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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
878546	Intermetallic morphology around Ni particles in Sn-3.5Ag solder J.G. Lee, F. Guo, K.N. Subramanian, J.P. Lucas (pp. 11-17) Keywords: Intermetallics, Reflow, Solder ArticleType: Case study View HTML | View PDF (1019 KB) | Reprints & Permissions
878547	Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards Minna Arra, Dongkai Shangguan, Eero Ristolainen, Toivo Lepistö (pp. 18-25) Keywords: Intermetallics, Lead-free soldering, Printed circuit boards, Reflow ArticleType: Case study View HTML | View PDF (1054 KB) | Reprints & Permissions
878548	A methodology to establish baseline metrics for assessing the isothermally aging of Sn-Pb solder interconnects P.T. Vianco, J.A. Rejent (pp. 26-34) Keywords: Printed circuit boards, Solder joints ArticleType: Case study View HTML | View PDF (994 KB) | Reprints & Permissions
878549	Reliability of tin-lead balled BGAs soldered with lead-free solder paste Sami Tapani Nurmi, Eero Olavi Ristolainen (pp. 35-39) Keywords: Ball grid array, Lead-free, Temperature cycling ArticleType: Research Paper View HTML | View PDF (386 KB) | Reprints & Permissions
878550	Solder ball failure mechanisms in plastic ball grid array packages C.H. Zhong, S. Yi, D.C. Whalley (pp. 40-50) Keywords: Ball grid array, Intermetallics, Soldering ArticleType: Case study View HTML | View PDF (1738 KB) | Reprints & Permissions
1455685	Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging C.M. Lawrence Wu, M.L. Chau (pp. 51-58) Keywords: Degradation, Flip-chip, Humidity ArticleType: Research Paper View HTML | View PDF (1972 KB) | Reprints & Permissions

Association news

IPC. IPC names new director of communications

Item No:	Item Information
1489136	IPC. IPC names new director of communications Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

IPC. New IPC council formed

Item No:	Item Information
1489137	IPC. New IPC council formed Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

IPC. SSTC Spring Conference & Exhibition

Item No:	Item Information
1489138	IPC. SSTC Spring Conference & Exhibition Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

IPC. SSTC and SMART Group Meeting

Item No:	Item Information
1489139	IPC. SSTC and SMART Group Meeting Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

SMART group. Design for reliability success

Item No:	Item Information
1489140	SMART group. Design for reliability success Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

SMTA. SMTA international conference sneak preview

Item No:	Item Information
1489141	SMTA. SMTA international conference sneak preview Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

SMTA. Boston to feature three leading edge events

Item No:	Item Information
1489142	SMTA. Boston to feature three leading edge events Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Industry news

Cookson consolidates its electronics divisions

Item No:	Item Information
1489143	Cookson consolidates its electronics divisions Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Europlacer host lean manufacturing conference

Item No:	Item Information
1489144	Europlacer host lean manufacturing conference Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

New process-proven lead-free solution

Item No:	Item Information
1489145	New process-proven lead-free solution Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Flextronics Chief Marketing Officer to speak at NEPCON East

Item No:	Item Information
1489146	Flextronics Chief Marketing Officer to speak at NEPCON East Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

1st European Union/United States Lead-Free Solder Interface Meeting

Item No:	Item Information
1489147	1st European Union/United States Lead-Free Solder Interface Meeting Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Vitronics Soltec appoints Prodelec in Italy

Item No:	Item Information
1489148	Vitronics Soltec appoints Prodelec in Italy Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Valor joins forces with Aster

Item No:	Item Information
1489149	Valor joins forces with Aster Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Reports

Earth Technologies Forum, 2002

Item No:	Item Information
1489150	Earth Technologies Forum, 2002 Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 Author(s): Brian Ellis View HTML

International diary

International diary

Item No:	Item Information
1489151	International diary Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

New products

Insight ™ software for reflow tracker

Item No:	Item Information
1489152	Insight ™ software for reflow tracker Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

New OptiCon software version 3.7 available

Item No:	Item Information
1489153	New OptiCon software version 3.7 available Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Void free soldering – inline reflow and vacuum furnace

Item No:	Item Information
1489154	Void free soldering – inline reflow and vacuum furnace Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Viscom's 4M camera module increases test speed and passage height

Item No:	Item Information
1489155	Viscom's 4M camera module increases test speed and passage height Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Stencil cleaning frame optimises efficiency

Item No:	Item Information
1489156	Stencil cleaning frame optimises efficiency Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Micro-Placer for BGA, QFP and Flip Chip

Item No:	Item Information
1489157	Micro-Placer for BGA, QFP and Flip Chip Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

New autofeeder from Autosplice

Item No:	Item Information
1489158	New autofeeder from Autosplice Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML

Internet commentary

Internet commentary

Item No:	Item Information
1489159	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 14 Issue: 2 View HTML