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Soldering & Surface Mount Technology

Volume 10 Issue 2

Published: 1998 | Start Page: 6

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Articles

Articles
Article No: Article Information:
878500 Numerical modelling of solder joint formation
Chris Bailey, Daniel Wheeler, Mark Cross (pp. 6-13)
Keywords: Assembly, Defects, Numerical modelling, Printed circuit boards, Solder joint, Solders
ArticleType: Technical paper
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878501 The beneficial effect of underfilling on the reliability of flip-chip joints
Bela Roesner (pp. 14-18)
Keywords: Flip-chip, Reliability, Underfill
ArticleType: Technical paper
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1500381 The criticality of component forming and tinning in a high-reliability low-volume facility
David L. Cusick, William F. Knight, Bob Madeiros (pp. 19-25)
Keywords: Forming and tinning process, Process control techniques, SMT fabrication
ArticleType: Technical paper
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1508850 Engineering solder paste performance through controlled stress rheology analysis
Xiaohua Bao, Ning-Cheng Lee, Rajkumar B. Raj, K.P. Rangan, Anu Maria (pp. 26-35)
Keywords: Rheology, Solder paste, Stress
ArticleType: Technical paper
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1455663 Layout designs for robotic PCB assembly
Collin Wang (pp. 36-48)
Keywords: Industrial robots, Printed circuit board assembly
ArticleType: Technical paper
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