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Soldering & Surface Mount Technology

Volume 16 Issue 3

Published: 2004 | Start Page: 9

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Articles

Articles
Article No:	Article Information:
1455701	Dissolution rates of iron plating on soldering iron tips in molten lead-free solders Tadashi Takemoto, Takashi Uetani, Morio Yamazaki (pp. 9-15) Keywords: Soldering, Solders, Surface treatment ArticleType: Research paper View HTML \| View PDF (2005 KB) \| Reprints & Permissions
878574	A study of SMT assembly processes for fine pitch CSP packages Minna Arra, David Geiger, Dongkai Shangguan, Jonas Sjöberg (pp. 16-21) Keywords: Assembly, Solders, Surface fitting, Surface treatment ArticleType: Conceptual Paper View HTML \| View PDF (678 KB) \| Reprints & Permissions
1455702	A comparison of the quality of lead-free solder pastes Janusz Sitek, Dubravka Rocak, Krystyna Bukat, Janeta Fajfar-Plut, Darko Belavic (pp. 22-30) Keywords: Electronics industry, Solders, Strength of materials, Viscosity ArticleType: Research paper View HTML \| View PDF (1789 KB) \| Reprints & Permissions
1455703	Dissolution of solids in contact with liquid solder Samjid Mannan, Michael P. Clode (pp. 31-33) Keywords: Physical properties of materials, Soldering ArticleType: Research paper View HTML \| View PDF (247 KB) \| Reprints & Permissions

Editorial

Editorial
Item No:	Item Information
1489408	Editorial Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 Author(s): David Boswell View HTML

Industry news

Allied Vision Technologies’ “Golden Camera” goes to Siplace
Item No:	Item Information
1489409	Allied Vision Technologies’ “Golden Camera” goes to Siplace Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Kester honoured by Intel
Item No:	Item Information
1489410	Kester honoured by Intel Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Assembléon strengthens its Asian operation
Item No:	Item Information
1489411	Assembléon strengthens its Asian operation Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Teddington launches lead phase-out in line with RoHS directive
Item No:	Item Information
1489412	Teddington launches lead phase-out in line with RoHS directive Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Soldertec Global requests nominations for 2004 Lead-free Solder Awards
Item No:	Item Information
1489413	Soldertec Global requests nominations for 2004 Lead-free Solder Awards Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

DEK signs new distributor in Ireland
Item No:	Item Information
1489414	DEK signs new distributor in Ireland Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Universal shows its fastest platform based placement machine
Item No:	Item Information
1489415	Universal shows its fastest platform based placement machine Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

NEMI group releases draft proposal of Tin Whisker acceptance test requirements
Item No:	Item Information
1489416	NEMI group releases draft proposal of Tin Whisker acceptance test requirements Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

FEINFOCUS launches X-ray inspection technology seminar program
Item No:	Item Information
1489417	FEINFOCUS launches X-ray inspection technology seminar program Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

DEK engineer Rachel helps training company ITE set new standards
Item No:	Item Information
1489418	DEK engineer Rachel helps training company ITE set new standards Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

AIM announces sales and support network expansions
Item No:	Item Information
1489419	AIM announces sales and support network expansions Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Appointments

Universal welcomes high-tech leader, as new direct sales office in Brazil signals renewed Americas expansion
Item No:	Item Information
1489420	Universal welcomes high-tech leader, as new direct sales office in Brazil signals renewed Americas expansion Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Indium hires new marketing director in Europe
Item No:	Item Information
1489421	Indium hires new marketing director in Europe Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Exhibitions and conferences

NEPCON 2004, Brighton, Sussex, England, May 26th-27th 2004
Item No:	Item Information
1489422	NEPCON 2004, Brighton, Sussex, England, May 26th-27th 2004 Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

IPC and Soldertec
Item No:	Item Information
1489423	IPC and Soldertec Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

SMT/HYBRID/PACKAGING 2004 a huge success
Item No:	Item Information
1489424	SMT/HYBRID/PACKAGING 2004 a huge success Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Hands-On Lead-Free Workshop Provides Unique Perspective
Item No:	Item Information
1489425	Hands-On Lead-Free Workshop Provides Unique Perspective Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

SSTC – Soldering Science & Technology Club, Summer Conference 2004, National Physical Laboratory, Teddington, Middlesex, 15 June
Item No:	Item Information
1489426	SSTC – Soldering Science & Technology Club, Summer Conference 2004, National Physical Laboratory, Teddington, Middlesex, 15 June Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 Author(s): John Ling View HTML

International diary

International diary
Item No:	Item Information
1489427	International diary Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

New products

New features enhance the flexibility of Assembléon GEM machines
Item No:	Item Information
1489428	New features enhance the flexibility of Assembléon GEM machines Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

New Advantis™ provides high-end flip chip capability at an entry-level price
Item No:	Item Information
1489429	New Advantis™ provides high-end flip chip capability at an entry-level price Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

New DEK stencils enable multiple deposit heights in a single pass
Item No:	Item Information
1489430	New DEK stencils enable multiple deposit heights in a single pass Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

SIRA ensures success in the US for Newson Gale’s new range of hazardous area products
Item No:	Item Information
1489431	SIRA ensures success in the US for Newson Gale’s new range of hazardous area products Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

TBA ECP introduces new improved two-ply static dissipative matting
Item No:	Item Information
1489432	TBA ECP introduces new improved two-ply static dissipative matting Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Water-soluble solder paste cuts out waste
Item No:	Item Information
1489433	Water-soluble solder paste cuts out waste Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

TBA ECP introduces new flexible ion nozzle for repetitive cleaning tasks
Item No:	Item Information
1489434	TBA ECP introduces new flexible ion nozzle for repetitive cleaning tasks Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Spectrometer gets the measure of PB contamination
Item No:	Item Information
1489435	Spectrometer gets the measure of PB contamination Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Foresite and GoodBye Chain Group launch RoHS-WEEE.NET
Item No:	Item Information
1489436	Foresite and GoodBye Chain Group launch RoHS-WEEE.NET Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

DuPont Electronic Technologies introduces WB dry photoresist for semiconductor wafer bumping at Semicon Europe
Item No:	Item Information
1489437	DuPont Electronic Technologies introduces WB dry photoresist for semiconductor wafer bumping at Semicon Europe Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Solder eases switch to lead-free processing
Item No:	Item Information
1489438	Solder eases switch to lead-free processing Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Quadris™ from Universal Instruments delivers concentrated high volume placement
Item No:	Item Information
1489439	Quadris™ from Universal Instruments delivers concentrated high volume placement Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Stencil system claims best of both worlds
Item No:	Item Information
1489440	Stencil system claims best of both worlds Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 View HTML

Book review

Survival for a Small Planet
Item No:	Item Information
1489441	Survival for a Small Planet Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 Author(s): Brian Ellis View HTML

Internet commentary

Internet commentary
Item No:	Item Information
1489442	Internet commentary Journal: Soldering & Surface Mount Technology Vol : 16 Issue: 3 Author(s): Brian Ellis View HTML