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Soldering & Surface Mount Technology

Volume 9 Issue 1

Published: 1997 | Start Page: 4

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Articles

Articles
Article No: Article Information:
1455657 Capillary Flow Solder Wettability Test*
P.T. Vianco, J.A. Rejent (pp. 4-7)
Keywords: Flow, Soldering, Test, Wettability
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878482 Closed Loop Control of Atmospheres for Soldering
N. Saxena, C. Precious, A. Carr, S. Adams (pp. 8-10)
Keywords: Atmosphere, Flow, Ovens, Soldering
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878483 Some Problems in Switching to Lead-free Solders*
W.B. Hampshire (pp. 11-12)
Keywords: Load-free soldering, Soldering
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878484 Heated Gas Jet Reflow: An Alternative Reflow Solder Assembly Process Technology*
L.R. Lichtenberg, P.J. Gillespie (pp. 13-16)
Keywords: Hot gas jet reflow, Reflow, Solders
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1455658 Build Cycle Time Reduction through Process Optimisation*
H. Valladares (pp. 4-7)
Keywords: Cycle times, Optimisation, Printed circuit boards
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878485 Mass Soldering
G. Becker (pp. 23-29)
Keywords: Soldering
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878486 Microstructurally Based Finite Element Simulation on Solder Joint Behaviour*
D.R. Frear, S.N. Burchett, M.K. Neilsen, J.J. Stephens (pp. 39-42)
Keywords: Finite element simulation, Reliability, Solder joint
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