Welcome guest

Soldering & Surface Mount Technology

Browse
User Guides

Online Access

See all available RSS feeds

Journal Information

E-mail this page

Soldering & Surface Mount Technology

Volume 14 Issue 1

Published: 2002 | Start Page: 11

Special Issue: Computational modelling technology

Icon Key:

Requires login or subscription

Backfiles

EarlyCite

Articles

Articles
Article No:	Article Information:
878540	Correlation of solder paste rheology with computational simulations of the stencil printing process R. Durairaj, G.J. Jackson, N.N. Ekere, G. Glinski, C. Bailey (pp. 11-17) Keywords: Rheology, Solder pastes, Stencils ArticleType: Research Paper View HTML \| View PDF (294 KB) \| Reprints & Permissions
878541	Solder paste reflow modeling S.H. Mannan (pp. 18-23) Keywords: Computational fluid dynamics, Solder paste ArticleType: Research paper View HTML \| View PDF (292 KB) \| Reprints & Permissions
878542	Numerical modelling of scanned beam laser soldering of fine pitch packages P.M. Beckett, A.R. Fleming, J.M. Gilbert, D.G. Whitehead (pp. 24-29) Keywords: Electronics assembly, Lasers, Soldering ArticleType: Research paper View HTML \| View PDF (1394 KB) \| Reprints & Permissions
1455684	A simplified model of the reflow soldering process David C. Whalley, Stuart M. Hyslop (pp. 30-37) Keywords: Reflow, Soldering ArticleType: Research Paper View HTML \| View PDF (588 KB) \| Reprints & Permissions
878543	CFD modelling of the flow field inside a reflow oven Hao Yu, Jorma Kivilathti (pp. 38-44) Keywords: Computational fluid dynamics, Lead-free soldering, Reflow ArticleType: Research paper View HTML \| View PDF (475 KB) \| Reprints & Permissions
878544	Analysis on solder ball shear testing conditions with a simple computational model S.W. Ricky Lee, Xingjia Huang (pp. 45-48) Keywords: Finite element analysis, Plastic ball grid array, Reliability, Solder joints ArticleType: Research paper View HTML \| View PDF (524 KB) \| Reprints & Permissions
878545	Optimisation modelling for flip-chip solder joint reliability S. Stoyanov, C. Bailey, M. Cross (pp. 49-58) Keywords: Flip chip, Optimization, Reliability, Underfill ArticleType: Research paper View HTML \| View PDF (915 KB) \| Reprints & Permissions

Editorial

Editorial
Item No:	Item Information
1489104	Editorial Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology Author(s): Chris Bailey View HTML

SMART Group

Fifth SMART group european conference 2002announced
Item No:	Item Information
1489105	Fifth SMART group european conference 2002announced Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

The SMART group environmental electronics seminar
Item No:	Item Information
1489106	The SMART group environmental electronics seminar Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Association News

SMTA.Pan pacific microelectronics symposium preliminary program announced
Item No:	Item Information
1489107	SMTA.Pan pacific microelectronics symposium preliminary program announced Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

SMTA.Third technology symposium to be held at SMTA Boston 2002
Item No:	Item Information
1489108	SMTA.Third technology symposium to be held at SMTA Boston 2002 Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Industry news

Oxford Instruments Analytical extends product range to include coating measurement instruments
Item No:	Item Information
1489109	Oxford Instruments Analytical extends product range to include coating measurement instruments Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

ems – ALLIANCE the new concept for electronics manufacturing
Item No:	Item Information
1489110	ems – ALLIANCE the new concept for electronics manufacturing Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

The National Physical Laboratory celebrates the strength of UK measurement through national awards
Item No:	Item Information
1489111	The National Physical Laboratory celebrates the strength of UK measurement through national awards Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

New alliance in the SMT arena
Item No:	Item Information
1489112	New alliance in the SMT arena Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

A range of new chemicals
Item No:	Item Information
1489113	A range of new chemicals Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Appointments

New man at the helm for X-Tek
Item No:	Item Information
1489114	New man at the helm for X-Tek Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

A new CEO for Instem Technologies
Item No:	Item Information
1489115	A new CEO for Instem Technologies Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Tecnomatix-Unicam expands executive team
Item No:	Item Information
1489116	Tecnomatix-Unicam expands executive team Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

International diary

International diary
Item No:	Item Information
1489117	International diary Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

New products

New convertible head flip chip bonder
Item No:	Item Information
1489118	New convertible head flip chip bonder Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Dexter introduces 260°C reflow silver-filled conductive adhesive
Item No:	Item Information
1489119	Dexter introduces 260°C reflow silver-filled conductive adhesive Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Loctite multicore introduces anti-tombstoning solder pastes formulated with 63S4 alloy
Item No:	Item Information
1489120	Loctite multicore introduces anti-tombstoning solder pastes formulated with 63S4 alloy Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

EKRA announces the release of the E5-36 large format in-line sten
Item No:	Item Information
1489121	EKRA announces the release of the E5-36 large format in-line sten Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

IC-SCAN DE tracks MSDs for double side reflow boards
Item No:	Item Information
1489122	IC-SCAN DE tracks MSDs for double side reflow boards Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

New thin bondline, thermal interface material
Item No:	Item Information
1489123	New thin bondline, thermal interface material Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Test jig boosts productivity for users of surface-mount feeders
Item No:	Item Information
1489124	Test jig boosts productivity for users of surface-mount feeders Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Selective soldering system from Vitronics Soltec
Item No:	Item Information
1489125	Selective soldering system from Vitronics Soltec Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

High-performance stencils for vector™ and tetra™ frames
Item No:	Item Information
1489126	High-performance stencils for vector™ and tetra™ frames Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

New printers from Reprint
Item No:	Item Information
1489127	New printers from Reprint Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Pyramax lowers cost of ownership
Item No:	Item Information
1489128	Pyramax lowers cost of ownership Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Focus is on the Hawk
Item No:	Item Information
1489129	Focus is on the Hawk Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Multicore solders introduces new lead-free no-clean solder cream for SMT assembly
Item No:	Item Information
1489130	Multicore solders introduces new lead-free no-clean solder cream for SMT assembly Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

New electronics coating lowers cost of moisture protection for PCBs
Item No:	Item Information
1489131	New electronics coating lowers cost of moisture protection for PCBs Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Book review

Environment-friendly Electronics: Lead-free Technology
Item No:	Item Information
1489132	Environment-friendly Electronics: Lead-free Technology Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Publications

IPC-VT-42/43 hand soldering for through-hole components
Item No:	Item Information
1489133	IPC-VT-42/43 hand soldering for through-hole components Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

New standard published in the BS-7000 series
Item No:	Item Information
1489134	New standard published in the BS-7000 series Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1489135	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 1 Special Issue: Computational modelling technology Author(s): Brian Ellis View HTML