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Circuit World


Volume 35 Issue 3

Published: 2009 | Start Page: 3

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Articles

Articles
Article No: Article Information:
1805522 Halogen-free materials with improved thermal and electrical properties
David Bedner, Michael He (pp. 3-7)
Keywords: Dielectric properties, Dissipation factor, Halogens, Physical properties of materials, Printed circuits, Thermal properties of materials
ArticleType: Research paper
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1805523 EnFACE: a maskless process for circuit fabrication
Sudipta Roy (pp. 8-11)
Keywords: Copper, Electrodeposition, Printed circuit boards, Substrates
ArticleType: Research paper
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1805525 Microfluidic systems on a printed wiring board platform
Keryn Lian, Shawn O'Rourke, Daniel Sadler, Claudia Gamboa, Robert Terbrueggen, Marc Chason (pp. 12-20)
Keywords: Biotechnology, Printed circuit boards, Sensors
ArticleType: Research paper
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1805526 The processing time optimization of printed circuit board
Mircea Ancau (pp. 21-28)
Keywords: Monte Carlo methods, Printed circuit boards, Strategic manufacturing
ArticleType: Research paper
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1805527 Method and system of automated measurement of micro drill bit wear
Lianyu Fu, Jian Li, Fan Yang (pp. 29-34)
Keywords: Physical property measurement, Printed circuit boards
ArticleType: Technical paper
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1805528 Influences on the reflow soldering process by components with specific thermal properties
Florian Schüßler, Denis Kozic, Jörg Franke (pp. 35-42)
Keywords: Electrical components, Microvias, Soldering, Thermal efficiency, Thermal properties of materials
ArticleType: Research paper
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Industry news

ISO 9001:2000 success for GSPK Design
Item No: Item Information
1805529 ISO 9001:2000 success for GSPK Design
Vol : 35 Issue: 3
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Prism builds on long-standing contract to help develop low energy lighting
Item No: Item Information
1805530 Prism builds on long-standing contract to help develop low energy lighting
Vol : 35 Issue: 3
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European PCB industry
Item No: Item Information
1805531 European PCB industry
Vol : 35 Issue: 3
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New appointments

CC Electronics continues to grow with new appointment
Item No: Item Information
1805532 CC Electronics continues to grow with new appointment
Vol : 35 Issue: 3
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Exhibitions and conferences

SMT/HYBRID/PACKAGING, Nürnberg, Germany, 5-7 May 2009
Item No: Item Information
1805533 SMT/HYBRID/PACKAGING, Nürnberg, Germany, 5-7 May 2009
Vol : 35 Issue: 3
Author(s): John Ling
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SMART Group seminar on printed circuit materials and finishes
Item No: Item Information
1805534 SMART Group seminar on printed circuit materials and finishes
Vol : 35 Issue: 3
Author(s): Pete Starkey
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Printed Electronics Europe,7-8 April 2009,Dresden, Germany
Item No: Item Information
1805535 Printed Electronics Europe,7-8 April 2009,Dresden, Germany
Vol : 35 Issue: 3
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New products

Helmut Fischer Institute developed new X-ray technique for coating thickness analysis
Item No: Item Information
1805536 Helmut Fischer Institute developed new X-ray technique for coating thickness analysis
Vol : 35 Issue: 3
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Intertronics and Turbo-Coat – tack free in three minutes
Item No: Item Information
1805537 Intertronics and Turbo-Coat – tack free in three minutes
Vol : 35 Issue: 3
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Book review

Nanopackaging: Nanotechnologies and Electronics Packaging
Item No: Item Information
1805538 Nanopackaging: Nanotechnologies and Electronics Packaging
Vol : 35 Issue: 3
Author(s): Martin Goosey
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