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Soldering & Surface Mount Technology

Volume 11 Issue 3

Published: 1999 | Start Page: 8

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Articles

Articles
Article No:	Article Information:
878513	Materials behaviour and the reliability in performance of solder joints W.J. Plumbridge (pp. 8-11) Keywords: Lead-free soldering, Mechanical properties, Reliability, Solder joints ArticleType: General review View HTML \| View PDF (269 KB) \| Reprints & Permissions
1455671	Survey of rework practices in the UK electronics assembly industry M. Wickham, C.P. Hunt (pp. 12-22) Keywords: Rework, Surface mount assembly, United Kingdom ArticleType: Research paper View HTML \| View PDF (362 KB) \| Reprints & Permissions
878514	Characterization of a solder paste printing process and its optimization Gary K.K. Poon, D.J. Williams (pp. 23-26) Keywords: Optimization, Solder paste, Stencil printer ArticleType: Technical paper View HTML \| View PDF (1038 KB) \| Reprints & Permissions
878515	Analysis of crack growth in solder joints Dongkai Shangguan (pp. 27-32) Keywords: Crack propagation, Fatigue, Intermetallics, Lead-free soldering, Reliability ArticleType: Technical paper View HTML \| View PDF (177 KB) \| Reprints & Permissions
878516	Enhancement of underfill encapsulants for flip-chip technology M.B. Vincent, C.P. Wong (pp. 33-39) Keywords: Adhesion, Encapsulation, Flip chip, Underfill ArticleType: Technical paper View HTML \| View PDF (400 KB) \| Reprints & Permissions
878517	PBGA solder ball coplanarity impact evaluation Tony Huang, Joe Chu (pp. 40-45) Keywords: Plastic ball grid array, Reliability, Solders ArticleType: General review View HTML \| View PDF (89 KB) \| Reprints & Permissions
878518	Interfacial reactions of tin-zinc-bismuth alloys Paul Harris (pp. 46-52) Keywords: Alloys, Lead-free soldering, Solders, Tin-zinc, Zinc ArticleType: General review View HTML \| View PDF (153 KB) \| Reprints & Permissions

Editorial

Editorial
Item No:	Item Information
1488605	Editorial Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 Author(s): David Topham View HTML

SMART news

SMART Group trip to Productronica
Item No:	Item Information
1488606	SMART Group trip to Productronica Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Soldering and Surface Mount Technology sponsor VIP to SMT/ES and S/Hybrid'99
Item No:	Item Information
1488607	Soldering and Surface Mount Technology sponsor VIP to SMT/ES and S/Hybrid'99 Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

SMART Group rework seminar/workshop - 13th May 1999, Coventry
Item No:	Item Information
1488608	SMART Group rework seminar/workshop - 13th May 1999, Coventry Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 Author(s): Mike Judd and Tom Perrett View HTML

SMART Group Scotland - corporate golf day
Item No:	Item Information
1488609	SMART Group Scotland - corporate golf day Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 Author(s): Jim Wilson View HTML

SMART Ireland host golf and shooting event
Item No:	Item Information
1488610	SMART Ireland host golf and shooting event Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

SMART Group Ireland
Item No:	Item Information
1488611	SMART Group Ireland Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Industry welcomes lead-free guidance
Item No:	Item Information
1488612	Industry welcomes lead-free guidance Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Institute news

IPC. IPCWorks '99 to focus on lead-free electronic assemblies
Item No:	Item Information
1488613	IPC. IPCWorks '99 to focus on lead-free electronic assemblies Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

IPC. Motorola VP to keynote IPCWorks '99
Item No:	Item Information
1488614	IPC. Motorola VP to keynote IPCWorks '99 Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

IPC. IPC introduces lead-free alternative electronic forum
Item No:	Item Information
1488615	IPC. IPC introduces lead-free alternative electronic forum Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

IPC. IPC to create roadmap for lead-free electronic assemblies
Item No:	Item Information
1488616	IPC. IPC to create roadmap for lead-free electronic assemblies Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

IPC. IPC to 'storm' the shores of Long Beach with General H. Norman Schwarzkopf
Item No:	Item Information
1488617	IPC. IPC to 'storm' the shores of Long Beach with General H. Norman Schwarzkopf Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

IPC. IPC SMEMA Council to give two technical paper awards at APEX 2000
Item No:	Item Information
1488618	IPC. IPC SMEMA Council to give two technical paper awards at APEX 2000 Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

IPC. IPC releases final financial statistics for 1998 EMSI market
Item No:	Item Information
1488619	IPC. IPC releases final financial statistics for 1998 EMSI market Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

SMTA. Anita Sargent named winner of the 1999 Hutchins Educational Grant
Item No:	Item Information
1488620	SMTA. Anita Sargent named winner of the 1999 Hutchins Educational Grant Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

SMTA. Real world BGA/CSP applications at Nepcon Texas
Item No:	Item Information
1488621	SMTA. Real world BGA/CSP applications at Nepcon Texas Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

SMTA. SMTA hosts talk on packaging future
Item No:	Item Information
1488622	SMTA. SMTA hosts talk on packaging future Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

SSTC. Full house at spring meeting of SSTC held at NPL
Item No:	Item Information
1488623	SSTC. Full house at spring meeting of SSTC held at NPL Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Industry news

ITRI launch the first lead-free soldering technology centre
Item No:	Item Information
1488624	ITRI launch the first lead-free soldering technology centre Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Kestra Ltd of UK acquired by CyberOptics
Item No:	Item Information
1488625	Kestra Ltd of UK acquired by CyberOptics Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Flextronics International completes acquisition of the Ericsson Visby, Sweden plant
Item No:	Item Information
1488626	Flextronics International completes acquisition of the Ericsson Visby, Sweden plant Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Flextronics International announces agreement for merger with Kyrel EMS Oyj
Item No:	Item Information
1488627	Flextronics International announces agreement for merger with Kyrel EMS Oyj Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

PAF Systems appoints Irish distributor
Item No:	Item Information
1488628	PAF Systems appoints Irish distributor Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

PMJ wins orders worth over FIM 50 million
Item No:	Item Information
1488629	PMJ wins orders worth over FIM 50 million Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

GenRad and Tecpro join forces in Ireland
Item No:	Item Information
1488630	GenRad and Tecpro join forces in Ireland Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New headquarters for Europlacer Group
Item No:	Item Information
1488631	New headquarters for Europlacer Group Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Speedprint acquired by Europlacer
Item No:	Item Information
1488632	Speedprint acquired by Europlacer Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New MRSI European office opens
Item No:	Item Information
1488633	New MRSI European office opens Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New analytical support service
Item No:	Item Information
1488634	New analytical support service Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Speedline Technologies invests in new Asia/Pacific headquarters
Item No:	Item Information
1488635	Speedline Technologies invests in new Asia/Pacific headquarters Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Indium Corporation awarded Market Engineering Award
Item No:	Item Information
1488636	Indium Corporation awarded Market Engineering Award Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New trade fair for electronics in India
Item No:	Item Information
1488637	New trade fair for electronics in India Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

OnQ Technology chosen as name for merged Cofer and Surface Mount Taping Corporations
Item No:	Item Information
1488638	OnQ Technology chosen as name for merged Cofer and Surface Mount Taping Corporations Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New 1.4 million project aims to boost business opportunities for electronics industry
Item No:	Item Information
1488639	New 1.4 million project aims to boost business opportunities for electronics industry Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

More investment at DEK Screens
Item No:	Item Information
1488640	More investment at DEK Screens Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

The inside story on design re-use and intellectual property
Item No:	Item Information
1488641	The inside story on design re-use and intellectual property Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Quad Systems finalizes distribution agreement with Mirae Corporation
Item No:	Item Information
1488642	Quad Systems finalizes distribution agreement with Mirae Corporation Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

DEK signs AMTEST as their central European distributor
Item No:	Item Information
1488643	DEK signs AMTEST as their central European distributor Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Appointments

Kiwi takes flight and joins Multicore
Item No:	Item Information
1488644	Kiwi takes flight and joins Multicore Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

DEK Asia Pacific appoint new general manager
Item No:	Item Information
1488645	DEK Asia Pacific appoint new general manager Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Quad Systems names Langbridge general manager and director of Quad Europe Limited
Item No:	Item Information
1488646	Quad Systems names Langbridge general manager and director of Quad Europe Limited Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Quad appoints Mortensen director of international sales
Item No:	Item Information
1488647	Quad appoints Mortensen director of international sales Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Holloway rejoins Nepcon portfolio of events as director of industry development
Item No:	Item Information
1488648	Holloway rejoins Nepcon portfolio of events as director of industry development Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

MultiTroniKs Ltd appoints new regional sales manager
Item No:	Item Information
1488649	MultiTroniKs Ltd appoints new regional sales manager Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New European business manager for Speedline ELECTROVERT
Item No:	Item Information
1488650	New European business manager for Speedline ELECTROVERT Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

DEK appoints new advanced technologies engineer
Item No:	Item Information
1488651	DEK appoints new advanced technologies engineer Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Conferences

The Second International IEEE Symposium on Polymeric Electronics Packaging (PEP'99)
Item No:	Item Information
1488652	The Second International IEEE Symposium on Polymeric Electronics Packaging (PEP'99) Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

International diary

International diary
Item No:	Item Information
1488653	International diary Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New products

Enhancements to Genrad's CIMBridge software expand Fuji programming capability through Fujicam
Item No:	Item Information
1488654	Enhancements to Genrad's CIMBridge software expand Fuji programming capability through Fujicam Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Enhancements to Teradyne's flying prober provide faster board test to meet manufacturing demands of shorter new product life cycles
Item No:	Item Information
1488655	Enhancements to Teradyne's flying prober provide faster board test to meet manufacturing demands of shorter new product life cycles Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Teradyne to extend Unified Test Environment with new platform configurations
Item No:	Item Information
1488656	Teradyne to extend Unified Test Environment with new platform configurations Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New AAT Hydrojet brings high speed, state-of-the-art performance to 'in-line' cleaning
Item No:	Item Information
1488657	New AAT Hydrojet brings high speed, state-of-the-art performance to 'in-line' cleaning Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

GR TestStation enhancements expand system flexibility and capability
Item No:	Item Information
1488658	GR TestStation enhancements expand system flexibility and capability Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New lightweight, low thermal expansion silicon-aluminium alloys
Item No:	Item Information
1488659	New lightweight, low thermal expansion silicon-aluminium alloys Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Speedline launches high-speed flexible wave soldering system
Item No:	Item Information
1488660	Speedline launches high-speed flexible wave soldering system Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

AutoLSM semi-automatic solder paste inspection
Item No:	Item Information
1488661	AutoLSM semi-automatic solder paste inspection Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

MYDATA releases two new placement machines - MY9 and MY12
Item No:	Item Information
1488662	MYDATA releases two new placement machines - MY9 and MY12 Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

PMJ's automation of the final assembly process
Item No:	Item Information
1488663	PMJ's automation of the final assembly process Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New Ultra Fast(TM) UV curing adhesives
Item No:	Item Information
1488664	New Ultra Fast(TM) UV curing adhesives Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New PCB transport system from Siemens increases throughput significantly
Item No:	Item Information
1488665	New PCB transport system from Siemens increases throughput significantly Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Launch of affordable system for BGA inspection
Item No:	Item Information
1488666	Launch of affordable system for BGA inspection Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Senju Europe launches high performance solder paste resistant to tombstoning
Item No:	Item Information
1488667	Senju Europe launches high performance solder paste resistant to tombstoning Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New via plug ink enables void-free hole filling
Item No:	Item Information
1488668	New via plug ink enables void-free hole filling Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New 'no flow' flip-chip underfill dramatically improves joint yield
Item No:	Item Information
1488669	New 'no flow' flip-chip underfill dramatically improves joint yield Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New polyurethane encapsulant from Multicore
Item No:	Item Information
1488670	New polyurethane encapsulant from Multicore Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Multicore solders announces CM50 contaminometer for large PCBs
Item No:	Item Information
1488671	Multicore solders announces CM50 contaminometer for large PCBs Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Multi-handshaking makes conveyors universal tank
Item No:	Item Information
1488672	Multi-handshaking makes conveyors universal tank Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Scanner technology cuts PCB inspection time to just a minute
Item No:	Item Information
1488673	Scanner technology cuts PCB inspection time to just a minute Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New high-speed, user-friendly wave soldering system from Speedline ELECTROVERT
Item No:	Item Information
1488674	New high-speed, user-friendly wave soldering system from Speedline ELECTROVERT Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New Speedline MPM software package
Item No:	Item Information
1488675	New Speedline MPM software package Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

ProFlow continues to evolve
Item No:	Item Information
1488676	ProFlow continues to evolve Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Siemens rolls out faster, more flexible SIPLACE SMT machine
Item No:	Item Information
1488677	Siemens rolls out faster, more flexible SIPLACE SMT machine Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

MYDATA increases component range for HYDRA
Item No:	Item Information
1488678	MYDATA increases component range for HYDRA Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Launch of new industry standard for PCB reliability
Item No:	Item Information
1488679	Launch of new industry standard for PCB reliability Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

FirstCheck speeds inspection, reduces downtime
Item No:	Item Information
1488680	FirstCheck speeds inspection, reduces downtime Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Extended tack and stencil life solder paste
Item No:	Item Information
1488681	Extended tack and stencil life solder paste Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

New Quad Meridian Series(TM) SMT assemblers significantly expand quad market presence
Item No:	Item Information
1488682	New Quad Meridian Series(TM) SMT assemblers significantly expand quad market presence Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Pin-ball wizardry from Autosplice
Item No:	Item Information
1488683	Pin-ball wizardry from Autosplice Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Book reviews

Aqueous Cleaning Handbook
Item No:	Item Information
1488684	Aqueous Cleaning Handbook Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Electronic Failure Analysis Handbook
Item No:	Item Information
1488685	Electronic Failure Analysis Handbook Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Chip Scale Packaging: Design, Materials, Processes and Reliability
Item No:	Item Information
1488686	Chip Scale Packaging: Design, Materials, Processes and Reliability Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 View HTML

Company profile

Philips Electronic Manufacturing Technology (EMT)
Item No:	Item Information
1488687	Philips Electronic Manufacturing Technology (EMT) Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 Author(s): Trevor Galbraith View HTML

Internet commentary

As some day it may happen that a victim must be found, I've got a little list I've got a little list(1)
Item No:	Item Information
1488688	As some day it may happen that a victim must be found, I've got a little list I've got a little list(1) Journal: Soldering & Surface Mount Technology Vol : 11 Issue: 3 Author(s): Brian Ellis View HTML