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Soldering & Surface Mount Technology


Volume 12 Issue 1

Published: 2000 | Start Page: 7

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Articles

Articles
Article No: Article Information:
878519 Investigation of a solder bumping technique for flip-chip interconnection
David A. Hutt, Daniel G. Rhodes, Paul P. Conway, Samjid H. Mannan, David C. Whalley, Andrew S. Holmes (pp. 7-14)
Keywords: Flip-chip, Silicone, Solder bumps, Solder paste
ArticleType: Technical paper
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878520 Reliability of unencapsulated SMD plastic film capacitors
Anne Seppälä, Kimmo Saarinen, Eero Ristolainen (pp. 15-22)
Keywords: Lead-free soldering, Reliability, Surface mount technology
ArticleType: General review
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878521 An alternative approach for the analysis of intermetallic compounds in SMT solder joints
I.K. Hui, H.W. Law (pp. 23-31)
Keywords: Analysis, Intermetallics, Solder joints, Surface mount technology
ArticleType: General review
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878522 Lead-free solders in Japan (a personal impression)
W.J. Plumbridge (pp. 32-34)
Keywords: Japan,, Lead-free soldering
ArticleType: General review
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1508852 3D Si-on-Si stack packaging
H. Kanbach, J. Wilde, F. Kriebel, E. Meusel (pp. 35-39)
Keywords: Electronic packing, Fault analysis, Flip chip, Multi-chip module
ArticleType: Technical paper
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878523 A novel high performance die attach
X.M. Xie, T.B. Wang, J.Z. Shi, R.Q. Ye, F. Stubhan, J. Freytag (pp. 40-44)
Keywords: Die bonding, Microstructures, Reliability
ArticleType: General review
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SMART news

SMART adhesives day
Item No: Item Information
1488689 SMART adhesives day
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Philip J. O'Rourke
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The SMART Group Ireland Industry Awards 1999
Item No: Item Information
1488690 The SMART Group Ireland Industry Awards 1999
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Philip J. O'Rourke
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The SMART Group launch new brochure
Item No: Item Information
1488691 The SMART Group launch new brochure
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Philip J. O'Rourke
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Nepcon and the SMART Group announce process technology seminars
Item No: Item Information
1488692 Nepcon and the SMART Group announce process technology seminars
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Philip J. O'Rourke
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Advance information from the SMART Group
Item No: Item Information
1488693 Advance information from the SMART Group
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Philip J. O'Rourke
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Dr Colin Lee OBE marries Deborah White
Item No: Item Information
1488694 Dr Colin Lee OBE marries Deborah White
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Philip J. O'Rourke
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Obituary - Declan Clear
Item No: Item Information
1488695 Obituary - Declan Clear
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Philip J. O'Rourke
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Institute news

IPC, NEMI team to standardize factory and supply chain communication
Item No: Item Information
1488696 IPC, NEMI team to standardize factory and supply chain communication
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NEMI to launch Roadmap 2000 at APEX SM
Item No: Item Information
1488697 NEMI to launch Roadmap 2000 at APEX SM
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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IPC estimates EMS sales rose 21.5 percent in 1999
Item No: Item Information
1488698 IPC estimates EMS sales rose 21.5 percent in 1999
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Lead-free electronics talks bring large crowds to IPCworks
Item No: Item Information
1488699 Lead-free electronics talks bring large crowds to IPCworks
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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APEX keynote to focus on supply chain management
Item No: Item Information
1488700 APEX keynote to focus on supply chain management
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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APEX tutorials to focus on SMT, advanced component packaging
Item No: Item Information
1488701 APEX tutorials to focus on SMT, advanced component packaging
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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SMTA International 2000 moves to the windy city
Item No: Item Information
1488702 SMTA International 2000 moves to the windy city
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New online feature - practical solutions forums
Item No: Item Information
1488703 New online feature - practical solutions forums
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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ITRI launches lead-free solder centre of excellence
Item No: Item Information
1488704 ITRI launches lead-free solder centre of excellence
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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ITRI's Kay Nimmo wins Best International paper at IPCWorks
Item No: Item Information
1488705 ITRI's Kay Nimmo wins Best International paper at IPCWorks
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL Electronics Interconnection Group publications
Item No: Item Information
1488706 NPL Electronics Interconnection Group publications
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL receives research and development award
Item No: Item Information
1488707 NPL receives research and development award
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL. New issue of NPL Microelectronics News
Item No: Item Information
1488708 NPL. New issue of NPL Microelectronics News
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL. NPL launches Visual Inspection Guidelines on CD-ROM
Item No: Item Information
1488709 NPL. NPL launches Visual Inspection Guidelines on CD-ROM
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL. NPL launches SSTC Web page and announces upcoming events
Item No: Item Information
1488710 NPL. NPL launches SSTC Web page and announces upcoming events
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL. NPL shows the way on lead-free soldering
Item No: Item Information
1488711 NPL. NPL shows the way on lead-free soldering
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL. IPC honours NPL scientist Chris Hunt
Item No: Item Information
1488712 NPL. IPC honours NPL scientist Chris Hunt
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NPL. The lead-free soldering cook book
Item No: Item Information
1488713 NPL. The lead-free soldering cook book
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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SSTC. 20th Anniversary Seminar Meeting at NPI
Item No: Item Information
1488714 SSTC. 20th Anniversary Seminar Meeting at NPI
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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TWI. The REACT Network Club launch
Item No: Item Information
1488715 TWI. The REACT Network Club launch
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Industry news

Test Connections announces purchase
Item No: Item Information
1488716 Test Connections announces purchase
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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ATF acquires equity interest from Speedline
Item No: Item Information
1488717 ATF acquires equity interest from Speedline
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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EKRA expands international presence
Item No: Item Information
1488718 EKRA expands international presence
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Philips EMT and CIMCIS partner to help customers optimize pick-and-place machine setup and operation
Item No: Item Information
1488719 Philips EMT and CIMCIS partner to help customers optimize pick-and-place machine setup and operation
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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DEK and photo stencil form global alliance
Item No: Item Information
1488720 DEK and photo stencil form global alliance
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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PAF announces management buyout and expansion plan
Item No: Item Information
1488721 PAF announces management buyout and expansion plan
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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ESEC and Juki Automation Systems sign agreement on transfer of CBA business
Item No: Item Information
1488722 ESEC and Juki Automation Systems sign agreement on transfer of CBA business
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Tamura Kaken Japan receives Telcordia Technologies certification for Solder Paste NC 7
Item No: Item Information
1488723 Tamura Kaken Japan receives Telcordia Technologies certification for Solder Paste NC 7
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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PMJ acquires Cencorp's depaneling technologies
Item No: Item Information
1488724 PMJ acquires Cencorp's depaneling technologies
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Philips and Yamaha extend SMT partnership
Item No: Item Information
1488725 Philips and Yamaha extend SMT partnership
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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M-Factor paste proves decisive for Siemens
Item No: Item Information
1488726 M-Factor paste proves decisive for Siemens
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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$440 million agreed for phasing out developing country CFCs
Item No: Item Information
1488727 $440 million agreed for phasing out developing country CFCs
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Industry specialists join forces to resolve the technical challenges in electronics manufacturing
Item No: Item Information
1488728 Industry specialists join forces to resolve the technical challenges in electronics manufacturing
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Fujitsu Siemens Computers to outsource server production in Paderborn to Flextronics International
Item No: Item Information
1488729 Fujitsu Siemens Computers to outsource server production in Paderborn to Flextronics International
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Mask Tek awarded patent
Item No: Item Information
1488730 Mask Tek awarded patent
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Flextronics International and the Dii Group sign merger agreement
Item No: Item Information
1488731 Flextronics International and the Dii Group sign merger agreement
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Siemens AG and Fabmaster S.A. have signed an OEM agreement
Item No: Item Information
1488732 Siemens AG and Fabmaster S.A. have signed an OEM agreement
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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OK International announces acquisition of Semtronics Corp.
Item No: Item Information
1488733 OK International announces acquisition of Semtronics Corp.
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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PMJ acquires Salon Hannu Seppälä OY
Item No: Item Information
1488734 PMJ acquires Salon Hannu Seppälä OY
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Appointments

Quad announces three promotions
Item No: Item Information
1488735 Quad announces three promotions
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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MYDATA announces three new appointments
Item No: Item Information
1488736 MYDATA announces three new appointments
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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DEK expands German application department
Item No: Item Information
1488737 DEK expands German application department
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Appointments at PMJ
Item No: Item Information
1488738 Appointments at PMJ
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Conference report

SMTA International Conference and Exhibition
Item No: Item Information
1488739 SMTA International Conference and Exhibition
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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EM&T/OnBoard Seminars 1999 - another successful year, come on 2000!
Item No: Item Information
1488740 EM&T/OnBoard Seminars 1999 - another successful year, come on 2000!
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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International diary

International diary
Item No: Item Information
1488741 International diary
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Exhibitions and conferences

Productronica 99 provides industry boost
Item No: Item Information
1488742 Productronica 99 provides industry boost
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Buzz Aldrin to deliver opening keynote address at NEPCON West 2000
Item No: Item Information
1488743 Buzz Aldrin to deliver opening keynote address at NEPCON West 2000
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NEPCON/Microelectronics Shenzhen '99 concluded with encouraging responses
Item No: Item Information
1488744 NEPCON/Microelectronics Shenzhen '99 concluded with encouraging responses
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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NEPCON West conference enhanced with new sessions and special events
Item No: Item Information
1488745 NEPCON West conference enhanced with new sessions and special events
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Trevor Galbraith
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New products

Excellon automation announces first depanelization line
Item No: Item Information
1488746 Excellon automation announces first depanelization line
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Heraeus introduces lead- and halide-free no-clean solder paste
Item No: Item Information
1488747 Heraeus introduces lead- and halide-free no-clean solder paste
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Siemens replacement pick and place vacuum nozzles introduced
Item No: Item Information
1488748 Siemens replacement pick and place vacuum nozzles introduced
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New climate test chambers from Montford
Item No: Item Information
1488749 New climate test chambers from Montford
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Speedline ACCEL's new MicroPro™ integrates the reflow and cleaning process
Item No: Item Information
1488750 Speedline ACCEL's new MicroPro™ integrates the reflow and cleaning process
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Speedline Electrovert launches aqueous cleaner
Item No: Item Information
1488751 Speedline Electrovert launches aqueous cleaner
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Speedline CAMALOT enters sphere placement market with new Matrixx™ system
Item No: Item Information
1488752 Speedline CAMALOT enters sphere placement market with new Matrixx™ system
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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PMJ's launches HiSAC 1502 final assembly cell
Item No: Item Information
1488753 PMJ's launches HiSAC 1502 final assembly cell
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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PMJ Cencorp expands product line with new low-cost depaneling system
Item No: Item Information
1488754 PMJ Cencorp expands product line with new low-cost depaneling system
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New adhesives: for Iow-temp cure without trade-offs and ultra high-speed dispensing
Item No: Item Information
1488755 New adhesives: for Iow-temp cure without trade-offs and ultra high-speed dispensing
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New solderpastes: high-speed, fine pitch and lead-free
Item No: Item Information
1488756 New solderpastes: high-speed, fine pitch and lead-free
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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The new high-end EKRA E4 stencil printer sets milestones in the industry-wide price-performance ratio
Item No: Item Information
1488757 The new high-end EKRA E4 stencil printer sets milestones in the industry-wide price-performance ratio
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New micro grabbers for fine pitch IC testing
Item No: Item Information
1488758 New micro grabbers for fine pitch IC testing
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New reflow ovens provide improved operating process and low maintenance
Item No: Item Information
1488759 New reflow ovens provide improved operating process and low maintenance
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New manual dispensing guns from Intertronics - low cost, operator friendly, versatile
Item No: Item Information
1488760 New manual dispensing guns from Intertronics - low cost, operator friendly, versatile
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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New, easy-to-use Quad operating software
Item No: Item Information
1488761 New, easy-to-use Quad operating software
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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GraphiCode introduces GC-PLACE 4.1.2 for Windows™
Item No: Item Information
1488762 GraphiCode introduces GC-PLACE 4.1.2 for Windows™
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Valor releases version 5 of Enterprise 3000 and Trilogy 5000 CAD/CAM systems
Item No: Item Information
1488763 Valor releases version 5 of Enterprise 3000 and Trilogy 5000 CAD/CAM systems
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Heraeus launches a new cleaner for removing flux residues from reflow ovens and wave solder machines
Item No: Item Information
1488764 Heraeus launches a new cleaner for removing flux residues from reflow ovens and wave solder machines
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Electronic clip art CDs from Bob Willis
Item No: Item Information
1488765 Electronic clip art CDs from Bob Willis
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Further enhancements to Speedline MPM's Rheometric Pump
Item No: Item Information
1488766 Further enhancements to Speedline MPM's Rheometric Pump
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Powerful
Item No: Item Information
1488767 Powerful
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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GenRad announces availability of Shop Floor Line Manager software
Item No: Item Information
1488768 GenRad announces availability of Shop Floor Line Manager software
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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JOT Automation introduces mobile phone test handlers for both PCB and final testing
Item No: Item Information
1488769 JOT Automation introduces mobile phone test handlers for both PCB and final testing
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Book reviews

An Engineer's Handbook of Encapsulation and Underfill Technology
Item No: Item Information
1488770 An Engineer's Handbook of Encapsulation and Underfill Technology
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Brian Ellis
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Conductive Adhesives for Electronics Packaging
Item No: Item Information
1488771 Conductive Adhesives for Electronics Packaging
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Brian Ellis
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Workbook coaches electronics companies in outsource decision
Item No: Item Information
1488772 Workbook coaches electronics companies in outsource decision
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Supply chain management shifts to contract manufacturers
Item No: Item Information
1488773 Supply chain management shifts to contract manufacturers
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
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Internet commentary

By just exchange one for the other giv'n 1
Item No: Item Information
1488774 By just exchange one for the other giv'n 1
Journal: Soldering & Surface Mount Technology
Vol : 12 Issue: 1
Author(s): Brian Ellis
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