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Soldering & Surface Mount Technology


Volume 16 Issue 2

Published: 2004 | Start Page: 13


Special Issue: Solder joint reliability
Guest Editor(s): S W Ricky Lee
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Articles

Articles
Article No: Article Information:
878568 Long term mechanical reliability with lead-free solders
W.J. Plumbridge (pp. 13-20)
Keywords: Modelling, Reliability, Reliability management, Solders
ArticleType: Research paper
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878569 Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate
Eric C.C. Yan, S.W. Ricky Lee, X. Huang (pp. 21-26)
Keywords: Product reliability, Semiconductor technology, Shear strength, Solders
ArticleType: Research paper
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878570 Strategies for improving the reliability of solder joints on power semiconductor devices
Guo-Quan Lu, Xingsheng Liu, Sihua Wen, Jesus Noel Calata, John G. Bai (pp. 27-40)
Keywords: Joining processes, Semiconductor devices, Soldering, Stress (materials)
ArticleType: Research paper
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878571 CBGA solder joint thermal fatigue life estimation by a simple method
T.E. Wong, C.Y. Lau, H.S. Fenger (pp. 41-45)
Keywords: Fatigue, Joining processes, Soldering, Thermal properties of materials
ArticleType: Research paper
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1455700 Reliability testing and data analysis of lead-free solder joints for high-density packages
John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan (pp. 46-68)
Keywords: Printed-circuit boards, Product reliability, Solders
ArticleType: Research paper
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878572 Failure analysis of lead-free solder joints for high-density packages
John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan (pp. 69-76)
Keywords: Joining processes, Printed-circuit boards, Product reliability, Solders
ArticleType: Research paper
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878573 Thermal cycling reliability of lead-free chip resistor solder joints
Jeffrey C. Suhling, H.S. Gale, R. Wayne Johnson, M. Nokibul Islam, Tushar Shete, Pradeep Lall, Michael J. Bozack, John L. Evans, Ping Seto, Tarun Gupta, James R. Thompson (pp. 77-87)
Keywords: Joining processes, Product reliability, Soldering
ArticleType: Research paper
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Editorial

Editorial
Item No: Item Information
1489345 Editorial
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): Ricky Lee
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Association news

SMART Group 6th Annual Lead-Free Seminar and Table-Top Exhibition, 3 February 2004, High Wycombe
Item No: Item Information
1489346 SMART Group 6th Annual Lead-Free Seminar and Table-Top Exhibition, 3 February 2004, High Wycombe
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): John Ling
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Harsh environment applications for lead-free solder systems was the subject of a talk by Steve Brown of Cookson Electronics
Item No: Item Information
1489347 Harsh environment applications for lead-free solder systems was the subject of a talk by Steve Brown of Cookson Electronics
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): John Ling
Icon: Requires login or subscription View HTML
Smart group workshop – PCB specifications and procurement requirement, 18 February 2004
Item No: Item Information
1489348 Smart group workshop – PCB specifications and procurement requirement, 18 February 2004
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): John Ling
Icon: Requires login or subscription View HTML
European LEADOUT Project – Bob Willis, SMART Group
Item No: Item Information
1489349 European LEADOUT Project – Bob Willis, SMART Group
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): John Ling
Icon: Requires login or subscription View HTML

Industry news

Concoat Limited employee receives Electronics Award
Item No: Item Information
1489350 Concoat Limited employee receives Electronics Award
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
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Dage X-ray and Tin Technology Ltd form strong bonds
Item No: Item Information
1489351 Dage X-ray and Tin Technology Ltd form strong bonds
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
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Asymtek receives Intel Award
Item No: Item Information
1489352 Asymtek receives Intel Award
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
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DEK's 100 percent Via Fill process wins Apex 2004 Innovative Technology Showcase Award
Item No: Item Information
1489353 DEK's 100 percent Via Fill process wins Apex 2004 Innovative Technology Showcase Award
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Xidat 6600 X-ray Service Announced
Item No: Item Information
1489354 Xidat 6600 X-ray Service Announced
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
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Asymtek voted best in customer service
Item No: Item Information
1489355 Asymtek voted best in customer service
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
NPL leads project to investigate solder joint reliability during transition period to lead-free
Item No: Item Information
1489356 NPL leads project to investigate solder joint reliability during transition period to lead-free
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
DEK again voted top in customer service at Apex 2004
Item No: Item Information
1489357 DEK again voted top in customer service at Apex 2004
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
CEMCEX announces event schedule for 2004
Item No: Item Information
1489358 CEMCEX announces event schedule for 2004
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Asymtek wins SMT Magazine's 2003 Vision Award for Conformal Coating Product
Item No: Item Information
1489359 Asymtek wins SMT Magazine's 2003 Vision Award for Conformal Coating Product
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
SMT/HYBRID/PACKAGING 2004
Item No: Item Information
1489360 SMT/HYBRID/PACKAGING 2004
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Henkel Technologies enhances its Multicore® technical support team with M.O.L.E.® Technology
Item No: Item Information
1489361 Henkel Technologies enhances its Multicore® technical support team with M.O.L.E.® Technology
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal's wins Apex 2004 Innovation Technology Showcase Award
Item No: Item Information
1489362 Universal's wins Apex 2004 Innovation Technology Showcase Award
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Siplace strengthens global development and production processes
Item No: Item Information
1489363 Siplace strengthens global development and production processes
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Indium Corporation exhibited Pb-free products at APEX
Item No: Item Information
1489364 Indium Corporation exhibited Pb-free products at APEX
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal and Hitachi extend high speed placement collaboration to 2009
Item No: Item Information
1489365 Universal and Hitachi extend high speed placement collaboration to 2009
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
NPL announces new dates for improved lead-free workshops
Item No: Item Information
1489366 NPL announces new dates for improved lead-free workshops
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal Instruments and CyberOptics sign partnership agreement
Item No: Item Information
1489367 Universal Instruments and CyberOptics sign partnership agreement
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Lead-Free Solder Reliability Conference
Item No: Item Information
1489368 Lead-Free Solder Reliability Conference
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal and CeTaQ of Germany announce equipment capability assessment service cooperation
Item No: Item Information
1489369 Universal and CeTaQ of Germany announce equipment capability assessment service cooperation
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Soldertec Global announces winners of Lead-Free Solder Awards 2003
Item No: Item Information
1489370 Soldertec Global announces winners of Lead-Free Solder Awards 2003
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal and DaimlerChryslerSIM Tech. announce joint investment and technology partnership
Item No: Item Information
1489371 Universal and DaimlerChryslerSIM Tech. announce joint investment and technology partnership
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Italy distributor extends Universal infrastructure
Item No: Item Information
1489373 Italy distributor extends Universal infrastructure
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal appoints distributor in Portugal
Item No: Item Information
1489374 Universal appoints distributor in Portugal
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Siemens Dematic is honoured with the 2003 Gold Equipment Vendor Award for Siplace Service and Support
Item No: Item Information
1489375 Siemens Dematic is honoured with the 2003 Gold Equipment Vendor Award for Siplace Service and Support
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML

Appointments

Asymtek's Wesley W. Walters appointed as business development manager
Item No: Item Information
1489376 Asymtek's Wesley W. Walters appointed as business development manager
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
AIM appoints Cabiotec S.R.L. as distributor for Italy
Item No: Item Information
1489377 AIM appoints Cabiotec S.R.L. as distributor for Italy
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML

Exhibitions and conferences

ElectronicaChina and ProductronicaChina, 17-19 March 2004
Item No: Item Information
1489378 ElectronicaChina and ProductronicaChina, 17-19 March 2004
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML

International diary

International diary
Item No: Item Information
1489379 International diary
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML

New products

New lead-free solder pastes from Agmet
Item No: Item Information
1489380 New lead-free solder pastes from Agmet
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New DYMAX electronics encapsulant is ultra-flexible
Item No: Item Information
1489381 New DYMAX electronics encapsulant is ultra-flexible
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
McDry prevents micro-cracking in ICs
Item No: Item Information
1489382 McDry prevents micro-cracking in ICs
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
DEK expands next-generation stencil technology development
Item No: Item Information
1489383 DEK expands next-generation stencil technology development
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Two station system delivers powerful and efficient fume extraction
Item No: Item Information
1489384 Two station system delivers powerful and efficient fume extraction
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New vacuum pickup
Item No: Item Information
1489385 New vacuum pickup
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New μCT-50 System for 2D and 3D X-ray Inspection
Item No: Item Information
1489386 New μCT-50 System for 2D and 3D X-ray Inspection
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Highly-polished squeegees boost lead-free paste performance
Item No: Item Information
1489387 Highly-polished squeegees boost lead-free paste performance
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Asymtek introduces the DispenseMate® 550 benchtop dispensing system
Item No: Item Information
1489388 Asymtek introduces the DispenseMate® 550 benchtop dispensing system
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Robot provides economical automation for dispensing or pick and place
Item No: Item Information
1489389 Robot provides economical automation for dispensing or pick and place
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal consolidates line optimisation software onto two modules
Item No: Item Information
1489390 Universal consolidates line optimisation software onto two modules
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New safewash from Electrolube
Item No: Item Information
1489391 New safewash from Electrolube
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New rotary dispensing table
Item No: Item Information
1489392 New rotary dispensing table
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
FEINFOCUS and GÖPEL join to launch new combined AOI/AXI system
Item No: Item Information
1489393 FEINFOCUS and GÖPEL join to launch new combined AOI/AXI system
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Morgan advanced ceramics offers pressed glass spacers for circuit board applications
Item No: Item Information
1489394 Morgan advanced ceramics offers pressed glass spacers for circuit board applications
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Metcal introduces the PS-800 soldering system
Item No: Item Information
1489395 Metcal introduces the PS-800 soldering system
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New precision 50 ml twin-pack cartridge dispenser
Item No: Item Information
1489396 New precision 50 ml twin-pack cartridge dispenser
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New gantry power dispensing robots
Item No: Item Information
1489397 New gantry power dispensing robots
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
New MPM@ Gel-FlexTM Tooling available exclusively from Contax
Item No: Item Information
1489398 New MPM@ Gel-FlexTM Tooling available exclusively from Contax
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Intelligent Software turns rework into child's play
Item No: Item Information
1489399 Intelligent Software turns rework into child's play
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
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Asymtek introduces four-position "Tilt" accessory for conformal coating applications
Item No: Item Information
1489400 Asymtek introduces four-position "Tilt" accessory for conformal coating applications
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Universal expands high-speed placement range
Item No: Item Information
1489401 Universal expands high-speed placement range
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML
Lead-free soldering
Item No: Item Information
1489402 Lead-free soldering
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
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Book reviews

Electronics Assembly Technology – 2nd Edition
Item No: Item Information
1489403 Electronics Assembly Technology – 2nd Edition
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): Brian Ellis
Icon: Requires login or subscription View HTML
The Design of CMOS Radio-frequency Integrated Circuits
Item No: Item Information
1489404 The Design of CMOS Radio-frequency Integrated Circuits
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): Brian Ellis
Icon: Requires login or subscription View HTML
Bob Willis' Top Ten reference books 2004
Item No: Item Information
1489405 Bob Willis' Top Ten reference books 2004
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): Bob Willis
Icon: Requires login or subscription View HTML

Company profile

Fulleon, their switch and the wardrobe
Item No: Item Information
1489406 Fulleon, their switch and the wardrobe
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Icon: Requires login or subscription View HTML

Internet commentary

Internet commentary
Item No: Item Information
1489407 Internet commentary
Journal: Soldering & Surface Mount Technology
Vol : 16 Issue: 2
Special Issue: Solder joint reliability
Author(s): Brian Ellis
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