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Microelectronics International

Volume 17 Issue 3

Published: 2000 | Start Page: 7

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Articles

Articles
Article No:	Article Information:
1455614	A novel approach for hybrid optoelectronic circuits: thick-film on glass (TOG) Achim Köhler, Peter Dullenkopf (pp. 7-10) Keywords: Glass, Hybrid circuits, Thick film ArticleType: Technical paper View HTML \| View PDF (192 KB) \| Reprints & Permissions
1455615	Assessing the cost-effectiveness of integrated passives Michael Scheffler, Gerhard Tröster, Joaquin Lopez Contreras, Jürgen Hartung, Michel Menard (pp. 11-15) Keywords: Components, Cost-effectiveness, Integration, Surface mount devices ArticleType: Technical paper View HTML \| View PDF (400 KB) \| Reprints & Permissions
1455616	Effectiveness of conformal coatings on a PBGA subjected to unbiased high humidity, high temperature tests Kang Zhang, Michael Pecht (pp. 16-20) Keywords: Conformal coatings, Delamination, High temperature, Humidity, Moisture, Plastic ball grid array ArticleType: Technical paper View HTML \| View PDF (311 KB) \| Reprints & Permissions
1455617	2D-model for thermal analysis of hybrid power modules B. Radojcoic, R. Ramovic, O. Aleksic (pp. 21-26) Keywords: 2-dimensional model, Hybrid circuit ArticleType: Technical paper View HTML \| View PDF (356 KB) \| Reprints & Permissions
1455618	Investigation into the curing and thermal behavior of an epoxy-based UV curable coating in microelectronics assembly Chi Fo Tsang (pp. 27-41) Keywords: Coatings, Curing, Electrical assembly, Optimization, Thermal analysis ArticleType: Technical paper View HTML \| View PDF (384 KB) \| Reprints & Permissions

IMAPS news

IMAPS UK
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1488066	IMAPS UK Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

IMAPS Europe
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1488067	IMAPS Europe Journal: Microelectronics International Vol : 17 Issue: 3 Author(s): Pavel Mach View HTML

IMAPS announces new officers for 2001
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1488068	IMAPS announces new officers for 2001 Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

"Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium
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1488069	"Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Industry news

Joint development targets future photoresist and residue removal for low-K and copper
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1488070	Joint development targets future photoresist and residue removal for low-K and copper Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Amkor completes acquisition of three semiconductor assembly factories
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1488071	Amkor completes acquisition of three semiconductor assembly factories Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

MRSI 505 opens eutectic die attach lab facility
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1488072	MRSI 505 opens eutectic die attach lab facility Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Amkor expands IC test development capabilities; will acquire Integra Technologies
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1488073	Amkor expands IC test development capabilities; will acquire Integra Technologies Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

SEMATECH forges partnership with IMEC
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1488074	SEMATECH forges partnership with IMEC Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Atmel and CS2 agree to develop interconnect technology for multi-element integration
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1488075	Atmel and CS2 agree to develop interconnect technology for multi-element integration Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

CS2 establishes full service HF signal integrity lab
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1488076	CS2 establishes full service HF signal integrity lab Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Mintech and International Rectifier: new product line agreement
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1488077	Mintech and International Rectifier: new product line agreement Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

AMKOR expands stacked chip-scale package capacity and 3D packaging family
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1488078	AMKOR expands stacked chip-scale package capacity and 3D packaging family Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

W.C. Heraeus sells Heraeus Precision Engineering in Singapore to Jade Technologies Singapore
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1488079	W.C. Heraeus sells Heraeus Precision Engineering in Singapore to Jade Technologies Singapore Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Unitek Miyachi Corporation announces new corporate structure
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1488080	Unitek Miyachi Corporation announces new corporate structure Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Semiconductor manufacturers predict bright future for bare die
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1488081	Semiconductor manufacturers predict bright future for bare die Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Amkor and RangeStar form partnership to place advanced antennas into module packages for wireless products
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1488082	Amkor and RangeStar form partnership to place advanced antennas into module packages for wireless products Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

System-in-package prototype line opens at Amkor's Arizona facility
Item No:	Item Information
1488083	System-in-package prototype line opens at Amkor's Arizona facility Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

GSI Lumonics receives multi-unit excimer laser sales order for manufacture of Fibre Bragg Gratings
Item No:	Item Information
1488084	GSI Lumonics receives multi-unit excimer laser sales order for manufacture of Fibre Bragg Gratings Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Philips Semiconductors and TSMC announce new benchmark in lab construction
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1488085	Philips Semiconductors and TSMC announce new benchmark in lab construction Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Du Pont provides its electronics customers with the "big screen" treatment
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1488086	Du Pont provides its electronics customers with the "big screen" treatment Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Amkor technology announces factory expansion plans for the Philippines and Korea
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1488087	Amkor technology announces factory expansion plans for the Philippines and Korea Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Bovis Lend Lease acquires Project Consultants Incorporated
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1488088	Bovis Lend Lease acquires Project Consultants Incorporated Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

W.C. Heraeus acquires US-based PGP Industries
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1488089	W.C. Heraeus acquires US-based PGP Industries Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Datacon continues to grow – preparations begin for second expansion within two years
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1488090	Datacon continues to grow – preparations begin for second expansion within two years Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Du Pont focuses on information technologies
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1488091	Du Pont focuses on information technologies Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Expanded microcircuit materials information now on www.dupont.com/mcm
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1488092	Expanded microcircuit materials information now on www.dupont.com/mcm Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Pasta and present
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1488093	Pasta and present Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

CS2 breaks ground on second site – cleanroom capacity will more than triple
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1488094	CS2 breaks ground on second site – cleanroom capacity will more than triple Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

CS2 and EV Group reveal bumping technology relationship
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1488095	CS2 and EV Group reveal bumping technology relationship Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Long-term contract signed with AMS
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1488096	Long-term contract signed with AMS Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Appointments

Datacon Semiconductor Equipment GmbH appoints new European sales manager
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1488097	Datacon Semiconductor Equipment GmbH appoints new European sales manager Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Olympus' new subsidiary announces chief technology officer
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1488098	Olympus' new subsidiary announces chief technology officer Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Schoubert named International Service Manager for Quad
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1488099	Schoubert named International Service Manager for Quad Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

CS2 announces new key account director
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1488100	CS2 announces new key account director Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Martin for top post
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1488101	Martin for top post Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Datacon Semiconductor Equipment GmbH responds to rising demand from the USA, Asia and the Pacific Rim and appoints business manager
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1488102	Datacon Semiconductor Equipment GmbH responds to rising demand from the USA, Asia and the Pacific Rim and appoints business manager Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

IMAPS news

IMAPS – Diary of events
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1488103	IMAPS – Diary of events Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Exhibitions

Embedded systems – new sector at Electronica 2000
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1488104	Embedded systems – new sector at Electronica 2000 Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Seminars and training courses

Seminars and training courses
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1488105	Seminars and training courses Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

International diary

International diary
Item No:	Item Information
1488106	International diary Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

New products

Continuous web processing system unveiled by NanoVia, LP
Item No:	Item Information
1488107	Continuous web processing system unveiled by NanoVia, LP Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

PowerBGA 3.5 simplifies the design process by enabling engineers to manipulate die information
Item No:	Item Information
1488108	PowerBGA 3.5 simplifies the design process by enabling engineers to manipulate die information Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

New Vias in DBC
Item No:	Item Information
1488109	New Vias in DBC Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

MRSI-505 combines flip chip bonding and delicate GaAs handling
Item No:	Item Information
1488110	MRSI-505 combines flip chip bonding and delicate GaAs handling Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

IPL launch cost-competitive glass lid array
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1488111	IPL launch cost-competitive glass lid array Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

New pressure indicating film is 50 per cent more accurate!
Item No:	Item Information
1488112	New pressure indicating film is 50 per cent more accurate! Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H
Item No:	Item Information
1488113	12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

IMEC develops innovative fast-drying methods for single-wafer wet cleaning
Item No:	Item Information
1488114	IMEC develops innovative fast-drying methods for single-wafer wet cleaning Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Launch of new Micro-Screen
Item No:	Item Information
1488115	Launch of new Micro-Screen Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

New automatic pulltester from F&K Delvotec
Item No:	Item Information
1488116	New automatic pulltester from F&K Delvotec Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

BP Microsystems introduces high through-put Parallel Wafer Tester and Programmer, the BP-350
Item No:	Item Information
1488117	BP Microsystems introduces high through-put Parallel Wafer Tester and Programmer, the BP-350 Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

MicroJoin introduces new extended-length Ceramic Hot Bar Technology(TM) (CHBT(TM))
Item No:	Item Information
1488118	MicroJoin introduces new extended-length Ceramic Hot Bar Technology(TM) (CHBT(TM)) Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

MicroJoin introduces the VTA 63 constant force weld head for low force high precision applications
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1488119	MicroJoin introduces the VTA 63 constant force weld head for low force high precision applications Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Loctite introduces thermal shock resistant epoxy potting compound
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1488120	Loctite introduces thermal shock resistant epoxy potting compound Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Frequency shift tuning RF power generators enable ultra-thin film deposition in high-speed coating systems
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1488121	Frequency shift tuning RF power generators enable ultra-thin film deposition in high-speed coating systems Journal: Microelectronics International Vol : 17 Issue: 3 View HTML

Internet commentary

Or a rather tough worm in your little inside?
Item No:	Item Information
1488122	Or a rather tough worm in your little inside? Journal: Microelectronics International Vol : 17 Issue: 3 Author(s): Brian Ellis View HTML