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Circuit World


Volume 35 Issue 2

Published: 2009 | Start Page: 3

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Articles

Articles
Article No: Article Information:
1789930 A direct-writing approach to the micro-patterning of copper onto polyimide
J.H.-G. Ng, M.P.Y. Desmulliez, M. Lamponi, B.G. Moffat, A. McCarthy, H. Suyal, A.C. Walker, K.A. Prior, D.P. Hand (pp. 3-17)
Keywords: Copper, Electronic engineering, Lasers, Metallizing, Polymers
ArticleType: Research paper
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1789931 Cracking phenomena on flexible-rigid interfaces in PCBs under thermo cycling loading
Luciano Arruda, Renato Bonadiman, Josineto Costa, Tommi Reinikainen (pp. 18-22)
Keywords: Failure, Finite element analysis, Modes and effects analysis, Printed circuits
ArticleType: Research paper
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1789932 A multilayer process for the connection of fine-pitch-devices on molded interconnect devices (MIDs)
Thomas Leneke, Soeren Hirsch, Bertram Schmidt (pp. 23-29)
Keywords: Adhesion, Metallization, Semiconductor technology
ArticleType: Research paper
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1789933 Low-power noise multilayer PCB with discrete decoupling capacitors inside
Ki-Jae Song, Jongmin Kim, Jongwoon Yoo, Wansoo Nah, Jaeil Lee, Hyunseop Sim (pp. 30-36)
Keywords: Capacitors, Electric power supplies, Electric power transmission, Printed circuits, Switching systems
ArticleType: Research paper
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1789934 Reflow ageing influences and wettability effects of immersion tin final finishes with lead-free solder
Thomas Hetschel, Klaus-Jürgen Wolter, Fritz Phillipp (pp. 37-44)
Keywords: Metals, Printed circuits, Soldering, Solders
ArticleType: Research paper
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Industry news

AT&S moves Klagenfurt plant to short-time working
Item No: Item Information
1789935 AT&S moves Klagenfurt plant to short-time working
Vol : 35 Issue: 2
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Artetch achieves Green Belt in quality training
Item No: Item Information
1789936 Artetch achieves Green Belt in quality training
Vol : 35 Issue: 2
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RUWEL offers masslam production as a service
Item No: Item Information
1789937 RUWEL offers masslam production as a service
Vol : 35 Issue: 2
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IPC issues updated world PCB production and laminate market report
Item No: Item Information
1789938 IPC issues updated world PCB production and laminate market report
Vol : 35 Issue: 2
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SOMACIS GRAPHIC announces TUV ISO/TS 16949 awarded to Dongguan Somacis Graphic
Item No: Item Information
1789939 SOMACIS GRAPHIC announces TUV ISO/TS 16949 awarded to Dongguan Somacis Graphic
Vol : 35 Issue: 2
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Researchers recycle circuit boards as road paving material
Item No: Item Information
1789940 Researchers recycle circuit boards as road paving material
Vol : 35 Issue: 2
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UK researchers explore using laser technology as a low-cost, chemical-free method of making PCBs
Item No: Item Information
1789941 UK researchers explore using laser technology as a low-cost, chemical-free method of making PCBs
Vol : 35 Issue: 2
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HannStar Board expected to take a 50-70 per cent global share of netbook PCB market in 2009
Item No: Item Information
1789942 HannStar Board expected to take a 50-70 per cent global share of netbook PCB market in 2009
Vol : 35 Issue: 2
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Selection of DEK Horizon 03i underpins DCI quality commitment
Item No: Item Information
1789943 Selection of DEK Horizon 03i underpins DCI quality commitment
Vol : 35 Issue: 2
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Camtek reports additional cost-reduction measures, cuts 14 per cent of worldwide work force or 68 employees
Item No: Item Information
1789944 Camtek reports additional cost-reduction measures, cuts 14 per cent of worldwide work force or 68 employees
Vol : 35 Issue: 2
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Appointments

Daleba appoints new CEO
Item No: Item Information
1789945 Daleba appoints new CEO
Vol : 35 Issue: 2
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Gary R. Sutcliffe Promoted to Manager, Corporate Technical Services – Enthone Americas
Item No: Item Information
1789946 Gary R. Sutcliffe Promoted to Manager, Corporate Technical Services – Enthone Americas
Vol : 35 Issue: 2
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GSPK Design expands electronic design team
Item No: Item Information
1789947 GSPK Design expands electronic design team
Vol : 35 Issue: 2
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Arthur Huenecke joins IPC as chief information officer
Item No: Item Information
1789948 Arthur Huenecke joins IPC as chief information officer
Vol : 35 Issue: 2
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Conferences and exhibitions

Electronica 2008
Item No: Item Information
1789949 Electronica 2008
Vol : 35 Issue: 2
Author(s): John Ling
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Technology breakthroughs – bending the design rules
Item No: Item Information
1789950 Technology breakthroughs – bending the design rules
Vol : 35 Issue: 2
Author(s): Peter Starkey
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iMAPS – Basic Packaging Workshop, 4 December 2008, Unisem Europe Ltd, Croespenmaen, Newport
Item No: Item Information
1789951 iMAPS – Basic Packaging Workshop, 4 December 2008, Unisem Europe Ltd, Croespenmaen, Newport
Vol : 35 Issue: 2
Author(s): Martin Goosey
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EPTC 2008 – Electronics Packaging Technology Conference, 9-12 December, Grand Copthorne Waterfront Hotel, Singapore
Item No: Item Information
1789952 EPTC 2008 – Electronics Packaging Technology Conference, 9-12 December, Grand Copthorne Waterfront Hotel, Singapore
Vol : 35 Issue: 2
Author(s): Martin Goosey
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EIPC Winter Conference Review – Amsterdam, 12-13 February 2009
Item No: Item Information
1789953 EIPC Winter Conference Review – Amsterdam, 12-13 February 2009
Vol : 35 Issue: 2
Author(s): Pete Starkey
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New products

Enthone introduces OrmeSTAR™ Ultra Nanofinish®, organic metal-based PWB final finish
Item No: Item Information
1789954 Enthone introduces OrmeSTAR™ Ultra Nanofinish®, organic metal-based PWB final finish
Vol : 35 Issue: 2
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