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Microelectronics International

Volume 19 Issue 1

Published: 2002 | Start Page: 11

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Articles

Articles
Article No:	Article Information:
878443	On the frequency-dependent line capacitance and conductance of on-chip interconnects on lossy silicon substrate H. Ymeri, B. Nauwelaers, K. Maex (pp. 11-18) Keywords: Interconnection, Multiconductor transmissions ArticleType: Research paper View HTML \| View PDF (418 KB) \| Reprints & Permissions
1455627	N-channel power MOSFET for fast neutron detection C. Salame, P. Mialhe, J.-P. Charles, A. Khoury (pp. 19-22) Keywords: Integrated circuits, Semiconductors ArticleType: Research paper View HTML \| View PDF (267 KB) \| Reprints & Permissions
878444	The investigation of the capillary flow of underfill materials C.Y. Huang (pp. 23-29) Keywords: Encapsulation, Flip chip, Underfill ArticleType: Research paper View HTML \| View PDF (336 KB) \| Reprints & Permissions
878445	Rapid production of microwave packaging in silicon–aluminium by thin-shell electroforming C. Bocking, D.M. Jacobson, A.E.W. Rennie (pp. 30-32) Keywords: Electronics assembly, Rapid prototyping ArticleType: Research paper View HTML \| View PDF (403 KB) \| Reprints & Permissions
878446	Observations on the characteristics of thick film k strain sensors fabricated on steel substratesThis paper is based on a poster presentation made at the IMAPS 2001 Symposium, Baltimore. Yulan Zheng, John Atkinson, Zhige Zhang, Russ Sion (pp. 33-37) Keywords: Steel, Temperature, Thick film ArticleType: Research paper View HTML \| View PDF (422 KB) \| Reprints & Permissions

Editorial

Editorial
Item No:	Item Information
1488248	Editorial Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Note from the publisher

How to get the best from your Emerald subscription
Item No:	Item Information
1488249	How to get the best from your Emerald subscription Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

IMAPS news

MicroTech 2002 Programme
Item No:	Item Information
1488250	MicroTech 2002 Programme Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

IMAPS-UK AGM 17:30 in the Stanley Suite
Item No:	Item Information
1488251	IMAPS-UK AGM 17:30 in the Stanley Suite Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

IMAPS Europe – Cracow
Item No:	Item Information
1488252	IMAPS Europe – Cracow Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Dr. Peter Barnwell New 2002 IMAPS President-elect
Item No:	Item Information
1488253	Dr. Peter Barnwell New 2002 IMAPS President-elect Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

IMAPS Announces New Executive Council Members
Item No:	Item Information
1488254	IMAPS Announces New Executive Council Members Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

IMAPS Plans IMAPS-ISRAEL 2002 Conference
Item No:	Item Information
1488255	IMAPS Plans IMAPS-ISRAEL 2002 Conference Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Advanced Technology Workshop on Passive Integration
Item No:	Item Information
1488256	Advanced Technology Workshop on Passive Integration Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Pan Pacific Microelectronics Symposium Preliminary Program Announced
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1488257	Pan Pacific Microelectronics Symposium Preliminary Program Announced Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Industry news

CoorsTek lays off about 300 workers and posts a net loss
Item No:	Item Information
1488258	CoorsTek lays off about 300 workers and posts a net loss Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Bell Labs scientists create high-temperature organic superconductor
Item No:	Item Information
1488259	Bell Labs scientists create high-temperature organic superconductor Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

IMEC opens business development office in China
Item No:	Item Information
1488260	IMEC opens business development office in China Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Appointments

New man at the helm for X-Tek
Item No:	Item Information
1488261	New man at the helm for X-Tek Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Radiant technology corporation names new marketing head
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1488262	Radiant technology corporation names new marketing head Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Integrated Photomatrix announces new MD to take the helm
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1488263	Integrated Photomatrix announces new MD to take the helm Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Exhibitions/seminars

FiberComm - new European platform for optical information and communications technology
Item No:	Item Information
1488264	FiberComm - new European platform for optical information and communications technology Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

A range of new chemicals
Item No:	Item Information
1488265	A range of new chemicals Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

International diary

International diary
Item No:	Item Information
1488266	International diary Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

New products

New system offers zero-stress coatings in MEMS and nano-fabrication
Item No:	Item Information
1488267	New system offers zero-stress coatings in MEMS and nano-fabrication Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

MRSI introduces micro-stamping with automatic tool changer
Item No:	Item Information
1488268	MRSI introduces micro-stamping with automatic tool changer Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

New convertible head flip chip bonder
Item No:	Item Information
1488269	New convertible head flip chip bonder Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

IC-SCAN DE tracks MSDs for double side reflow boards
Item No:	Item Information
1488270	IC-SCAN DE tracks MSDs for double side reflow boards Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Professional imaging with the new compact digital camera 0P12 from Olympus
Item No:	Item Information
1488271	Professional imaging with the new compact digital camera 0P12 from Olympus Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

In-situ UV cure automates assembly of optoelectronic packages
Item No:	Item Information
1488272	In-situ UV cure automates assembly of optoelectronic packages Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

New flip chip underfill offers high compatibility with no-clean fluxes
Item No:	Item Information
1488273	New flip chip underfill offers high compatibility with no-clean fluxes Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Semiconductor characterization software provides simultaneous HF and quasistatic C-V measurements
Item No:	Item Information
1488274	Semiconductor characterization software provides simultaneous HF and quasistatic C-V measurements Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

BTUS new Pyramax reflow systems lowers cost of ownership
Item No:	Item Information
1488275	BTUS new Pyramax reflow systems lowers cost of ownership Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Publications

Photonic packaging – exciting opportunities in difficult times
Item No:	Item Information
1488276	Photonic packaging – exciting opportunities in difficult times Journal: Microelectronics International Vol : 19 Issue: 1 View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1488277	Internet commentary Journal: Microelectronics International Vol : 19 Issue: 1 Author(s): Brian Ellis View HTML