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Microelectronics International

Volume 18 Issue 1

Published: 2001 | Start Page: 7

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Articles

Articles
Article No:	Article Information:
878432	Some results obtained with diffusion patterning technology Darko Belavic, Marko Hrovat, Marko Pavlin, Janez Holc (pp. 7-18) Keywords: Multichip modules, Multilayers, Thick film ArticleType: General review View HTML \| View PDF (4653 KB) \| Reprints & Permissions
1455619	Development of a reliable packaging process for flip chip on ceramics Zhaowei Zhong (pp. 19-22) Keywords: Adhesives, Assembly, Flip chip, Reliability, Yield ArticleType: General review View HTML \| View PDF (194 KB) \| Reprints & Permissions
878433	Thick film microstrip rejection filter with improved Q using overlay Sunit Rane, Vijaya Puri (pp. 23-28) Keywords: Filters, Overlay, Strip, Thick film ArticleType: General review View HTML \| View PDF (181 KB) \| Reprints & Permissions
1455620	New approach for calculation of line parameters of IC interconnects Hasan Ymeri, Bart Nauwelaers, Karen Maex, David De Roest (pp. 29-31) Keywords: Integrated circuits, Interconnection, Line parameters ArticleType: General review View HTML \| View PDF (172 KB) \| Reprints & Permissions
878434	Substrate characterization: simulation and measurement at high microwave frequencies Charles Free, Zhengrong Tian, Peter Barnwell (pp. 32-34) Keywords: Measurement, Microwaves, Substrates, Thick film ArticleType: General review View HTML \| View PDF (213 KB)
878435	Computational and experimental approach to thermal management in microelectronics and packaging Cosme Furlong, Ryszard J. Pryputniewicz (pp. 35-39) Keywords: Electronic packaging, Hybrid technique, Thermal management ArticleType: Technical paper View HTML \| View PDF (1540 KB)
878436	Effects of aspect ratio on the temperature coefficient of resistance matching and low frequency noise levels in thick film strain sensors J.K. Atkinson, R.P. Sion, Z. Zhang (pp. 40-43) Keywords: Noise levels, Screen printing, Strain analysis, Thick film ArticleType: Technical paper View HTML \| View PDF (374 KB) \| Reprints & Permissions

Editorial

Mind the gap
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1488123	Mind the gap Journal: Microelectronics International Vol : 18 Issue: 1 Author(s): John Atkinson View HTML

Internet commentary

... we have the kind of advertising we deserve[1]
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1488124	... we have the kind of advertising we deserve[1] Journal: Microelectronics International Vol : 18 Issue: 1 Author(s): Brian Ellis View HTML

IMAPS news

IMAPS Europe
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1488125	IMAPS Europe Journal: Microelectronics International Vol : 18 Issue: 1 Author(s): Professor Nihal Sinnadurai View HTML

IMAPS Poland
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1488126	IMAPS Poland Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

IMAPS UK
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1488127	IMAPS UK Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

IMAPS USA
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1488128	IMAPS USA Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

IMAPS USA. Flip Chip Technology workshop planned by IMAPS
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1488129	IMAPS USA. Flip Chip Technology workshop planned by IMAPS Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

IMAPS – Diary of events
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1488130	IMAPS – Diary of events Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Industry news

Middlesex/Tec-Sem alliance
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1488131	Middlesex/Tec-Sem alliance Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

US$160 million investment in joint venture wafer lab in Germany
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1488132	US$160 million investment in joint venture wafer lab in Germany Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

MRSI 505 opens eutectic die attach lab facility
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1488133	MRSI 505 opens eutectic die attach lab facility Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Ferro Electronic Materials initiates major expansion in New York
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1488134	Ferro Electronic Materials initiates major expansion in New York Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

MRSI opens new facility, major growth expansion
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1488135	MRSI opens new facility, major growth expansion Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

SMT/ES+S/HYBRID exhibition changes name
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1488136	SMT/ES+S/HYBRID exhibition changes name Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Semi Dice selected as exclusive US distributor of international rectifier commercial die and wafer products
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1488137	Semi Dice selected as exclusive US distributor of international rectifier commercial die and wafer products Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

MCE launches solution to ASIC and IC obsolescence
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1488138	MCE launches solution to ASIC and IC obsolescence Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Amkor/Anam and Texas Instruments extend cooperation on deep submicron process technology for advanced semiconductor manufacturing
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1488139	Amkor/Anam and Texas Instruments extend cooperation on deep submicron process technology for advanced semiconductor manufacturing Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Amkor adds latest packaging equipment to advanced prototype development lab
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1488140	Amkor adds latest packaging equipment to advanced prototype development lab Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Loctite acquires Power Devices Inc.
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1488141	Loctite acquires Power Devices Inc. Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

New £7.5 million optoelectronics foundry and research centre spearheads Scotland's drive in global communications market
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1488142	New £7.5 million optoelectronics foundry and research centre spearheads Scotland's drive in global communications market Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Philips and LG join forces in display components activities
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1488143	Philips and LG join forces in display components activities Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

IMEC announces MEMS design and technology agreement with INTI-CITEI, Argentina
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1488144	IMEC announces MEMS design and technology agreement with INTI-CITEI, Argentina Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Thomson-CSF Laser Diodes and Alcatel Optronics Division announce partnership for manufacturing materials for high power lasers
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1488145	Thomson-CSF Laser Diodes and Alcatel Optronics Division announce partnership for manufacturing materials for high power lasers Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Multimillion-euro orders from Asia and the USA lead to massive sales surge at Datacon
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1488146	Multimillion-euro orders from Asia and the USA lead to massive sales surge at Datacon Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Free flip chip information
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1488147	Free flip chip information Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Appointments

Brewin joins The National Physical Laboratory
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1488148	Brewin joins The National Physical Laboratory Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Ferro Electronic Materials names Hodder North American Sales Manager, East Region
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1488149	Ferro Electronic Materials names Hodder North American Sales Manager, East Region Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Gerry Waldron appointed Applications Engineering Manager at MRSI Group
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1488150	Gerry Waldron appointed Applications Engineering Manager at MRSI Group Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Datacon Semiconductor Equipment GmbH appoints new head of product management
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1488151	Datacon Semiconductor Equipment GmbH appoints new head of product management Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Seminars and training courses

Advanced Technology Workshop on Ceramic Technologies for Microwave
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1488152	Advanced Technology Workshop on Ceramic Technologies for Microwave Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

EuroSimE 2001 – 2nd International Conference
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1488153	EuroSimE 2001 – 2nd International Conference Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Conferences

Call for papers
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1488154	Call for papers Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

InterPACK '01®
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1488155	InterPACK '01® Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Advanced packaging technologies in the electronics industry
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1488156	Advanced packaging technologies in the electronics industry Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

International diary

International diary
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1488157	International diary Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

New products

LCD assembly gains through-put increase with Micro Join 4200 Series Bonders
Item No:	Item Information
1488158	LCD assembly gains through-put increase with Micro Join 4200 Series Bonders Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Philips Semiconductors has new angle on automotive sensing
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1488159	Philips Semiconductors has new angle on automotive sensing Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Microscope ergonomics
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1488160	Microscope ergonomics Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Loctite introduces dam and fill products for encapsulation applications
Item No:	Item Information
1488161	Loctite introduces dam and fill products for encapsulation applications Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

New state-of-the-art chip scale package EMI I RFI filter arrays
Item No:	Item Information
1488162	New state-of-the-art chip scale package EMI I RFI filter arrays Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Technology news from Philips Semiconductors
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1488163	Technology news from Philips Semiconductors Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

MCE launches low risk, low customised chips for measurement and sensing
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1488164	MCE launches low risk, low customised chips for measurement and sensing Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

A6 S Microwave LTCC materials system for high frequency low cost applications
Item No:	Item Information
1488165	A6 S Microwave LTCC materials system for high frequency low cost applications Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Ferro Electronic Materials launches new RE 88 series of "thrifted" thick film surge resistor materials
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1488166	Ferro Electronic Materials launches new RE 88 series of "thrifted" thick film surge resistor materials Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Next-generation Laser Probe System for flip chips
Item No:	Item Information
1488167	Next-generation Laser Probe System for flip chips Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

New Load Port is the first in the industry to meet new SEMI automation standard
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1488168	New Load Port is the first in the industry to meet new SEMI automation standard Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Precision thin film resistors now available in chip scale format
Item No:	Item Information
1488169	Precision thin film resistors now available in chip scale format Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Amkor is expanding LGA package offerings
Item No:	Item Information
1488170	Amkor is expanding LGA package offerings Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Microstamping and pump dispensing combined for ultra fine conductive epoxy dots
Item No:	Item Information
1488171	Microstamping and pump dispensing combined for ultra fine conductive epoxy dots Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Bonder attachment for reworking underfilled flip chips
Item No:	Item Information
1488172	Bonder attachment for reworking underfilled flip chips Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

New cost-effective LTCC materials from Ferro
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1488173	New cost-effective LTCC materials from Ferro Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Impressive palladium reductions in new RE 88-Series surge resistor materials
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1488174	Impressive palladium reductions in new RE 88-Series surge resistor materials Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Book review

An Engineer's Handbook of Encapsulation and Underfill Technology
Item No:	Item Information
1488175	An Engineer's Handbook of Encapsulation and Underfill Technology Journal: Microelectronics International Vol : 18 Issue: 1 Author(s): Professor Nihal Sinnadurai View HTML

Publications

The power of amplifier design
Item No:	Item Information
1488176	The power of amplifier design Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Reports

Hybrid circuit and MCM suppliers fight for a share of a e1.1 billion European market
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1488177	Hybrid circuit and MCM suppliers fight for a share of a e1.1 billion European market Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

TechSearch International analyzes market surge in high density interconnect flex circuits
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1488178	TechSearch International analyzes market surge in high density interconnect flex circuits Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

One billion cellular handset market by 2004
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1488179	One billion cellular handset market by 2004 Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

Market analysis and technology trends
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1488180	Market analysis and technology trends Journal: Microelectronics International Vol : 18 Issue: 1 View HTML

High penetration and advancing technology in wireless industry necessitate outsourcing
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1488181	High penetration and advancing technology in wireless industry necessitate outsourcing Journal: Microelectronics International Vol : 18 Issue: 1 View HTML