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Microelectronics International

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Articles

Articles

Article No:	Article Information:
878447	Tools for evaluation of electrical performance of chip-on-board devices A. Cordery, N. Kilbey, N. Suthiwongsunthorn (pp. 8-12) Keywords: Flip chip, Tests ArticleType: Research Paper View HTML | View PDF (573 KB) | Reprints & Permissions
878448	Electrical characterisation of BGA package for RF applications Arun Chandrasekhar, Eric Beyne, Walter De Raedt, Bart Nauwelaers, Tania Van Bever (pp. 13-18) Keywords: Interconnection, Plastic ball grid array ArticleType: Research paper View HTML | View PDF (856 KB) | Reprints & Permissions
878449	Thick film symmetrical EMI LC cells O. Aleksic, V. Desnica, M. Lukovic, Lj.D. Živanov (pp. 19-25) Keywords: Electronics, Thick film ArticleType: Research Paper View HTML | View PDF (806 KB) | Reprints & Permissions
878450	Effects of material parameters and processing conditions on high voltage sensitivity of polymer thick film resistors Y. Srinivasa Rao, M. Satyam (pp. 26-31) Keywords: High voltage, Resistors ArticleType: Case study View HTML | View PDF (952 KB) | Reprints & Permissions
878451	No flow underfill: additional reliability and failure mode analysis Michael A. Previti, Peter Ongley (pp. 32-37) Keywords: Flip chip, Underfill ArticleType: Research Paper View HTML | View PDF (505 KB) | Reprints & Permissions
878452	The effects of aged Cu-Al intermetallics to electrical resistance in microelectronics packaging Tan Chee Wei, Abdul Razak Daud (pp. 38-43) Keywords: Aluminium, Bonding, Copper, Diffusion, Intermetallics, Resistance ArticleType: Research Paper View HTML | View PDF (299 KB) | Reprints & Permissions

IMAPS news

IMAPS – Europe Cracow, Poland, 16-18 June 2002

Item No:	Item Information
1488278	IMAPS – Europe Cracow, Poland, 16-18 June 2002 Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

IMAPS Nordic

Item No:	Item Information
1488279	IMAPS Nordic Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

IMAPS USA

Item No:	Item Information
1488280	IMAPS USA Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

IMAPS Appoints Steve Capp Treasurer

Item No:	Item Information
1488281	IMAPS Appoints Steve Capp Treasurer Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

IMAPS Ceramic Technologies Workshop provides glimpse into the future

Item No:	Item Information
1488282	IMAPS Ceramic Technologies Workshop provides glimpse into the future Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

IMAPS Advanced Technology Workshop on Passive Integration

Item No:	Item Information
1488283	IMAPS Advanced Technology Workshop on Passive Integration Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Flip Chip 2002 conference and exhibition offers "latest and greatest" in flip chip technology

Item No:	Item Information
1488284	Flip Chip 2002 conference and exhibition offers "latest and greatest" in flip chip technology Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

IPC issues call for participation for optoelectronics conference

Item No:	Item Information
1488285	IPC issues call for participation for optoelectronics conference Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Industry news

Datacon phases out collaboration with Kulicke & Soffa

Item No:	Item Information
1488286	Datacon phases out collaboration with Kulicke & Soffa Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Kulicke & Soffa and Amkor Technology announce Letter Of Intent for 200 wire bonders

Item No:	Item Information
1488287	Kulicke & Soffa and Amkor Technology announce Letter Of Intent for 200 wire bonders Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Coorstek gets invision tech pac

Item No:	Item Information
1488288	Coorstek gets invision tech pac Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Appointments

Bruno Miquel appointed product manager at MRSI

Item No:	Item Information
1488289	Bruno Miquel appointed product manager at MRSI Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

International Diary

International Diary

Item No:	Item Information
1488290	International Diary Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

New products

KS 75: Post-reflow solder joint inspection with inherently low false calls

Item No:	Item Information
1488291	KS 75: Post-reflow solder joint inspection with inherently low false calls Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

New bonder offers sub-micron alignment

Item No:	Item Information
1488292	New bonder offers sub-micron alignment Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Industry "First" – automatic stamping tool changing

Item No:	Item Information
1488293	Industry "First" – automatic stamping tool changing Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

MRSI announces

Item No:	Item Information
1488294	MRSI announces Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Scribe and break 100-3 for delicate wafers

Item No:	Item Information
1488295	Scribe and break 100-3 for delicate wafers Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Philips Semiconductors reinvents radio architecture

Item No:	Item Information
1488296	Philips Semiconductors reinvents radio architecture Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Book review

Environment-friendly Electronics: Lead-free Technology

Item No:	Item Information
1488297	Environment-friendly Electronics: Lead-free Technology Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Company profile

Company Profile – IPL, Dorchester, UK

Item No:	Item Information
1488298	Company Profile – IPL, Dorchester, UK Journal: Microelectronics International Vol : 19 Issue: 2 View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1488299	Internet commentary Journal: Microelectronics International Vol : 19 Issue: 2 View HTML