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Microelectronics International

Volume 18 Issue 2

Published: 2001 | Start Page: 6

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Articles

Articles
Article No:	Article Information:
1455621	Energy-recovery low power C-PAL flip-flop design H.H. Wong, K.T. Lau (pp. 6-11) Keywords: Energy, Flip flops ArticleType: Technical paper View HTML \| View PDF (1201 KB) \| Reprints & Permissions
1455622	Investigations of assembly properties of conductive layers in LTCC circuits A. Bochenek, B. Bober, A. Dziedzic, L. Golonka (pp. 11-15) Keywords: Ceramics, Conductive layers, Electronics assembly ArticleType: Technical paper View HTML \| View PDF (2260 KB) \| Reprints & Permissions
878437	Effects of the pre-neutron irradiation on VDMOSFET sensitivity to heavy ions C. Salame, A. Hoffmann, F. Pelanchon, P. Mialhe, J.P. Charles (pp. 16-20) Keywords: Destruction, Hardener, Radiation, Sensitivity ArticleType: Technical paper View HTML \| View PDF (1242 KB) \| Reprints & Permissions
1455623	Measurement techniques for the evaluation of thick-film materials used in wireless applications Zhengrong Tian, Charles Free (pp. 21-25) Keywords: Measurement, Thick film, Wireless technology ArticleType: Technical paper View HTML \| View PDF (677 KB) \| Reprints & Permissions
878438	An investigation of the factors influencing stability in continuously-powered screen-printed amperometric dissolved oxygen sensors J.K. Atkinson, W.V. Glasspool (pp. 26-31) Keywords: Membranes, Oxygen, Screen-printing, Sensors, Thick film ArticleType: Technical paper View HTML \| View PDF (1000 KB) \| Reprints & Permissions
878439	The use of thick print copper and silver conductors for power applications David K. Anderson, John Oleksyn, Martin Batson, John Cocker (pp. 31-34) Keywords: Conductors, Copper, Power, Silver, Thick film ArticleType: Technical paper View HTML \| View PDF (336 KB)

IMAPS news

IMAPS Brazil. IMAPS issues call for papers for IMAPS Brazil 2001
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1488182	IMAPS Brazil. IMAPS issues call for papers for IMAPS Brazil 2001 Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS Nordic 38th Annual Conference
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1488183	IMAPS Nordic 38th Annual Conference Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS Russia plans technical, organizational workshop
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1488184	IMAPS Russia plans technical, organizational workshop Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS USA. IMAPS moves to new permanent world headquarters in Washington, DC
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1488185	IMAPS USA. IMAPS moves to new permanent world headquarters in Washington, DC Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS USA. "Everything Flip Chip" is focus of IMAPS' 1st conference and exhibition on Flip Chip Technology in Austin
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1488186	IMAPS USA. "Everything Flip Chip" is focus of IMAPS' 1st conference and exhibition on Flip Chip Technology in Austin Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS USA. Optoelectronics Packaging Advanced Technology Workshop Scheduled by IMAPS
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1488187	IMAPS USA. Optoelectronics Packaging Advanced Technology Workshop Scheduled by IMAPS Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS USA. IMAPS 2001 heating up; Photonics, Flip Chip, Microwave, tracks are popular symposium topics
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1488188	IMAPS USA. IMAPS 2001 heating up; Photonics, Flip Chip, Microwave, tracks are popular symposium topics Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS USA. Dr Jerry Sergent appointed IMAPS' technical journal editor
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1488189	IMAPS USA. Dr Jerry Sergent appointed IMAPS' technical journal editor Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMAPS – Diary of events
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1488190	IMAPS – Diary of events Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Industry news

Celestica completes acquisition of Motorola facilities
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1488191	Celestica completes acquisition of Motorola facilities Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Datacon's 4-million-euro investment: new building ready after just 10 months
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1488192	Datacon's 4-million-euro investment: new building ready after just 10 months Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Amkor Technology enters Taiwan semiconductor market, acquiring two established assembly and test companies
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1488193	Amkor Technology enters Taiwan semiconductor market, acquiring two established assembly and test companies Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Invest in Sweden Agency launches Socware in the UK
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1488194	Invest in Sweden Agency launches Socware in the UK Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Infineon Technologies extends its wide-ranging research collaboration with IMEC on basic technologies for next semiconductor generations
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1488195	Infineon Technologies extends its wide-ranging research collaboration with IMEC on basic technologies for next semiconductor generations Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

"Mozaik" opens office in Russia
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1488196	"Mozaik" opens office in Russia Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

IMEC and Sony sign research collaboration programs on fundamental technologies for next-generation semiconductor systems and devices
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1488197	IMEC and Sony sign research collaboration programs on fundamental technologies for next-generation semiconductor systems and devices Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Hitachi joins IMEC's high-k industrial affiliation program
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1488198	Hitachi joins IMEC's high-k industrial affiliation program Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

ERA Technology ties up with European Microwave week 2001
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1488199	ERA Technology ties up with European Microwave week 2001 Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Contax announce new UK & Ireland partnership with ESSEMTEC
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1488200	Contax announce new UK & Ireland partnership with ESSEMTEC Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

General Hybrid moves across Banbury
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1488201	General Hybrid moves across Banbury Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

PartMiner announces agreement with Yahoo! industry marketplaces
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1488202	PartMiner announces agreement with Yahoo! industry marketplaces Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Labtech showcases MMIC Capability
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1488203	Labtech showcases MMIC Capability Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

TheSupply and KeyAssets.com create e-marketplace for surplus semiconductor equipment
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1488204	TheSupply and KeyAssets.com create e-marketplace for surplus semiconductor equipment Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Appointments

Philips Semiconductors appoints Indro Mukerjee to drive global marketing and sales
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1488205	Philips Semiconductors appoints Indro Mukerjee to drive global marketing and sales Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Conferences and exhibitions

13th European Conference and Exhibition
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1488206	13th European Conference and Exhibition Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Third Annual APEX Conference on Electronics Manufacturing
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1488207	Third Annual APEX Conference on Electronics Manufacturing Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

International diary

International diary
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1488208	International diary Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

New products

New automatic ribbon bonder offers industry's fastest wire cycles
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1488209	New automatic ribbon bonder offers industry's fastest wire cycles Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

New VCSEL alignment features added to SEC laser bonders
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1488210	New VCSEL alignment features added to SEC laser bonders Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

New Z motion control design permits precisely controlled die bond loads
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1488211	New Z motion control design permits precisely controlled die bond loads Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

New paste die attach adhesive designed for lead-free initiatives
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1488212	New paste die attach adhesive designed for lead-free initiatives Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Festo pneumatic drives reduce contamination from semiconductor processing equipment
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1488213	Festo pneumatic drives reduce contamination from semiconductor processing equipment Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Amkor Technology nears qualification of environmentally friendly material alternatives for ball grid array packages
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1488214	Amkor Technology nears qualification of environmentally friendly material alternatives for ball grid array packages Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

MCE provides electronics protection against nuclear blast
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1488215	MCE provides electronics protection against nuclear blast Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Introducing the technique for the dynamic hardness measurement of thin films and coatings
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1488216	Introducing the technique for the dynamic hardness measurement of thin films and coatings Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Labtech introduces Universal finish for MMIC packaging
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1488217	Labtech introduces Universal finish for MMIC packaging Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

MCE provides customised power modules
Item No:	Item Information
1488218	MCE provides customised power modules Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Amkor Technology stacks die 3-high in IC packages; saves money for system designers and manufacturers
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1488219	Amkor Technology stacks die 3-high in IC packages; saves money for system designers and manufacturers Journal: Microelectronics International Vol : 18 Issue: 2 View HTML

Internet commentary

Then I saw that there was a way to Hell, even from the Gates of heaven [1]
Item No:	Item Information
1488220	Then I saw that there was a way to Hell, even from the Gates of heaven [1] Journal: Microelectronics International Vol : 18 Issue: 2 Author(s): Brian Ellis View HTML