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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1782706	Properties of two new medium temperature solders Chunyuan Li, Xitao Wang, Wenxia Yuan (pp. 4-8) Keywords: Alloys, High temperatures, Solders ArticleType: Research paper View HTML | View PDF (293 KB) | Reprints & Permissions
1782707	Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles C.D. Zou, Y.L. Gao, B. Yang, Q.J. Zhai, C. Andersson, J. Liu (pp. 9-13) Keywords: Alloys, Lead, Melting point, Nanotechnology, Solders ArticleType: Research paper View HTML | View PDF (339 KB) | Reprints & Permissions
1782708	The growth behaviours of IMC layers in solid-liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields Cong-qian Cheng, Jie Zhao, Yang Xu, Fu-Min Xu, Ming-liang Huang (pp. 14-18) Keywords: Composite materials, Magnetic fields, Physical properties of materials, Solders ArticleType: Research paper View HTML | View PDF (601 KB) | Reprints & Permissions
1782709	Interfacial reactions between Sn-Cu based multicomponent solders and Ni substrates during soldering and aging Ning Zhao, Hai-tao Ma, Lai Wang (pp. 19-23) Keywords: Chemical reactions, Soldering, Solders ArticleType: Research paper View HTML | View PDF (290 KB) | Reprints & Permissions
1782710	Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC) M. Norén, S. Brunner, C. Hoffmann, W. Salz, K. Aichholzer (pp. 24-27) Keywords: Ceramics, Electronics industry, Product reliability, Temperature measurement ArticleType: Research paper View HTML | View PDF (418 KB) | Reprints & Permissions
1782711	Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages C. Andersson, B. Vandevelde, C. Noritake, P. Sun, P.E. Tegehall, D.R. Andersson, G. Wetter, J. Liu (pp. 28-38) Keywords: Finite element analysis, Lead, Modelling, Solders, Stress (materials), Thermal testing ArticleType: Research paper View HTML | View PDF (546 KB) | Reprints & Permissions
1782712	A study of thermo-mechanical reliability of lead-free PTH solder joints Jennifer Nguyen, David Geiger, Dan Rooney, Dongkai Shangguan (pp. 39-47) Keywords: Joining processes, Lead, Soldering, Waves ArticleType: Research paper View HTML | View PDF (455 KB) | Reprints & Permissions
1782713	Coffin-Manson equation of Sn-4.0Ag-0.5Cu solder joint S. Chen, P. Sun, X.C. Wei, Z.N. Cheng, J. Liu (pp. 48-54) Keywords: Finite element analysis, Joining processes, Shear strength, Soldering, Stress (materials) ArticleType: Research paper View HTML | View PDF (346 KB) | Reprints & Permissions

Guest editorial

Selected papers from HDP’07

Item No:	Item Information
1782714	Selected papers from HDP’07 Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) Author(s): Johan Liu, Daoqiang Lu, Cristina Andersson View HTML

Appointments

SMART Group Elect Keith Bryant as New Chairman

Item No:	Item Information
1782715	SMART Group Elect Keith Bryant as New Chairman Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

DEK Solar expands global reach with new additions

Item No:	Item Information
1782716	DEK Solar expands global reach with new additions Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

Industry news

PartnerTech adds new SMT line and AOI equipment to Cambridge NPI facility

Item No:	Item Information
1782717	PartnerTech adds new SMT line and AOI equipment to Cambridge NPI facility Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

New Siemens SMT insights technology brochure covers “Vision”: why vision systems are so important in electronics production

Item No:	Item Information
1782718	New Siemens SMT insights technology brochure covers “Vision”: why vision systems are so important in electronics production Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

Metcal customers go for gold with proven solder technologies

Item No:	Item Information
1782719	Metcal customers go for gold with proven solder technologies Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

Exhibitions and conferences

iMAPS – Basic Packaging Workshop, 4 December 2008, Unisem Europe Ltd, Croespenmaen, Newport

Item No:	Item Information
1782720	iMAPS – Basic Packaging Workshop, 4 December 2008, Unisem Europe Ltd, Croespenmaen, Newport Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

EPTC 2008, Electronics Packaging Technology Conference, 9-12 December, Grand Copthorne, Waterfront Hotel, Singapore

Item No:	Item Information
1782721	EPTC 2008, Electronics Packaging Technology Conference, 9-12 December, Grand Copthorne, Waterfront Hotel, Singapore Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) Author(s): Martin Goosey View HTML

International diary

International diary

Item No:	Item Information
1782722	International diary Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

New products

ThreeBond 1530 elastic adhesive

Item No:	Item Information
1782769	ThreeBond 1530 elastic adhesive Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

Aries Electronics patented CSP/BallNest hybrid socket provides reliable, consistent test and burn-in down to 0.30 mm pitch

Item No:	Item Information
1782770	Aries Electronics patented CSP/BallNest hybrid socket provides reliable, consistent test and burn-in down to 0.30 mm pitch Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

Intertronics moves conformal coating ahead of the game

Item No:	Item Information
1782771	Intertronics moves conformal coating ahead of the game Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

Essemtec launch new semi-automatic printer in the UK

Item No:	Item Information
1782772	Essemtec launch new semi-automatic printer in the UK Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

HumiSeal® redefines conformal coating selection with launch of industry leading web site

Item No:	Item Information
1782773	HumiSeal® redefines conformal coating selection with launch of industry leading web site Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

Metcal launches new state-of-the-art web site

Item No:	Item Information
1782774	Metcal launches new state-of-the-art web site Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML

The Highway Code of Stencils

Item No:	Item Information
1782775	The Highway Code of Stencils Vol : 21 Issue: 2 Special Issue: Selected Papers from the 9th International Symposium on High Density Design, Packaging and Microsystem Integration (HDP'07) View HTML