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Microelectronics International

Volume 21 Issue 2

Published: 2004 | Start Page: 10

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Articles

Articles
Article No:	Article Information:
878473	The reliability assessment of flip chip components C.Y. Huang (pp. 10-15) Keywords: Electronics industry, Packaging, Printed-circuit boards, Product reliability ArticleType: Research paper View HTML \| View PDF (621 KB) \| Reprints & Permissions
878474	2D analysis of functional stress degradations on power VDMOS transistor B. Beydoun, M. Zoaeter, A. Alaeddine, I. Rachidi, F. Bahsoun, J-J. Charlot, J-P. Charles (pp. 16-22) Keywords: Electrical properties of materials, Semiconductor devices, Stress (Materials) ArticleType: Conceptual Paper View HTML \| View PDF (391 KB) \| Reprints & Permissions
1508843	Increasing placement capacity with area based optimization and line balancing Timo Liukkonen, Aulis Tuominen (pp. 23-28) Keywords: Assembly, Electronics industry, Optimization techniques, Printed-circuit boards ArticleType: Research paper View HTML \| View PDF (184 KB) \| Reprints & Permissions
878475	Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach Teck Joo Goh, K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, K. Jeevan (pp. 29-35) Keywords: Heat transfer, Interpolation, Microprocessor chips, Temperature distribution ArticleType: Research paper View HTML \| View PDF (570 KB) \| Reprints & Permissions
1508844	Characterization of copper pastes for end termination application of base metal electrode MLCCs Masyood Akhtar, Rupendra M. Anklekar (pp. 36-40) Keywords: Capacitors, Copper, Pastes, Temperature ArticleType: Research Paper View HTML \| View PDF (860 KB) \| Reprints & Permissions
1508845	Inspection of electronics packages using the efficient perception technique Z.W. Zhong, Y. Jiang (pp. 41-44) Keywords: Electronics industry, Inspection, Light-emitting devices ArticleType: Research Paper View HTML \| View PDF (282 KB) \| Reprints & Permissions
1455639	Fourier and wavelet transform analysis of moire fringe patterns in electronic packaging C.Y. Xiong, J. Zhang, M. Li, J. Fang, S. Yi (pp. 45-51) Keywords: Electronics industry, Fourier transforms, Packaging ArticleType: Research paper View HTML \| View PDF (1972 KB) \| Reprints & Permissions

Letter to the Editor

The litmus test for speciality optical fibers
Item No:	Item Information
1488446	The litmus test for speciality optical fibers Journal: Microelectronics International Vol : 21 Issue: 2 Author(s): Dr Chris Emslie View HTML

Association news

MIPI Alliance grows membership to 39 companies
Item No:	Item Information
1488447	MIPI Alliance grows membership to 39 companies Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Industry news

CEMCEX announces event schedule for 2004
Item No:	Item Information
1488448	CEMCEX announces event schedule for 2004 Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

IBM and Chartered extend manufacturing arrangement to include 90 nm SOI semiconductors
Item No:	Item Information
1488449	IBM and Chartered extend manufacturing arrangement to include 90 nm SOI semiconductors Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Realistic solderability testing with lead-free solders
Item No:	Item Information
1488450	Realistic solderability testing with lead-free solders Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Discretix partners with Texas Instruments on mobile security
Item No:	Item Information
1488451	Discretix partners with Texas Instruments on mobile security Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Software provides easy access to embedded FPGAS
Item No:	Item Information
1488452	Software provides easy access to embedded FPGAS Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Intel and Media Lario announce investment and commercial agreements
Item No:	Item Information
1488453	Intel and Media Lario announce investment and commercial agreements Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Media Lario receives €12 million series – a funding led by TLcom Capital Partners and DFJ ePlanet Ventures
Item No:	Item Information
1488454	Media Lario receives €12 million series – a funding led by TLcom Capital Partners and DFJ ePlanet Ventures Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

WBI-FOX X-ray inspection system selected "Best in Test"
Item No:	Item Information
1488455	WBI-FOX X-ray inspection system selected "Best in Test" Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Elite Electronics selects Komax Gamma 333PC
Item No:	Item Information
1488456	Elite Electronics selects Komax Gamma 333PC Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Agilent Technologies expects to exceed guidance for first quarter 2004 results
Item No:	Item Information
1488457	Agilent Technologies expects to exceed guidance for first quarter 2004 results Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Exhibitions and conferences

MICROTECH 2004
Item No:	Item Information
1488458	MICROTECH 2004 Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

International diary

International diary
Item No:	Item Information
1488459	International diary Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

New products

New vacuum pickup
Item No:	Item Information
1488460	New vacuum pickup Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

New EPCOS antenna for Bluetooth and WLAN provides more power in less space
Item No:	Item Information
1488461	New EPCOS antenna for Bluetooth and WLAN provides more power in less space Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

New liquid crystal polymer reduces semiconductor packaging costs
Item No:	Item Information
1488462	New liquid crystal polymer reduces semiconductor packaging costs Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Soft EMI shielding gaskets cropped to any length from TBA ECP
Item No:	Item Information
1488463	Soft EMI shielding gaskets cropped to any length from TBA ECP Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

New precision 50 ml twin-pack cartridge dispenser
Item No:	Item Information
1488464	New precision 50 ml twin-pack cartridge dispenser Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

New rotary dispensing table
Item No:	Item Information
1488465	New rotary dispensing table Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Agilent Technologies introduces smaller FBAR transmit filter for US PCS band mobile phones, data cards
Item No:	Item Information
1488466	Agilent Technologies introduces smaller FBAR transmit filter for US PCS band mobile phones, data cards Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Telelog reduces cash drain from climate change levy
Item No:	Item Information
1488467	Telelog reduces cash drain from climate change levy Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

DuPont Electronic Technologies new WB dry film photoresist for semiconductor wafer bumping
Item No:	Item Information
1488468	DuPont Electronic Technologies new WB dry film photoresist for semiconductor wafer bumping Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

iSYSTEM and PHYTEC launch combination rapid development kit
Item No:	Item Information
1488469	iSYSTEM and PHYTEC launch combination rapid development kit Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

GDS invests in new Taiwanese clean room to ensure optimum LCD display performance
Item No:	Item Information
1488470	GDS invests in new Taiwanese clean room to ensure optimum LCD display performance Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Book reviews

The Design of CMOS Radio-Frequency Integrated Circuits
Item No:	Item Information
1488471	The Design of CMOS Radio-Frequency Integrated Circuits Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Bob Willis' top ten reference books 2004
Item No:	Item Information
1488472	Bob Willis' top ten reference books 2004 Journal: Microelectronics International Vol : 21 Issue: 2 Author(s): Bob Willis View HTML

Company profile

Mozaik Technology Ventures Ltd
Item No:	Item Information
1488473	Mozaik Technology Ventures Ltd Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Interview

All together now
Item No:	Item Information
1488474	All together now Journal: Microelectronics International Vol : 21 Issue: 2 View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1488475	Internet commentary Journal: Microelectronics International Vol : 21 Issue: 2 Author(s): Brian Ellis View HTML