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Soldering & Surface Mount Technology

Volume 8 Issue 2

Published: 1996 | Start Page: 5

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Articles

Articles
Article No: Article Information:
1455792 Fluxless Flip-chip Bonding on Flexible Substrates: A Comparison between Adhesive Bonding and Soldering*
R. Aschenbrenner, E. Zakel, G. Azdasht**, A. Kloeser, H. Reichl (pp. 5-11)
Keywords: Bonding, Flip chip, Fluxless, Soldering
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1455648 Novel Application of Diffusion Soldering*
D.M. Jacobson, S.P.S Sangha (pp. 12-15)
Keywords: Difussion soldering, Soldering
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1455649 Advantages of Protective Atmosphere Control for No-Clean Solder Pastes*
F.J.de Klein (pp. 16-24)
Keywords: Atmosphere, No-clean, Oxygen, Pastes, Solder paste
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1455650 Screen Printing is a Science, not an Art
D. Mc Phail (pp. 25-28)
Keywords: Deposition, Screen printing, Solder paste
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1455651 Reliability Evaluation of TSOP Solder Joints for PC Card Application
J. Seyyedi, R. lannuzzelli, J. Bukhari (pp. 29-32)
Keywords: Reliability, Solder joint, TSOP
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1455652 Intercomparison Results of a Gold Plated Nickel Solderability Reference Standard
C. Hunt (pp. 49-53)
Keywords: Gold, Nickel, Solderability, Standards
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