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Microelectronics International


Volume 26 Issue 2

Published: 2009 | Start Page: 3

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Articles

Articles
Article No: Article Information:
1789357 Comparison of low cost, insulated aluminium substrates used as integrated heat sinks with conventional technology
E. Eisermann, K. Höll, W. Smetana, W. Tusler, M. Unger, J. Whitmarsh (pp. 3-9)
Keywords: Films (states of matter), Light-emitting diodes, Semiconductor devices, Substrates, Thermal conductivity
ArticleType: Research paper
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1789358 Fine and ultra-fine pitch wire bonding: challenges and solutions
Z.W. Zhong (pp. 10-18)
Keywords: Bonding, Copper, Electronic engineering, Wires
ArticleType: General review
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1789359 Ruthenium dioxide doped manganite-based NTC thermistors for low-resistance applications
Shweta Jagtap, Sunit Rane, Suresh Gosavi, Dinesh Amalnerkar (pp. 19-23)
Keywords: Electrical properties, Minerals, Semiconductor devices, Solid state physics
ArticleType: Research paper
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1789360 Influence of solution acidity on composition, structure and electrical parameters of Ni-P alloys
Z. Pruszowski, P. Kowalik, M. Ciez, J. Kulawik (pp. 24-27)
Keywords: Alloys, Electrical resistivity, Metallizing, Resistors, Thin film
ArticleType: Research paper
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1789361 Polymer-metal nano-composite films for thermal management
Björn Carlberg, Teng Wang, Johan Liu, Dongkai Shangguan (pp. 28-36)
Keywords: Composite materials, Electronic engineering, Films (states of matter), Thermal conductivity, Thermal resistance
ArticleType: Research paper
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1789362 Comparison between models for p-n junctions parameters extraction
G.C. Pesenti, H. Boudinov (pp. 37-40)
Keywords: Chemical technology, Diodes, Gases, Series, Sintering
ArticleType: Conceptual paper
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1789363 Silicon Schottky barrier photodiodes with a thin AlN nucleation layer
L.S. Chuah, Z. Hassan, H. Abu Hassan, C.W. Chin, S.M. Thahab, S.C. Teoh (pp. 41-44)
Keywords: Diodes, Nucleation, Photodiodes, Schottky-barrier diodes
ArticleType: Conceptual paper
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1789364 Electrical properties and electrical equivalent models of thick-film and LTCC microcapacitors
Edward Mis, Andrzej Dziedzic, Karol Nitsch (pp. 45-50)
Keywords: Capacitors, Chemical technology, Electrical properties, Thick-film circuits
ArticleType: Research paper
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Industry news

Moscow Metro: the world’s first major transport system to operate fully contactless with NXP’s MIFARE technology
Item No: Item Information
1789365 Moscow Metro: the world’s first major transport system to operate fully contactless with NXP’s MIFARE technology
Vol : 26 Issue: 2
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Fairchild Semiconductor’s European power seminars provide design solutions to enable energy-efficiency
Item No: Item Information
1789366 Fairchild Semiconductor’s European power seminars provide design solutions to enable energy-efficiency
Vol : 26 Issue: 2
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Embedded Systems Show 2008 delivers “first-rate business leads”
Item No: Item Information
1789367 Embedded Systems Show 2008 delivers “first-rate business leads”
Vol : 26 Issue: 2
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Rutronik receives “Distributor of the Year 2008 Award” from Samsung Electro-Mechanics GmbH
Item No: Item Information
1789368 Rutronik receives “Distributor of the Year 2008 Award” from Samsung Electro-Mechanics GmbH
Vol : 26 Issue: 2
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DEK delivers solar solutions for the thin-film generation
Item No: Item Information
1789369 DEK delivers solar solutions for the thin-film generation
Vol : 26 Issue: 2
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Orolia acquires Rapco Electronics extending reach of time and frequency sales
Item No: Item Information
1789370 Orolia acquires Rapco Electronics extending reach of time and frequency sales
Vol : 26 Issue: 2
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Applied Nanotech Holdings, Inc. expands research agreement
Item No: Item Information
1789371 Applied Nanotech Holdings, Inc. expands research agreement
Vol : 26 Issue: 2
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Appointments

AVG Technologies names Craig Kensek Global Product Reviews Director
Item No: Item Information
1789372 AVG Technologies names Craig Kensek Global Product Reviews Director
Vol : 26 Issue: 2
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International diary

International diary
Item No: Item Information
1789373 International diary
Vol : 26 Issue: 2
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New products

Lantronix unveils enhanced software development kit for its embedded wired and wireless modules
Item No: Item Information
1789374 Lantronix unveils enhanced software development kit for its embedded wired and wireless modules
Vol : 26 Issue: 2
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New NXP platform brings viewing experience of the future to mainstream flat TVs now
Item No: Item Information
1789375 New NXP platform brings viewing experience of the future to mainstream flat TVs now
Vol : 26 Issue: 2
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Cadence unveils next-generation parallel circuit simulator for the verification of complex analogue and mixed-signal integrated circuit designs
Item No: Item Information
1789376 Cadence unveils next-generation parallel circuit simulator for the verification of complex analogue and mixed-signal integrated circuit designs
Vol : 26 Issue: 2
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New LFR complements CWT from power electronic measurements
Item No: Item Information
1789377 New LFR complements CWT from power electronic measurements
Vol : 26 Issue: 2
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Fairchild semiconductor’s 300 mA low VIN low-dropout offers higher efficiency in less space for digital applications
Item No: Item Information
1789378 Fairchild semiconductor’s 300 mA low VIN low-dropout offers higher efficiency in less space for digital applications
Vol : 26 Issue: 2
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LDO regulator offers stable output without requiring a load capacitor
Item No: Item Information
1789379 LDO regulator offers stable output without requiring a load capacitor
Vol : 26 Issue: 2
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Light enhancing, heat dissipating silicones from Intertronics
Item No: Item Information
1789380 Light enhancing, heat dissipating silicones from Intertronics
Vol : 26 Issue: 2
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New ITS from Versaperm Ltd
Item No: Item Information
1789381 New ITS from Versaperm Ltd
Vol : 26 Issue: 2
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C&K develops micro-miniature pendulum detect switch with top and side actuation
Item No: Item Information
1789382 C&K develops micro-miniature pendulum detect switch with top and side actuation
Vol : 26 Issue: 2
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Microchip technology announces 1.5 A MOSFET drivers in SOT-23 package
Item No: Item Information
1789383 Microchip technology announces 1.5 A MOSFET drivers in SOT-23 package
Vol : 26 Issue: 2
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Aries Electronics’ new 6.5 mm centre probe test socket features versatile design ideal for test and burn-in
Item No: Item Information
1789384 Aries Electronics’ new 6.5 mm centre probe test socket features versatile design ideal for test and burn-in
Vol : 26 Issue: 2
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Elgar XWave AC power source/frequency converter combines high-current capability and modular architecture
Item No: Item Information
1789385 Elgar XWave AC power source/frequency converter combines high-current capability and modular architecture
Vol : 26 Issue: 2
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