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Microelectronics International

Volume 18 Issue 3

Published: 2001 | Start Page: 9

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Articles

Articles
Article No:	Article Information:
1455624	Thermal time constants of various substrates of integrated circuits Andrzej Kos (pp. 9-14) Keywords: Integrated circuits, Thermal testing ArticleType: Technical paper View HTML \| View PDF (391 KB) \| Reprints & Permissions
878440	Flip chip assemblies using gold bumps and adhesive Zhaowei Zhong (pp. 15-19) Keywords: Adhesives, Bonding, Flip chip, Reliability ArticleType: Technical paper View HTML \| View PDF (257 KB) \| Reprints & Permissions
878441	The impact of lead-free soldering on electronics packages L. Yang, J.B. Bernstein, K. Chung (pp. 20-26) Keywords: Crack propagation, Delamination, Lead-free soldering, Moisture ArticleType: Technical paper View HTML \| View PDF (1286 KB) \| Reprints & Permissions
1455625	The evaluation of different base materials for high density flip chip on flex applications Petteri Palm, Jarmo Määttänen, Alain Picault, Yannick De Maquillé (pp. 27-31) Keywords: Bonding, Flip chip ArticleType: General review View HTML \| View PDF (585 KB) \| Reprints & Permissions
1455626	Gravure offset printing development for fine line thick film circuits Juha Hagberg, Marko Pudas, Seppo Leppävuori, Ken Elsey, Alison Logan (pp. 32-35) Keywords: Printing, Thick film ArticleType: Technical paper View HTML \| View PDF (969 KB) \| Reprints & Permissions
878442	High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D) Eric Beyne, Rita Van Hoof, Tomas Webers, Steven Brebels, Stéphanie Rossi, François Lechleiter, Marianna Di Ianni, Andreas Ostmann (pp. 36-42) Keywords: Interconnection, Laminated structures, Thin-film ArticleType: Technical paper View HTML \| View PDF (2793 KB) \| Reprints & Permissions

Editorial

Editorial
Item No:	Item Information
1488221	Editorial Journal: Microelectronics International Vol : 18 Issue: 3 Author(s): John Atkinson View HTML

Note from the publisher

Note from the publisher
Item No:	Item Information
1488222	Note from the publisher Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

IMAPS news

IMAPS USA. IMAPS optoelectronics packaging advanced technology workshop program announced
Item No:	Item Information
1488223	IMAPS USA. IMAPS optoelectronics packaging advanced technology workshop program announced Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

IMAPS USA. Fall MMRC meeting to focus on optoelectronics packaging
Item No:	Item Information
1488224	IMAPS USA. Fall MMRC meeting to focus on optoelectronics packaging Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

IMAPS UK announce advance information on MicroTech 2002 Conference and Exhibition
Item No:	Item Information
1488225	IMAPS UK announce advance information on MicroTech 2002 Conference and Exhibition Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Call for papers
Item No:	Item Information
1488226	Call for papers Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Industry news

Intertronics named UK distributor for Thermoset
Item No:	Item Information
1488227	Intertronics named UK distributor for Thermoset Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

ESI establishes Technical Support Centre in Europe for customers
Item No:	Item Information
1488228	ESI establishes Technical Support Centre in Europe for customers Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Institute receives S.E.C. bonder for manufacturing classwork
Item No:	Item Information
1488229	Institute receives S.E.C. bonder for manufacturing classwork Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Celestica announces five-year strategic manufacturing agreement with Lucent worth up to US$10 billion dollars
Item No:	Item Information
1488230	Celestica announces five-year strategic manufacturing agreement with Lucent worth up to US$10 billion dollars Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

IMEC and LUC license in-situ test methodology to XPEQT
Item No:	Item Information
1488231	IMEC and LUC license in-situ test methodology to XPEQT Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Scientists at Lucent Technologies' Bell Labs create the world's first plastic superconductor
Item No:	Item Information
1488232	Scientists at Lucent Technologies' Bell Labs create the world's first plastic superconductor Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Osprey controlled expansion alloys (Osprey CE alloys) – new Web site
Item No:	Item Information
1488233	Osprey controlled expansion alloys (Osprey CE alloys) – new Web site Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Appointments

Asymtek names Lisa Ryan general manager for Europe
Item No:	Item Information
1488234	Asymtek names Lisa Ryan general manager for Europe Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Personnel changes at F&K Delvotec
Item No:	Item Information
1488235	Personnel changes at F&K Delvotec Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Stan Renals joins Indium as product manager
Item No:	Item Information
1488236	Stan Renals joins Indium as product manager Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Conference reports

PN launch event report
Item No:	Item Information
1488237	PN launch event report Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Micro System Technologies 2001 International Conference & Exhibition on Micro Electro, Opto, Mechanical Systems and Components
Item No:	Item Information
1488238	Micro System Technologies 2001 International Conference & Exhibition on Micro Electro, Opto, Mechanical Systems and Components Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

International diary

International diary
Item No:	Item Information
1488239	International diary Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

New products

Siemens introduces the world's smallest wafer identification system
Item No:	Item Information
1488240	Siemens introduces the world's smallest wafer identification system Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

New developments from F&K Delvotec
Item No:	Item Information
1488241	New developments from F&K Delvotec Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Fully automated Techcon TS3030 dispense robot
Item No:	Item Information
1488242	Fully automated Techcon TS3030 dispense robot Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Dexter introduces flip chip underfill encapsulant for use in 260°C reflow, no lead applications
Item No:	Item Information
1488243	Dexter introduces flip chip underfill encapsulant for use in 260°C reflow, no lead applications Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Sonoscan imaging permits bonded wafer rework
Item No:	Item Information
1488244	Sonoscan imaging permits bonded wafer rework Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Intercept Technology brings design freedom to Mentor users
Item No:	Item Information
1488245	Intercept Technology brings design freedom to Mentor users Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Reports

European wafer manufacturers
Item No:	Item Information
1488246	European wafer manufacturers Journal: Microelectronics International Vol : 18 Issue: 3 View HTML

Internet commentary

… humdrum issues like the environment[1]
Item No:	Item Information
1488247	… humdrum issues like the environment[1] Journal: Microelectronics International Vol : 18 Issue: 3 View HTML