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Microelectronics International

Volume 19 Issue 3

Published: 2002 | Start Page: 9

Special Issue: Packaging technology for sensors and MEMS

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Articles

Articles
Article No:	Article Information:
878453	Packaging technologies for pressure-sensors Marko Pavlin, Darko Belavic, Marina Santo Zarnik, Marko Hrovat, Matej Mozek (pp. 9-13) Keywords: Packaging, Pressure, Printed circuit board, Sensors, Thick film ArticleType: Research Paper View HTML \| View PDF (537 KB) \| Reprints & Permissions
1455628	Laser treatment of LTCC for 3D structures and elements fabrication Jaroslaw Kita, Andrzej Dziedzic, Leszek J. Golonka, Tomasz Zawada (pp. 14-18) Keywords: 3D, Fabrication, Lasers ArticleType: Research Paper View HTML \| View PDF (1071 KB) \| Reprints & Permissions
1455629	Using LTCC for microsystems Torsten Thelemann, Heiko Thust, Michael Hintz (pp. 19-23) Keywords: 3D, Lasers, Microfabrication ArticleType: Research Paper View HTML \| View PDF (678 KB) \| Reprints & Permissions
878454	On the zero offset stability of thick film strain gauges Yulan Zheng, John Atkinson, Russ Sion (pp. 24-29) Keywords: Stability, Strain, Temperature, Thick film ArticleType: Research Paper View HTML \| View PDF (495 KB) \| Reprints & Permissions
1455630	Effect of gamma radiation onto the properties of TeO thin films K. Arshak, O. Korostynska (pp. 30-34) Keywords: Radiation, Thin films ArticleType: General review View HTML \| View PDF (261 KB) \| Reprints & Permissions

Editorial

Special issue – packaging technology for sensors and MEMS
Item No:	Item Information
1488300	Special issue – packaging technology for sensors and MEMS Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Literati Club

Awards for Excellence
Item No:	Item Information
1488301	Awards for Excellence Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Note from the publisher

Note from the publisher
Item No:	Item Information
1488302	Note from the publisher Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

IMAP news

EMPC 2003 invites abstracts of unpublished work
Item No:	Item Information
1488303	EMPC 2003 invites abstracts of unpublished work Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

IMAPS announces program for Nano Systems workshop
Item No:	Item Information
1488304	IMAPS announces program for Nano Systems workshop Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

IMAPS topical workshop on Optoelectronics Packaging and MOEMS
Item No:	Item Information
1488305	IMAPS topical workshop on Optoelectronics Packaging and MOEMS Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

IMAPS ceramic workshop paves way for ceramic interconnect technology conference in 2003
Item No:	Item Information
1488306	IMAPS ceramic workshop paves way for ceramic interconnect technology conference in 2003 Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

IMAPS topical workshop schedule, content announced
Item No:	Item Information
1488307	IMAPS topical workshop schedule, content announced Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

IMAPS announces biomedical electronics advanced technology workshop (ATW)
Item No:	Item Information
1488308	IMAPS announces biomedical electronics advanced technology workshop (ATW) Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

MMRC announces free marketing forum at IMAPS 2002 symposium
Item No:	Item Information
1488309	MMRC announces free marketing forum at IMAPS 2002 symposium Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

2003 Conference on Ceramic Interconnect Technology announced
Item No:	Item Information
1488310	2003 Conference on Ceramic Interconnect Technology announced Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Thermal & mechanical simulation and experiments in micro-electronics and micro-systems
Item No:	Item Information
1488311	Thermal & mechanical simulation and experiments in micro-electronics and micro-systems Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Industry news

IFR Systems, Inc. agrees to be acquired by Aeroflex Incorporated
Item No:	Item Information
1488312	IFR Systems, Inc. agrees to be acquired by Aeroflex Incorporated Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

ESEC wins large order in Korea
Item No:	Item Information
1488313	ESEC wins large order in Korea Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

SUSS MicroTec signs representative agreement with Simac Masic for Probe Systems
Item No:	Item Information
1488314	SUSS MicroTec signs representative agreement with Simac Masic for Probe Systems Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Clear MEMS standards needed for future IC manufacturing
Item No:	Item Information
1488315	Clear MEMS standards needed for future IC manufacturing Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

IMEC announces industrial affiliation program
Item No:	Item Information
1488316	IMEC announces industrial affiliation program Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Bell Labs claims semiconductor breakthrough
Item No:	Item Information
1488317	Bell Labs claims semiconductor breakthrough Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Micron technology opts for mintech semiconductors
Item No:	Item Information
1488318	Micron technology opts for mintech semiconductors Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Appointments

Gheorghe-Catalin Pascariu Sales Manager for Asia Pacific Region
Item No:	Item Information
1488319	Gheorghe-Catalin Pascariu Sales Manager for Asia Pacific Region Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

New Head of Electronics and IT appointed
Item No:	Item Information
1488320	New Head of Electronics and IT appointed Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Conference report

Earth Technologies Forum, 2002
Item No:	Item Information
1488321	Earth Technologies Forum, 2002 Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS Author(s): Brian Ellis View HTML

International diary

International diary
Item No:	Item Information
1488322	International diary Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

New products

GSI Lumonics announces new Trimsmart ™ laser trim operating software
Item No:	Item Information
1488323	GSI Lumonics announces new Trimsmart ™ laser trim operating software Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

DEK-J2002 from PESL – thick film printing – the new generation
Item No:	Item Information
1488324	DEK-J2002 from PESL – thick film printing – the new generation Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Hybrid lids fabricated and plated on same site
Item No:	Item Information
1488325	Hybrid lids fabricated and plated on same site Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Low temp glass-to-metal preform seals for optic fibres
Item No:	Item Information
1488326	Low temp glass-to-metal preform seals for optic fibres Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

"Feather touch" multi-tool head enhances throughput for die bonding
Item No:	Item Information
1488327	"Feather touch" multi-tool head enhances throughput for die bonding Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

GSI Lumonics introduces the TrimSmart ™ LT1100
Item No:	Item Information
1488328	GSI Lumonics introduces the TrimSmart ™ LT1100 Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Conti Temic microelectronic starts mass production of EGR control units
Item No:	Item Information
1488329	Conti Temic microelectronic starts mass production of EGR control units Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1488330	Internet commentary Journal: Microelectronics International Vol : 19 Issue: 3 Special Issue: Packaging technology for sensors and MEMS Author(s): Brian Ellis View HTML