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Soldering & Surface Mount Technology

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Articles

Articles

Article No:	Article Information:
1795943	Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints Yi-Shao Lai, C.R. Kao, Hsiao-Chuan Chang, Chin-Li Kao (pp. 4-9) Keywords: Impact strength, Joining processes, Soldering, Surface tension ArticleType: Research paper View HTML | View PDF (323 KB) | Reprints & Permissions
1795944	Edge tail length effect on reliability of DBC substrates under thermal cycling Guangcheng Dong, Guangyin (Thomas) Lei, Xu Chen, Khai Ngo, Guo-Quan Lu (pp. 10-15) Keywords: Copper, Fatigue, High temperatures, Packaging, Substrates, Thermal properties of materials ArticleType: Research paper View HTML | View PDF (201 KB) | Reprints & Permissions
1795945	Effect of substrate material and thickness on reliability of ACA bonded flip chip joints Laura Frisk, Anne Cumini (pp. 16-23) Keywords: Adhesives, Joining materials, Liquid crystal polymers, Reliability management, Substrates ArticleType: Research paper View HTML | View PDF (246 KB) | Reprints & Permissions
1795946	Composite coating structure in an implantable electronic device Kati Kokko, Hanna Harjunpää, Pekka Heino, Minna Kellomäki (pp. 24-29) Keywords: Adhesives, Coatings technology, Flipchips, Joining materials ArticleType: Research paper View HTML | View PDF (310 KB) | Reprints & Permissions
1795947	Reliability analysis of a novel fan-out type WLP Ming-Chih Yew, Mars Tsai, Dyi-Chung Hu, Wen-Kun Yang, Kuo-Ning Chiang (pp. 30-38) Keywords: Finite element analysis, Packaging, Predictive process, Reliability management, Stress (materials) ArticleType: Research paper View HTML | View PDF (525 KB) | Reprints & Permissions
1795948	Six sigma analysis of SMD feeding parameters and board assembly quality Pekka Kytösaho, Timo Liukkonen (pp. 39-46) Keywords: Printed circuits, Six sigma, Surface mount technology ArticleType: Research paper View HTML | View PDF (289 KB) | Reprints & Permissions

Editorial

Editorial

Item No:	Item Information
1795949	Editorial Vol : 21 Issue: 3 Author(s): Martin Goosey View HTML

Appointments

Electrolube appoints Gary Peacock to Commercial Director for the HK Wentworth Group

Item No:	Item Information
1795950	Electrolube appoints Gary Peacock to Commercial Director for the HK Wentworth Group Vol : 21 Issue: 3 View HTML

Alpha appoints new VP Sales Europe

Item No:	Item Information
1795951	Alpha appoints new VP Sales Europe Vol : 21 Issue: 3 View HTML

Industry news

SMART Group welcomes Walt Custer to Ricoh Arena

Item No:	Item Information
1795952	SMART Group welcomes Walt Custer to Ricoh Arena Vol : 21 Issue: 3 View HTML

AdoptSMT group strengthens activities in Hungary

Item No:	Item Information
1795953	AdoptSMT group strengthens activities in Hungary Vol : 21 Issue: 3 View HTML

Encon named new SIPLACE partner for Poland

Item No:	Item Information
1795954	Encon named new SIPLACE partner for Poland Vol : 21 Issue: 3 View HTML

Pre-owned electronic assembly equipment company AdoptSMT reinforces their core competences

Item No:	Item Information
1795955	Pre-owned electronic assembly equipment company AdoptSMT reinforces their core competences Vol : 21 Issue: 3 View HTML

HumiSeal® announces significant investment in R&D facilities and services

Item No:	Item Information
1795956	HumiSeal® announces significant investment in R&D facilities and services Vol : 21 Issue: 3 View HTML

Ovation Products celebrates SMT Vision Award win for innovative dispensing technology

Item No:	Item Information
1795957	Ovation Products celebrates SMT Vision Award win for innovative dispensing technology Vol : 21 Issue: 3 View HTML

International diary

International diary

Item No:	Item Information
1795958	International diary Vol : 21 Issue: 3 View HTML

New products

Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste

Item No:	Item Information
1795959	Cookson Electronics launches ALPHA® WS-820 halide-free, lead-free, water soluble solder paste Vol : 21 Issue: 3 View HTML

LPKF laser shoots 680,000 circular holes per hour

Item No:	Item Information
1795960	LPKF laser shoots 680,000 circular holes per hour Vol : 21 Issue: 3 View HTML

Huge selection of new standard colours for Vero Technologies’ plastic enclosures

Item No:	Item Information
1795961	Huge selection of new standard colours for Vero Technologies’ plastic enclosures Vol : 21 Issue: 3 View HTML

DEK launches new stencil solution for ultra fine-pitch printing

Item No:	Item Information
1795962	DEK launches new stencil solution for ultra fine-pitch printing Vol : 21 Issue: 3 View HTML

Siplace Precedence Finder optimizes placement sequence: effective collision protection for the placement process

Item No:	Item Information
1795963	Siplace Precedence Finder optimizes placement sequence: effective collision protection for the placement process Vol : 21 Issue: 3 View HTML

Alpha launches Advanced ALPHA Telecore XL-806 Pb-free cored wire

Item No:	Item Information
1795964	Alpha launches Advanced ALPHA Telecore XL-806 Pb-free cored wire Vol : 21 Issue: 3 View HTML

HumiSeal® continues to support customers’ applications with range of gel-based coating products

Item No:	Item Information
1795965	HumiSeal® continues to support customers’ applications with range of gel-based coating products Vol : 21 Issue: 3 View HTML

Vantage X-ray from Contax

Item No:	Item Information
1795966	Vantage X-ray from Contax Vol : 21 Issue: 3 View HTML

Simultaneous lead and lead-free convection soldering from Rehm Thermal Systems

Item No:	Item Information
1795967	Simultaneous lead and lead-free convection soldering from Rehm Thermal Systems Vol : 21 Issue: 3 View HTML

Low temperature cure surface mount adhesive bonds micro-chips in place at 80°C

Item No:	Item Information
1795968	Low temperature cure surface mount adhesive bonds micro-chips in place at 80°C Vol : 21 Issue: 3 View HTML