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Microelectronics International


Volume 26 Issue 3

Published: 2009 | Start Page: 3

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Articles

Articles
Article No: Article Information:
1801313 Novel layout technique for on-chip inductance minimization
V.T.S. Dao, T.G. Etoh, M. Tanaka, T. Akino (pp. 3-8)
Keywords: Image sensors, Inductance, Integrated circuit technology
ArticleType: Research paper
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1801314 A highly miniaturized wireless inertial sensor using a novel 3D flexible circuit
J. Buckley, B. O'Flynn, J. Barton, S.C. O'Mathuna (pp. 9-21)
Keywords: MEMS, Motion, Printed circuits, Sensors
ArticleType: Research paper
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1801315 Exploiting narrow values for faster parity generation
Yusuf Onur Koçberber, Yusuf Osmanlioglu, Oguz Ergin (pp. 22-29)
Keywords: Circuits, Codes, Error analysis
ArticleType: Research paper
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1801316 Micro-flow sensor for water using NTC thick film segmented thermistors
O.S. Aleksic, S.M. Savic, M.V. Nikolic, L. Sibinoski, M.D. Lukovic (pp. 30-34)
Keywords: Flow measurement, Resistors, Sensors, Water
ArticleType: Research paper
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1801317 Application of a low-glitch current cell in 10-bit CMOS current-steering DAC
Zhi-Yuan Cui, Joong-Ho Choi, Yeong-Seuk Kim, Shi-Ho Kim, Nam-Soo Kim (pp. 35-40)
Keywords: Electric converters, Electric current, Electric power transmission, Semiconductors
ArticleType: Research paper
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1801318 Chemical characterization of failures and process materials for microelectronics assembly
Chien-Yi Huang, Ming-Shu Li, Chen-Liang Ku, Hao-Chun Hsieh, Kung-Cheng Li (pp. 41-48)
Keywords: Assembling, Chemical properties of materials, Contamination, Electronic engineering, Quality control
ArticleType: Technical paper
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1801319 Effects of process variation in VLSI interconnects – a technical review
K.G. Verma, B.K. Kaushik, R. Singh (pp. 49-55)
Keywords: Integrated circuit technology, Operations and production management
ArticleType: Technical paper
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1801320 Response of Ag thick film microstrip equilateral triangular patch antenna to overlay of moisture laden soybean
Vaishali Mane, Vijaya Puri (pp. 56-59)
Keywords: Dielectric properties, Microwaves, Soya, Thick film patch antenna
ArticleType: Research paper
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Industry news

Fujitsu Microelectronics and TSMC to collaborate on leading edge process technology
Item No: Item Information
1801321 Fujitsu Microelectronics and TSMC to collaborate on leading edge process technology
Vol : 26 Issue: 3
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IMAPS-UK Annual General Meeting 2009
Item No: Item Information
1801322 IMAPS-UK Annual General Meeting 2009
Vol : 26 Issue: 3
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Tundra Semiconductor selects Synopsys as its primary EDA partner Synopsys' differentiated offering of tools, IP and services cited as key to selection
Item No: Item Information
1801323 Tundra Semiconductor selects Synopsys as its primary EDA partner Synopsys' differentiated offering of tools, IP and services cited as key to selection
Vol : 26 Issue: 3
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Rutronik and ST consolidate successful partnership
Item No: Item Information
1801324 Rutronik and ST consolidate successful partnership
Vol : 26 Issue: 3
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NanoKTN Launches Directory of UK Micro and Nanotechnology (MNT) Academics and Industrialists
Item No: Item Information
1801325 NanoKTN Launches Directory of UK Micro and Nanotechnology (MNT) Academics and Industrialists
Vol : 26 Issue: 3
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Oxford RF Sensors (ORFS) has gained ISO 9001
Item No: Item Information
1801326 Oxford RF Sensors (ORFS) has gained ISO 9001
Vol : 26 Issue: 3
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Synopsys & Worlson join forces
Item No: Item Information
1801327 Synopsys & Worlson join forces
Vol : 26 Issue: 3
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DEK shows next-generation solar metallization solutions at Shanghai
Item No: Item Information
1801328 DEK shows next-generation solar metallization solutions at Shanghai
Vol : 26 Issue: 3
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International diary

International diary
Item No: Item Information
1801329 International diary
Vol : 26 Issue: 3
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Conferences and exhibitions

MicroTech-2009 overview
Item No: Item Information
1801330 MicroTech-2009 overview
Vol : 26 Issue: 3
Author(s): Nihal Sinnadurai
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Printed Electronics Europe 7 and 8 April 2009 Dresden Germany
Item No: Item Information
1801331 Printed Electronics Europe 7 and 8 April 2009 Dresden Germany
Vol : 26 Issue: 3
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Day 2
Item No: Item Information
1801332 Day 2
Vol : 26 Issue: 3
Author(s): John Ling
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New products

Pickering Interfaces introduces new 50-297 PCI Precision Resistor card
Item No: Item Information
1801333 Pickering Interfaces introduces new 50-297 PCI Precision Resistor card
Vol : 26 Issue: 3
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Moisture and electronics do not mix
Item No: Item Information
1801334 Moisture and electronics do not mix
Vol : 26 Issue: 3
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Half-size SBC packs a full size punch
Item No: Item Information
1801335 Half-size SBC packs a full size punch
Vol : 26 Issue: 3
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Cadence and NEC electronics announce encounter digital implementation system to support NEC Electronics' system LSI with built-in V850 CPU core
Item No: Item Information
1801336 Cadence and NEC electronics announce encounter digital implementation system to support NEC Electronics' system LSI with built-in V850 CPU core
Vol : 26 Issue: 3
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1U cPCI/VME64x 19 in low cost chassis
Item No: Item Information
1801337 1U cPCI/VME64x 19 in low cost chassis
Vol : 26 Issue: 3
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Fairchild Semiconductor announces the lowest RDS(ON) 20 V MicroFET™ MOSFET in the industry
Item No: Item Information
1801338 Fairchild Semiconductor announces the lowest RDS(ON) 20 V MicroFET™ MOSFET in the industry
Vol : 26 Issue: 3
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NXP demonstrates world's first functional Cortex™-M0 silicon
Item No: Item Information
1801339 NXP demonstrates world's first functional Cortex™-M0 silicon
Vol : 26 Issue: 3
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Alpha Micro Components adds u-blox' AMY-5M to its portfolio The distributor teams up with u-blox to resell the GPS industry's smallest standalone receiver
Item No: Item Information
1801340 Alpha Micro Components adds u-blox' AMY-5M to its portfolio The distributor teams up with u-blox to resell the GPS industry's smallest standalone receiver
Vol : 26 Issue: 3
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Fairchild Semiconductor's gate drivers enable improved fuel efficiency in automotive applications
Item No: Item Information
1801341 Fairchild Semiconductor's gate drivers enable improved fuel efficiency in automotive applications
Vol : 26 Issue: 3
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Book review

Nanopackaging: Nanotechnologies and Electronics Packaging
Item No: Item Information
1801342 Nanopackaging: Nanotechnologies and Electronics Packaging
Vol : 26 Issue: 3
Author(s): Martin Goosey
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