| 878502 |
Influences of storage conditions on component cracking
Klaus Feldmann, Robert Feuerstein, Knuth Götz
(pp. 6-11)
Keywords:
Components,
Cracking,
Moulding compound,
Popcorning,
Quality assurance,
Storage
ArticleType: Technical paper
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(121 KB)
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| 1455664 |
Finite element modelling of printed circuit boards (PCBs) for structural analysis
Miky Lee
(pp. 12-17)
Keywords:
High temperature,
Printed circuit boards,
Reflow,
Warpage
ArticleType: Technical paper
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(116 KB)
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| 878503 |
Gallium-based interconnects for flip-chip assembly
Adam A. Stanfield
(pp. 18-22)
Keywords:
Amalgam,
Conductive adhesive,
Flip-chip,
Magnetic alignment
ArticleType: Technical paper
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(117 KB)
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| 878504 |
Verification of flip-chip assembly on FR4 boards
Caroline Beelen-Hendrikx, Martin Verguld
(pp. 23-28)
Keywords:
Flip-chip,
Miniaturisation,
Reflow,
Solder paste
ArticleType: Technical paper
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(125 KB)
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| 878505 |
Eutectic Sn/Pb solder bump and under bump metallurgy: interfacial reactions and adhesion
Se-Young Jang, Kyung-Wook Paik
(pp. 29-37)
Keywords:
Electroplating,
Eutectic,
Flip-chip,
Tin-lead,
Under bump metallurgy
ArticleType: Technical paper
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(409 KB)
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| 878506 |
The role of intermetallic compounds in lead-free soldering
Paul G. Harris, Kaldev S. Chaggar
(pp. 38-52)
Keywords:
Intermetallics,
Lead-free soldering,
Solder joint,
Solders
ArticleType: Technical paper
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(450 KB)
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