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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1770749	Ultrasonic bonding of flexible PCB to rigid PCB using an Sn interlayer Kyoo-Seok Kim, Jae-Pil Jung, Y. Norman Zhou (pp. 4-10) Keywords: Bonding, Joining processes, Printed circuits ArticleType: Research paper View HTML | View PDF (262 KB) | Reprints & Permissions
1770750	Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging Stoyan Stoyanov, Chris Bailey, Marc Desmulliez (pp. 11-24) Keywords: Optimization, Product reliability, Prototypes, Techniques ArticleType: Research paper View HTML | View PDF (912 KB) | Reprints & Permissions
1770751	Geometry control of solder interconnects via induction heating Hongbo Xu, Mingyu Li, Yonggao Fu, Ling Wang, Jongmyung Kim (pp. 25-30) Keywords: Circuit boards, Heating, Soldering ArticleType: Research paper View HTML | View PDF (319 KB) | Reprints & Permissions
1770752	Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis Chang-Chun Lee, Kuo-Chin Chang, Ya-Wen Yang (pp. 31-41) Keywords: Finite element analysis, Joining processes, Solder ArticleType: Research paper View HTML | View PDF (333 KB) | Reprints & Permissions

Editorial

Editorial

Item No:	Item Information
1770753	Editorial Vol : 21 Issue: 1 Author(s): Martin Goosey View HTML

Appointments

ASML Supervisory Board nominates Pauline van der Meer Mohr as new member

Item No:	Item Information
1770754	ASML Supervisory Board nominates Pauline van der Meer Mohr as new member Vol : 21 Issue: 1 View HTML

OK International appoints new China Sales Director

Item No:	Item Information
1770755	OK International appoints new China Sales Director Vol : 21 Issue: 1 View HTML

Industry news

IET to sign up with UKRC’s CEO charter

Item No:	Item Information
1770756	IET to sign up with UKRC’s CEO charter Vol : 21 Issue: 1 View HTML

Surface mounting (the equine version) from Intertronics

Item No:	Item Information
1770757	Surface mounting (the equine version) from Intertronics Vol : 21 Issue: 1 View HTML

HumiSeal® redefines conformal coating selection with launch of industry leading website

Item No:	Item Information
1770758	HumiSeal® redefines conformal coating selection with launch of industry leading website Vol : 21 Issue: 1 View HTML

DEK solar offers fast-track to efficient commercial photovoltaic production

Item No:	Item Information
1770759	DEK solar offers fast-track to efficient commercial photovoltaic production Vol : 21 Issue: 1 View HTML

Novatec continues their tradition of breakthrough technologies at Forum de l’electronique

Item No:	Item Information
1770760	Novatec continues their tradition of breakthrough technologies at Forum de l’electronique Vol : 21 Issue: 1 View HTML

Low-cost Panasonic CM101 modular placement machine wins tough selection battle at Murata Power Solutions

Item No:	Item Information
1770761	Low-cost Panasonic CM101 modular placement machine wins tough selection battle at Murata Power Solutions Vol : 21 Issue: 1 View HTML

High bar count metal encoder disks enable accurate optical measurement and control

Item No:	Item Information
1770762	High bar count metal encoder disks enable accurate optical measurement and control Vol : 21 Issue: 1 View HTML

Advanced directory solves the problems of solder stencil efficiency

Item No:	Item Information
1770763	Advanced directory solves the problems of solder stencil efficiency Vol : 21 Issue: 1 View HTML

Exhibitions and conferences

ESTC 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London

Item No:	Item Information
1770764	ESTC 2008 – 2nd Electronics System Integration Technology Conference, 1-4 September 2008, The University of Greenwich, London Vol : 21 Issue: 1 Author(s): Martin Goosey and Darren Cadman View HTML

International diary

International diary

Item No:	Item Information
1770765	International diary Vol : 21 Issue: 1 View HTML

New products

DEK boosts throughput and flexibility with new Dual Lane RTC platform

Item No:	Item Information
1770766	DEK boosts throughput and flexibility with new Dual Lane RTC platform Vol : 21 Issue: 1 View HTML

New OK International Multi-Function Rework System provides process control, value and flexibility

Item No:	Item Information
1770767	New OK International Multi-Function Rework System provides process control, value and flexibility Vol : 21 Issue: 1 View HTML

New Universal AdVantisX from Contax – Genesis Technology on a Budget

Item No:	Item Information
1770768	New Universal AdVantisX from Contax – Genesis Technology on a Budget Vol : 21 Issue: 1 View HTML

ThreeBond 30F-404 UV/visible light cure adhesive

Item No:	Item Information
1770769	ThreeBond 30F-404 UV/visible light cure adhesive Vol : 21 Issue: 1 View HTML

Second generation C5 from Contax cost-effective high throughput placement system

Item No:	Item Information
1770770	Second generation C5 from Contax cost-effective high throughput placement system Vol : 21 Issue: 1 View HTML

Intertronics – fine mist lubricant system

Item No:	Item Information
1770771	Intertronics – fine mist lubricant system Vol : 21 Issue: 1 View HTML

DEK extends Instinctiv™ V9 software capabilities with 2D inspection control

Item No:	Item Information
1770772	DEK extends Instinctiv™ V9 software capabilities with 2D inspection control Vol : 21 Issue: 1 View HTML