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Soldering & Surface Mount Technology

Volume 9 Issue 2

Published: 1997 | Start Page: 5

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Articles

Articles
Article No: Article Information:
1508848 Lead-free and No-clean Soldering for Automotive Electronics*
D. Shangguan, G. Gao (pp. 5-8)
Keywords: Automotive industry, Electronics industry, Lead-free soldering, No-clean
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878488 Microstructural Investigation of Sn-Ag and Sn-Ag Solder Joints*
S. Chada, A. Herrmann, W. Laub, R. Fournelle, D. Shangguan, A. Achari (pp. 9-13)
Keywords: Solder joint, Solders
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1455659 An Experimental Method for Refinement of Solderability Measurement
W. Liggett, K.-W. Moon, C. Handwerker (pp. 14-21)
Keywords: Measurement, Solderability
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1455660 Hard-particle Reinforced Composite Solders Part 1: Microcharacterisation
J.L. Marshall, J. Calderon (pp. 22-28)
Keywords: Composite solders, Soldering, Solders
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878489 The Development of High Speed Printing Solder Pastes for Fine Pitch Applications*
M. Warwick, I. Harpley (pp. 29-32)
Keywords: Fine pitch components, Printing, Solder paste
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878490 Solder Reliability Solutions: A PC-based Design-for-reliability Tool*
J.-P. CIech (pp. 45-54)
Keywords: Design, Reliability, Software, Solders
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878491 New High Thermal Conductivity Thermoplastics for Power Applications
R.L. Dietz, D. Peck, P.J. Robinson, M.G. Firmstone, P.M. Bartholomew, G. Paterson (pp. 55-57)
Keywords: Electronics packaging, Thermal Conductivity, Thermo plastics
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1508849 The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies
J.H . Lau (pp. 58-60)
Keywords: Ball grid array, DNP, Reliability, Solder joint
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878493 Microstructural Modelling and Electronic Interconnect Reliability*
P.R. Winter, E.R. Wallach (pp. 61-64)
Keywords: CAM, Finite element analysis, Reliability, Solder joint, Strain
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1455661 Getting Ready for Lead-free Solders*
N.-C. Lee (pp. 65-69)
Keywords: Lead-free soldering, Soldering
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