| 878494 |
Maximising throughput of the component assembly process
Alan Nesbit
(pp. 6-9)
Keywords:
Assembly,
Efficiency,
Software,
Throughput
ArticleType: Research paper
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(52 KB)
|
| 878495 |
Microstructure of solder joints with electronic components in lead-free solders
Yoshikazu Nakamura, Yoshinori Sakakibara, Yoshihisa Watanabe, Yoshiki Amamoto
(pp. 10-12)
Keywords:
Lead-free soldering,
Microstructure,
Solder joint
ArticleType: General review
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(90 KB)
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| 1455662 |
The application of IR thermography to process monitoring and control of reflow soldering
Paul Conway, David Whalley, Michelle Wilkinson, S.M. Hyslop
(pp. 13-18)
Keywords:
Infra-red,
Reflow process recipe,
Sensors,
Thermography
ArticleType: Research paper
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(139 KB)
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| 878496 |
Lead-free alloys
Anton Zoran Miric, Angela Grusd
(pp. 19-25)
Keywords:
Environment,
Lead-free soldering,
Legislation,
Temperature
ArticleType: General review
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(139 KB)
|
| 878497 |
Solder joint reliability of cavity-down plastic ball grid array assemblies
S.-W. Ricky Lee, John H. Lau
(pp. 26-31)
Keywords:
Computational model,
Plastic ball grid array,
Solder joint
ArticleType: General review
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(122 KB)
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| 878498 |
Surface mount assembly of BGA and BGA
Volker-Ekkehart Koch
(pp. 32-36)
Keywords:
Ball grid array,
Chip size package,
Printed circuit board,
Surface mount assembly
ArticleType: General review
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(165 KB)
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| 878499 |
Mechanical properties of Pb/Sn Pb/In and Sn-In solders
W. Kinzy Jones, Yanqing Liu, Milind Shah, Robert Clarke
(pp. 37-41)
Keywords:
Fracture,
Mechanical properties,
Solders,
Uniform elongation
ArticleType: General review
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(133 KB)
|
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