: Chips, Packaging, Reactors, Silicone ArticleType: Technical paper View HTML \| View PDF (412 KB) \| Reprints & Permissions
878430	Assembly issues in three flip chip processes Zhaowei Zhong (pp. 15-18) Keywords: Adhesives, Bonding, Flip chip, Stud bump bonding, Underfill ArticleType: Technical paper View HTML \| View PDF (507 KB) \| Reprints & Permissions
878431	Advances in microwave MCM-D technology Philip Pieters, Walter De Raedt, Eric Beyne (pp. 19-22) Keywords: Interconnection, Multichip module, Multilayers, Technological innovation ArticleType: Technical paper View HTML \| View PDF (586 KB) \| Reprints & Permissions
1455613	Wafer level packaging of compliant, chip size ICs Joseph Fjelstad, Thomas DiStefano, Anthony Faraci (pp. 23-27) Keywords: Integrated circuits, Packaging, Semiconductors ArticleType: Technical paper View HTML \| View PDF (1687 KB) \| Reprints & Permissions

Book Review

Conductive Adhesives for Electronics Packaging
Item No:	Item Information
1498945	Conductive Adhesives for Electronics Packaging Journal: Microelectronics International Vol : 17 Issue: 2 Author(s): Nihal Sinnadurai View HTML

An Engineer’s Handbook of Encapsulation and Underfill Technology
Item No:	Item Information
1498946	An Engineer’s Handbook of Encapsulation and Underfill Technology Journal: Microelectronics International Vol : 17 Issue: 2 Author(s): David Kingsley View HTML

IMAPS news

IMAPS Israel
Item No:	Item Information
1488013	IMAPS Israel Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

IMAPS UK
Item No:	Item Information
1488014	IMAPS UK Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

IMAPS Nordic
Item No:	Item Information
1488015	IMAPS Nordic Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

MicroTech 2001
Item No:	Item Information
1488016	MicroTech 2001 Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Industry news

Amkor to install wafer bumping capability to support growing demand for flip chip packaging
Item No:	Item Information
1488017	Amkor to install wafer bumping capability to support growing demand for flip chip packaging Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Kulicke & Soffa and Amkor Technology announce flip chip technologies license
Item No:	Item Information
1488018	Kulicke & Soffa and Amkor Technology announce flip chip technologies license Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Amkor and Unitive Electronics sign licensing agreement for new flip chip wafer bumping technology ideal for communications
Item No:	Item Information
1488019	Amkor and Unitive Electronics sign licensing agreement for new flip chip wafer bumping technology ideal for communications Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Project proposal: Bluetooth application group
Item No:	Item Information
1488020	Project proposal: Bluetooth application group Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

NPL to generate data on underfills
Item No:	Item Information
1488021	NPL to generate data on underfills Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Study reveals the future of bare die
Item No:	Item Information
1488022	Study reveals the future of bare die Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Launch of Microelectronics Europe (SME)
Item No:	Item Information
1488023	Launch of Microelectronics Europe (SME) Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Dow Corning and Air Products join forces to supply trimethylsilane to the global semiconductor industry
Item No:	Item Information
1488024	Dow Corning and Air Products join forces to supply trimethylsilane to the global semiconductor industry Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

semiconbay.com enters into agreement with SBN and The Electrochemical Society
Item No:	Item Information
1488025	semiconbay.com enters into agreement with SBN and The Electrochemical Society Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Kulicke & Soffa and DATACON establish joint European Technology Center
Item No:	Item Information
1488026	Kulicke & Soffa and DATACON establish joint European Technology Center Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Dage moves into Japan
Item No:	Item Information
1488027	Dage moves into Japan Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Mintech raises wafer stakes
Item No:	Item Information
1488028	Mintech raises wafer stakes Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Menvier Hybrids closes the gap
Item No:	Item Information
1488029	Menvier Hybrids closes the gap Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Cammax is first in UK with in-house die bonding processing service
Item No:	Item Information
1488030	Cammax is first in UK with in-house die bonding processing service Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Racal strengthens position with Inotek purchase
Item No:	Item Information
1488031	Racal strengthens position with Inotek purchase Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Technologists from around the world converge in semiconbay.com Webcast
Item No:	Item Information
1488032	Technologists from around the world converge in semiconbay.com Webcast Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

CMP provides ARM® solutions to academic institutions
Item No:	Item Information
1488033	CMP provides ARM® solutions to academic institutions Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

New Leica Microsystems training centre - an offer for the worldwide semiconductor industry
Item No:	Item Information
1488034	New Leica Microsystems training centre - an offer for the worldwide semiconductor industry Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Loctite acquires multicore solders
Item No:	Item Information
1488035	Loctite acquires multicore solders Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Technology news from Philips Semiconductors
Item No:	Item Information
1488036	Technology news from Philips Semiconductors Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Protonique has moved
Item No:	Item Information
1488037	Protonique has moved Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Appointments

Exsil announces new president
Item No:	Item Information
1488038	Exsil announces new president Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Vitronics Soltec names new president, sales director for North and South America
Item No:	Item Information
1488039	Vitronics Soltec names new president, sales director for North and South America Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Lane to Menvier
Item No:	Item Information
1488040	Lane to Menvier Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Matthew Wilson joins MRSI product applications staff
Item No:	Item Information
1488041	Matthew Wilson joins MRSI product applications staff Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Lisa Michael joins semiconbay.com
Item No:	Item Information
1488042	Lisa Michael joins semiconbay.com Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Air Products appoints new president of electronic chemicals
Item No:	Item Information
1488043	Air Products appoints new president of electronic chemicals Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Leo van Bree appointed vice president and general manager for Schlumberger Semiconductor Solutions, Europe
Item No:	Item Information
1488044	Leo van Bree appointed vice president and general manager for Schlumberger Semiconductor Solutions, Europe Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Conferences/exhibitions

Boston's Hynes Convention Center is site for International Microelectronics and Packaging Society (IMAPS) Year 2000 Annual Symposium
Item No:	Item Information
1488045	Boston's Hynes Convention Center is site for International Microelectronics and Packaging Society (IMAPS) Year 2000 Annual Symposium Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Announcing the 3rd Annual IMAPS-UK/IEEE-CPMT/ASME/SPE/SPIE/MRS Workshop (POLY 2000)
Item No:	Item Information
1488046	Announcing the 3rd Annual IMAPS-UK/IEEE-CPMT/ASME/SPE/SPIE/MRS Workshop (POLY 2000) Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

International diary

International diary
Item No:	Item Information
1488047	International diary Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

New products

Super FSF-52 thermal interface material
Item No:	Item Information
1488048	Super FSF-52 thermal interface material Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

3D laser inspection system for bump inspection
Item No:	Item Information
1488049	3D laser inspection system for bump inspection Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

MRSI introduces advanced technology for eutectic die attach
Item No:	Item Information
1488050	MRSI introduces advanced technology for eutectic die attach Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Unitive introduces low alpha count flip chip wafer bumping
Item No:	Item Information
1488051	Unitive introduces low alpha count flip chip wafer bumping Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

New Mini-Systems program provides real-time data on similar products
Item No:	Item Information
1488052	New Mini-Systems program provides real-time data on similar products Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

SEC develops work chucks for high temperature bonding
Item No:	Item Information
1488053	SEC develops work chucks for high temperature bonding Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

SEC designs rapid heat head for flip chip bonders
Item No:	Item Information
1488054	SEC designs rapid heat head for flip chip bonders Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

New high density RF plasma source reduces contaminants to produce higher quality thin films
Item No:	Item Information
1488055	New high density RF plasma source reduces contaminants to produce higher quality thin films Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Suss launches new high end production flip chip bonder
Item No:	Item Information
1488056	Suss launches new high end production flip chip bonder Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Mini-Systems resistors qualify for Life Failure Rate R
Item No:	Item Information
1488057	Mini-Systems resistors qualify for Life Failure Rate R Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

SEC introduces motorized image sweeping, rotating die collet on bonders
Item No:	Item Information
1488058	SEC introduces motorized image sweeping, rotating die collet on bonders Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Wide range of microwave ferrites and dielectrics launched by Frequency Products
Item No:	Item Information
1488059	Wide range of microwave ferrites and dielectrics launched by Frequency Products Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Suss implements breakthrough contact printing technology
Item No:	Item Information
1488060	Suss implements breakthrough contact printing technology Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Speedier backside silicon thinning for emission imaging
Item No:	Item Information
1488061	Speedier backside silicon thinning for emission imaging Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Automated acoustic imaging of board-mounted components
Item No:	Item Information
1488062	Automated acoustic imaging of board-mounted components Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Philips Semiconductors announces a new methodology for designing next-generation silicon system chips
Item No:	Item Information
1488063	Philips Semiconductors announces a new methodology for designing next-generation silicon system chips Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Web sites

SEC expands Web site
Item No:	Item Information
1488064	SEC expands Web site Journal: Microelectronics International Vol : 17 Issue: 2 View HTML

Microtek Labs launches new Web site for UL testing, adds e-commerce to facilitate easy customer registration
Item No:	Item Information
1488065	Microtek Labs launches new Web site for UL testing, adds e-commerce to facilitate easy customer registration Journal: Microelectronics International Vol : 17 Issue: 2 View HTML